JP3446879B2 - Substrate clamping method and clamping device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and the like, and more particularly to a substrate clamping device for clamping and fixing a substrate introduced for mounting electronic components at a predetermined position of a substrate introduction base.

[0002]

2. Description of the Related Art Conventionally, as a clamp device for a substrate of this type, the one disclosed in Japanese Patent Laid-Open No. 6-326497 has been known. This clamp device is provided with a fixed-side substrate introduction table and a movable-side substrate introduction table in which guide grooves for introducing the substrate are arranged so as to face each other inwardly, and a backup pin lifting device arranged between both substrate introduction tables. There is. The movable-side substrate introduction table is provided with a clamp member that presses the substrate introduced at a predetermined position in its width direction, and the clamp member is biased by a spring. Further, the backup pin lifting device is provided with a backup table, and a plurality of backup pins are detachably mounted on the upper surface of the backup table. Both sides of the board are guided by the guide grooves of both board introduction bases and are introduced into predetermined positions of both board introduction bases. In this state, the movable side substrate introduction base slightly moves toward the fixed side substrate introduction base. It moves and clamps the substrate between the two guide grooves via the clamp member. Next, the backup pin lifting device raises the backup pin and presses the substrate against the upper surface of the guide groove to position the substrate immovably.

[0003]

In such a conventional board clamping device, the board is pressed against the upper surface of the guide groove while the board is sandwiched by the guide groove in the width direction. The end surface of the substrate rubs against the side surface of the guide groove corresponding to the groove bottom of the guide groove. Therefore, there is a problem that the side surface of the guide groove is worn and the end surface of the substrate is chipped. If the side surface of the guide groove wears, accurate positioning of the board becomes impossible,
Further, if a chip is formed on the end surface of the board, the chip is attached to the land of the board, resulting in poor mounting of electronic components.

The present invention provides a substrate clamping method and a clamping device capable of accurately clamping a substrate and preventing wear of a guide groove and chipping of the substrate, and also depending on the type and positioning of the substrate. It is an object of the invention to provide a clamping device with a selectable method.

[0005]

According to the method of clamping a substrate of the present invention, both ends are guided by "U" -shaped guide grooves, and the substrate introduced at a predetermined position is pressed against the upper surface of the guide groove. Up and down, the backup member is raised and the substrate is pushed up step by step, and the clamp member is repeatedly advanced and retracted in the width direction of the substrate for each stepwise pushing operation, and the substrate is repeatedly placed in one guide groove. The present invention is characterized by including a substrate moving step of pressing and a left and right clamping step of advancing the clamp member in the width direction of the substrate and finally pressing the substrate against the side surface of one of the guide grooves.

Similarly, the substrate clamping device of the present invention is
A pair of board introduction bases that have "U" -shaped guide grooves for guiding the side edges of the boards, and guide the guide grooves into the board at predetermined positions, and a guide groove for one board introduction base. Toward the front, a clamp member that presses the substrate introduced at a predetermined position in the width direction thereof, an advancing / retracting unit that moves the clamp member forward and backward in the width direction of the substrate, and a backup that presses the substrate introduced at the predetermined position from the lower side. In a substrate clamping device including a member, an elevating unit that elevates and lowers a backup member, and a control unit that controls the operation of the advancing and retracting unit and the elevating unit, the control unit controls the substrate until the substrate is pressed against the upper surface of the guide groove. The feature is that the backup member is raised in stages, and the clamp member is advanced and retracted with each stepwise movement of the backup member to finally press the substrate against the side surface of the guide groove. To.

According to this structure, the backup member is raised stepwise, and the clamp member is moved forward and backward in each process in the process of gradually approaching the substrate to the upper surface of the guide groove, thereby moving the substrate to the guide groove. Since the substrate is pressed (closed), as the substrate approaches the upper surface of the guide groove, the end face of the substrate conforms to the side surface of the guide groove, and finally the substrate moves to the upper surface of the guide groove by the backup member. In the state of being pressed and being pressed against the side surface of the guide groove by the clamp member, the end surface of the substrate is in close contact with the side surface of the guide groove without any gap, and the positioning is accurately performed. The "clamping member" referred to here may be one that has a drive unit itself to clamp the substrate, or one that clamps the substrate by using the movement of one substrate introduction table. May be. Further, the "backup member" may be a so-called backup pin or may be a dedicated member for vertically clamping the substrate.

Another board clamping device of the present invention has a pair of "U" -shaped guide grooves for guiding the side edges of the board, and guides the guide grooves into the board at a predetermined position. Of the substrate introduction table, toward the guide groove of one of the substrate introduction table, a clamp member for pressing the substrate introduced at a predetermined position in the width direction, advance and retreat means for moving the clamp member forward and backward in the width direction of the substrate, A board clamping device comprising a backup member for pressing a substrate introduced into a predetermined position from below, an elevating means for elevating the backup member, and a control means for controlling the operation of the advancing and retracting means and the elevating means. Is a clamp operation instructing means capable of instructing three or more kinds of clamping operations by the advancing and retracting means and the elevating means, and any one clamp of three or more kinds of clamping operations of the clamp operation instructing means. And a clamp operation selecting means capable of selecting the operation, and the clamp operation instructing means at least raises the backup member before the substrate is pressed against the upper surface of the guide groove and then advances the clamp member to guide the substrate. It is pressed against the side surface of the groove and then the backup member is raised to press the substrate against the upper surface of the guide groove.
Clamping operation mode, second clamping operation mode in which the backup member is raised and the substrate is pressed against the upper surface of the guide groove without advancing the clamping member, and the side edge of the substrate is pressed against the upper surface of the guide groove. And a third clamp operation mode in which the backup member is raised stepwise and the clamp member is moved back and forth for each stepwise raising operation of the backup member to finally press the substrate against the side surface of the guide groove. Characterize.

According to this configuration, in a standard substrate such as a resin substrate, the substrate is clamped in the first clamp operation mode and the substrate is positioned by the positioning mark on the substrate. The substrate is clamped in the second clamp operation mode, and the substrate is easily clamped in the third clamp operation mode when the guide groove such as the ceramic substrate is easily worn.
Thereby, the clamping method can be selected according to the material of the substrate and the positioning method, and the positioning accuracy can be prioritized and the time required for clamping can be shortened depending on the substrate.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION A case in which a substrate clamping method and a clamping device according to an embodiment of the present invention are applied to a substrate supply section of an electronic component mounting apparatus (mounter) will be described below with reference to the accompanying drawings. To do. This electronic component mounting device is a so-called multi-functional chip mounter, and can mount various electronic components such as surface mount components such as chip capacitors and chip resistors and multi-lead components such as flat pack ICs on various substrates. It is configured. FIG. 1 is a plan view of the electronic component mounting apparatus. As shown in FIG.
The electronic component mounting apparatus 1 includes a machine base 2, a board supply unit 3 extending in the left-right direction in a central portion of the machine base 2, and a first component arranged in a front portion (lower side in the drawing) of the machine base 2. Supply unit 4a, second component supply unit 4b arranged at the rear part (upper side in the drawing) of machine base 2, and first XY stage 5a arranged movably at the front part of machine base 2.
And a second XY stage 5b movably arranged at the rear of the machine base 2.

The first XY stage 5a has a first head unit 6a for picking up and mounting electronic components, and similarly, the second XY stage 5b has a second head unit 6a.
b are installed respectively. Each head unit 6a,
In 6b, two mounting heads 8 and 8 mounted with the suction nozzle 7 are mounted, and a board recognition camera 9 is mounted between the two mounting heads 8 and 8. Also, machine stand 2
Above the substrate supply unit 3, a pair of two component recognition cameras 10, 10, 10, 10 and two nozzle stockers 11, 11 are arranged, respectively. In this case, the both component recognition cameras 10 and 10 and the nozzle stocker 11 located at the front correspond to the first head unit 6a, and the both component recognition cameras 10 and 10 and the nozzle stocker 11 located at the rear are located at the second head unit 6b. It corresponds to.

In this electronic component mounting apparatus 1, small electronic components such as surface mount components are supplied from the first component supply unit 4a and the second component supply unit 4b, and large electronic components such as multi-lead components are not shown in the tray. It is supplied from the model parts supply section. Further, the substrate is supplied from the left side by the substrate supply unit 3, is immovably set in the center of the machine base 2, and is discharged to the right side. For example, in mounting an electronic component using the first XY stage 5a, the first XY stage 5a allows
The head unit 6a is made to face the first component supply unit (other component supply unit is also possible) 4a to adsorb a desired electronic component, and then this electronic component is made to face the component recognition camera 10 for position recognition, and After the first head unit 6a is moved to a predetermined position on the board and the board recognition camera 9 recognizes the board position, electronic components are mounted on the board. Note that normally, the first XY
The stage 5a and the second XY stage 5b are alternately operated.

The first component supply section 4a and the second component supply section 4b each have a large number of tape cassettes 12 arranged side by side. Electronic components are accommodated in each tape cassette 12 while being loaded in a carrier tape (not shown), and the electronic components are supplied one by one from the tip of the tape cassette 12. In the normal operation, when the first head unit 6a is in the mounting operation, the tape cassette 12 is replaced by the second component supply unit 4b.
When the second head unit 6b is in the mounting operation,
The tape cassette 12 is replaced at the first component supply unit 4a.

The first XY stage 5a and the second XY stage 5b are guided by a pair of Y-axis guide rails 14, 14 arranged at both left and right ends of the machine base 2 and moved in the front-rear direction (Y-axis direction). It has moving beams 15 and 15, respectively. The Y motion beam 15 of the first XY stage 5a is
The ball screw on the left side and a Y-axis motor (not shown) for rotating the ball screw move forward and backward in the Y-axis direction (front-back direction). Similarly, the Y motion beam 15 of the second XY stage 5b moves back and forth in the Y-axis direction by the ball screw on the right and a Y-axis motor (not shown) that rotates the ball screw.

On the other hand, both Y moving beams 15 and 15 are exactly the same, each having an X-axis guide rail 16,
Similar to the drive system described above, the head units 6a and 6b are moved back and forth in the X-axis direction (left-right direction) with a ball screw and an X-axis motor (both not shown). In this way, each head unit 6a, 6b is movable in the X-axis direction and the Y-axis direction, that is, in the horizontal plane. Although not shown, each head unit 6a,
The 6b has a built-in mechanism that raises and lowers each mounting head 8 (Z-axis direction) and rotates (θ direction).

The substrate supply section 3 has a clamp device 21 arranged in the center, a substrate loading mechanism 22 connected to the left side of the clamp device 21 in the drawing, and a substrate unloading mechanism 23 connected to the right side of the clamp device 5 in the drawing. There is. The substrate is supplied from the substrate loading mechanism 22 to the clamp device 21, and the clamp device 2
In step 1, the electronic components are set immovably and at a predetermined height so as to be mounted. The board on which the electronic components have been mounted is ejected from the clamp device 21 via the board unloading mechanism 23. In this case, the substrate carry-in mechanism 22 has a substrate in the supply standby state, and the substrate carry-out mechanism 23 has a substrate in the discharge standby state (not shown), and these substrates are transported in a sequential manner.

The clamp device 21 will now be described in more detail with reference to FIGS. In the following description of the clamp device 21, the substrate conveyance direction (longitudinal direction) is referred to as the front-rear direction (the left and right sides of the electronic component mounting apparatus 1 as a whole), and the board width direction is left and right (the front and rear sides of the electronic component mounting apparatus 1 as a whole). ) And proceed with the explanation.

The clamp device 21 includes a fixed-side substrate introduction table 31a and a movable-side substrate introduction table 31b for supporting the left and right ends of the substrate S, and a movable-side substrate introduction table 31b according to the width of the substrate S to be introduced. An introduction table moving device (see FIG. 10) 32 for advancing and retreating in the left and right direction and a board S are received from the board carry-in mechanism 22 and conveyed to predetermined clamp positions of both board introduction boards 31a and 31b, and mounting of electronic components is completed. The substrate unloading mechanism 23 for removing the substrate S from the clamp position
And a conveyor type substrate transfer device 33 for transporting the substrate.

Further, the clamp device 21 includes a plurality of backup pins 34 facing the substrate S set at the clamp position from below and supporting the substrate S, and a backup table 35 on which the plurality of backup pins 34 are erected. , Backup pin 34 via backup table 35
And a backup pin elevating device 36 for elevating and lowering.

Further, the clamp device 21 is provided with a control device 37 for controlling the introduction table moving device 32, the substrate transfer device 33, the backup pin lifting device 36, etc. (see FIG. 10). The fixed-side substrate introduction table 31a and the movable-side substrate introduction table 31b are arranged so as to face each other,
Further, the backup table 35 and the backup pin elevating device 36 are arranged below the both board introducing bases 31a and 31b.

As shown in FIG. 2, the fixed-side substrate introduction table 31
a is an introduction table body 41 in which a number of conveyor rollers 33a of the substrate transfer device 33 are attached, an intermediate plate 42 for guiding the side end surface of the substrate S inside, and an intermediate plate 4
2 and the top plate 43 provided on the upper side,
A guide groove 44 having a U-shaped cross section for guiding the side end portion of the substrate S is formed in the inner portion of the conveyor roller 33 a, the intermediate plate 42 and the top plate 43.

Similarly, the movable-side substrate introduction table 31b has an introduction table body 41 inside which a number of conveyor rollers 33a of the substrate transfer device 33 are attached, an intermediate plate 42 for guiding the side end surface of the substrate S inside, And a top plate 43 provided on the upper side of the intermediate plate 42. The conveyor roller 33a, the intermediate plate 42, and the inner portion of the top plate 43 are provided with a cross section of "U" shape for guiding the side end portion of the substrate S. Guide grooves 44 are formed.

Further, the intermediate plate 42 is arranged discontinuously in the longitudinal direction, and the discontinuous portion is a plurality of horizontal through holes 45. Then, in the horizontal through hole 45,
The air cylinders 46 face each other, and the substrate S can be pressed against the fixed-side substrate introduction table 31a over a plurality of positions.

The substrate S is guided to both guide grooves 44, 44 by the left and right conveyor belts (not shown) which are stretched around the conveyor roller 33a, and is introduced to the clamp position of the clamp device 21. The board S introduced into the clamp position has a predetermined clearance between the upper surface of both guide grooves 44, 44 (inner lower surface of each top plate 43) at both side end portions thereof, and both guide grooves 44, A predetermined clearance is also provided between the side surface of 44 (the inner end surface of each intermediate plate 42).

Therefore, in order to position (clamp) the substrate S immovably, in the left-right direction, the piston rod 46a of the air cylinder 46 is advanced to press the substrate S, and the guide groove ( Side) 44
Press against.

Further, in the vertical direction, the backup pin elevating device 36 raises the backup pin 34 and the later-described clamp plate 73, and pushes up the substrate S to guide the guide grooves (upper surface) of both substrate introducing bases 31a and 31b. Press on 44. Reference numeral 47 in the drawing is a connecting bar that engages the movable-side substrate introduction table 31b with the movable table 75 of the backup table 35 described later.

Although the details will be described later, the piston rod 46a of the air cylinder 46 and the clamp plate 7 are
There are three types of clamping methods for the substrate S by 3 and 3 according to the respective operation amounts and operation timings, and these three types of clamping methods can be selected by the mode switching of the control device 37. You can choose the method.

As shown in FIGS. 2 to 4, the backup table 35 has the above-mentioned both board introduction bases 31a and 31b.
And a table base 71 supported by the four shafts 51, 51, 51, 51, each of which has a substantially rectangular shape in plan view, corresponding to the length of the substrate and the maximum distance between the two board introduction bases 31a, 31b. The table base 71 has a tweezers plate 72 for standing up the backup pins 34 placed on the upper side, and a plurality of clamp plates 73 arranged at both ends of the table base 71 in the width direction.

A plurality of clamp plates 73 arranged on the fixed substrate introduction table 31a side are mounted side by side on a fixed table 74, and the fixed table 74 is fixed to one end of the table base 71 in the left-right direction. ing. In addition, a plurality of clamp plates 7 arranged on the movable substrate introduction table 31b side.
3 is mounted side by side on a movable base 75, and the movable base 75 is slidably mounted on a pair of rails 76, 76 arranged at both ends of the table base 71 in the front-rear direction (see FIG. 4). ).

The front and rear end portions of the movable table 75 have a pair of front and rear connecting bars 4 extending downward from the movable substrate introduction table 31b.
The movable table 75 is engaged with the rails 7 and 47, and moves on the rail 76 in accordance with the width of the substrate S together with the movable substrate introduction table 31b which is moved forward and backward by the introduction table moving device 32.

Further, in order to allow the movable table 75 to move in the vertical direction with respect to the movable substrate introduction table 31b, the connecting bar 47 is sandwiched by the pair of rollers 77, 77 provided on the movable table 75 in the left-right direction. The movable table 75 is the connecting bar 47.
Is engaged with. As a result, the clamp plate 73 attached to the movable table 75 and the clamp plate 73 attached to the fixed table 74 come into contact with the side end portions of the substrate S as the table base 71 rises, and both of them are introduced into the substrate introduction tables 31a, 31b. It is sandwiched between and in the vertical direction.

Further, each clamp plate 73 is urged upward by a spring (not shown), and is fixed to the fixing base 7.
4 or movable table 75 through long holes, the substrate S is pushed up from the lower side in preference to the backup pin 34, and the spring force is used to press the substrate S against the substrate introduction tables 31a and 31b. To do.

The rising end position of the backup table 35 is a position where the tip (upper end) of the backup pin 34 faces the lower surface of the substrate S with a minute gap.
In this state, the clamp plate 73 presses the respective side end portions of the substrate S from the lower side to the respective substrate introduction bases 31a and 31b.

On the other hand, the tweezers plate 72 is shown in FIG.
As shown in FIG. 5, a large number of set holes 78 for standing up the plurality of backup pins 34 are formed. The large number of setting holes 78 are distributed over the entire area of the tweezers plate 72, but in order to accommodate substrates S having different widths and narrow widths, the fixed substrate introducing base 31a side has a fine pitch and the movable substrate introducing base 31b has a rough pitch. It is arranged.

Further, the setting holes 78 on the fixed substrate introduction table 31a side have a fine pitch in the front part and the rear part in consideration of the presence of the substrate S for positioning the front end and the substrate S for positioning the rear end in the carrying direction. Has a large area.

In this case, the total number of the plurality of set holes 78 is several hundred units, the total number of the plurality of backup pins 34 is several tens of units, and the plurality of backup pins 34 correspond to the substrate S.
If there is a preliminarily attached component on the back surface of the substrate S, it is set (mounted) so as to be inserted into the set hole 78 as appropriate.

The mounting of the plurality of backup pins 34 on the various substrates S may be performed manually or automatically. Incidentally, reference numeral 79 in FIG.
Denoted at 79 are stoppers for respectively positioning the front and rear positions of the substrate, and any one of the stoppers 79 is used depending on the substrate.

Each of the backup pins 34 has a pin body 81 whose upper and lower ends are tapered, an upper flange portion 82 formed on the upper portion of the pin body 81, and a pin body 8.
1 and a lower flange portion 83 formed in the lower portion of The lower flange portion 83 regulates the insertion depth of the backup pin 34 that is inserted into the setting hole 78, and in the completely set state where the lower flange portion 83 abuts the upper surface of the tweezers plate 72, a plurality of backup pins 34 are provided. Are all set to the same height.

The upper flange portion 82, as shown in FIG.
When the backup pin 34 is automatically mounted, the insertion depth into the set nozzle (suction nozzle) 17 is regulated, and the air leakage of the set nozzle 17 is suppressed. The automatic mounting of the backup pin 34 is performed by the mounting head 8 described above.
Is preferably used.

In such a case, the NC data for each board is
The mounting pattern data of a plurality of corresponding backup pins 34 is added and stored in an NC data area 121 (see FIG. 10) described later, and the holding mechanism 18 of the mounting head 8 has a set nozzle for replacing the backup pins ( (Prepared for the nozzle stocker) 17 is gripped, each backup pin 34 is adsorbed to this set nozzle 17, and a plurality of backup pins 34 are mounted based on the above mounting pattern data.

As shown in FIGS. 2 to 4, the backup pin lifting device 36 includes four shafts 51, 51, 51, 51 for supporting the backup table 35 and four shafts 51, 51, 51, 51. It has a support frame 52 that supports and is mounted and fixed on the machine base 2, and a lifting motor 53 that simultaneously lifts and lowers the four shafts 51, 51, 51, 51.

Each shaft 51 is composed of a ball screw spline shaft and is guided to move up and down by a guide block 54 provided on the support frame 52 side.
The rotation block 55 moves up and down by forward and reverse rotations.

A drive pulley 56 is attached to the main shaft of the lifting motor 53.
Is fixed, and a driven pulley 57 is fixed to the upper end of each rotation block 55 while being coaxially arranged with each shaft 51. An intermediate pulley 58 is rotatably supported on the upper surface of the support frame 52, and these drive pulleys 5 are
6, a belt (for example, a timing belt) 59 is stretched around the driven pulley 57 and the intermediate pulley 58.

Each rotation block 55 is rotatably supported by the support frame 52 via a bearing 60, and when the lift motor 53 rotates forward and backward, the rotation block 55 rotates forward and backward via the driven pulleys 57. And 4 shafts 5
1, 51, 51, 51 move up and down at the same time. Then, as the four shafts 51, 51, 51, 51 move up and down at the same time, the backup table 35 having the backup pins 34 standing up and down moves up and down.

At that time, the vertical position (level) of the backup table 35 is detected by the optical sensor 61. The optical sensor 61 has a sensor main body 62 attached to the support frame 52 and a light shielding plate 63 vertically provided on the lower surface of the backup table 35, and the sensor main body 62 is connected to the control device 37 (see FIG. 10). .

In this case, the optical sensor 61 detects the lower end position of the backup table 35, the standby position for clamping, the middle position of the clamp and the upper end position (clamp position), and based on the detection results, the control device. Three
Reference numeral 7 appropriately stops or controls rotation of the lifting motor 53.

For example, between the lower end position and the standby position, the backup table 35 is raised and lowered at a high speed, and between the standby position, the middle clamping position and the raised end position, the backup table 35 is raised and lowered at a low speed. . 6 will be described as an example, the lower end position is shown in FIG. 6A, and the middle clamp position is shown in FIG.
In (c), the ascending end position corresponds to (d) in the figure, and the standby position is omitted.

Next, FIG. 10 shows a block diagram of a schematic configuration of a control system of the clamp device 21. As shown in FIG. 1, the control device 37 includes a control unit main body 100, a touch panel (touch screen) 110, an external storage device such as a hard disk or a magneto-optical disk (hereinafter, “hard disk”).
Typified by 120). In addition, a printing device (represented by “printer” in the figure) 130 such as a printer or a plotter for printing the display on the touch panel 110 or various data may be provided.

The touch panel 110 also has the functions of a display 111 such as a cathode ray tube and a liquid crystal display, a keyboard 112, and a pointing device (hereinafter represented by a "mouse") 113 such as a mouse, a digitizer, and a tablet so as to interface with a user. It has a so-called touch screen that allows all input / display, etc., with only a touch of a finger for workability in the field.

Note that, depending on the facilities and operability, the operation unit of the control device 37 may be replaced by the display 111, the keyboard 112, the mouse 1 instead of the touch panel 110.
It goes without saying that it may be composed of 13 or the like. Also,
The touch panel 110 may also be used as the operation panel of the electronic component mounting apparatus 1. Of course, the control device 37 can also be configured by using part or all of the control unit of the entire electronic component mounting device 1.

The hard disk 120 is an N disk containing clamp control data and mounting pattern data for the processing described later.
In addition to the NC data area 121 that stores C data and the like, various programs for causing the illustrated system to function as the control device 37, operating system (OS) programs for operating them, various font files, and the like are stored. It has the other area 122.

The control unit main body 100 includes a CPU 101, an RO
M102, RAM103, I / O controller (IO
C) 104, hard disk drive (HDD) 105
And are connected to each other by the internal bus 106.

The ROM 102 stands up as a device (system) for loading various control programs including a screen display process, a clamp control process described later, a backup pin recognition process, an OS and other programs from the hard disk 120 and supplying them to the CPU 20. Built-in programs for raising. Further, the RAM 103 is used as an internal storage unit of the control unit main body 2 in various work areas, buffers and the like.

If the various programs and data in the hard disk 120 can all be stored in the ROM 21 and the RAM 103, the HDD 105 and the hard disk 120 may be omitted. In addition, the RAM10
A battery or the like for data backup may be provided so that the data in 3 is stored even when the power is turned off.

The IOC 104 is the moving-side board introduction table 3 described above.
1b forward / backward moving device 32, a conveyor type substrate transfer device 33 that conveys the substrate S, a backup lifting device 36 that controls the lifting and lowering of a backup table 35 on which backup pins 34 are mounted and clamp pins 73 are arranged, The piston rod 46a is advanced to press the substrate S to guide the guide groove (side surface) 44 of the fixed-side substrate introduction table 31a.
And an air cylinder 46 that performs an operation of pressing the substrate (hereinafter, simply referred to as “width adjustment of the substrate S”), and peripheral devices such as a board recognition camera 9 mounted on the head units 6a and 6b and used for backup pin recognition processing described later. Connected with.

The IOC 104 is connected to the CPU by this connection.
According to commands from 101, input / output of various control signals and various data between these peripheral devices and the control unit main body 100 is controlled.

The HDD 105 controls and drives the hard disk 120 in accordance with commands from the CPU 101 to control input / output of various control signals and various data between the hard disk 120 and the control unit main body 100.

The CPU 101 has the RO
According to the built-in program of the M102 and the control program supplied from the hard disk 120, the RA
Various processing of data is performed using the work area of M103, the save area of the hard disk 120, etc.
4 and the HDD 105 to control the entire clamp device 21.

By the way, as described above, as the method of clamping the substrate S by the piston rod 46a of the air cylinder 46 and the clamp plate 73, three kinds of methods are prepared depending on the respective operation amounts and operation timings.
Of these three types of clamping methods, any one of the clamping methods can be selected by switching the mode of the control device 37. Therefore, the clamp control process and the clamp operation by the clamp control process will be described below.

In the initial state, on the display screen of the touch panel 110, an operation data edit screen for editing (or inputting) operation data (operation data) including NC data and instructing clamp operation and other operations is displayed. Since it is displayed, first, instruct the clamp operation mode selection (touch menu (panel key) to instruct the selection of the clamp operation mode displayed on the display screen.
Touch) to display the clamp operation mode selection screen (transition from the operation data edit screen to the clamp operation mode selection screen).

In this clamp operation mode selection screen, a panel key for instructing any one of modes 1 to 5 corresponding to the first to fifth clamp operation modes as the clamp operation mode is displayed on the display screen. Since any one of them is instructed (touching the corresponding panel key), the clamp operation mode is selected and set, and then the operation data edit screen is displayed again (clamp operation mode selection screen From the operation data edit screen and return).

In this state, when the clamp operation is instructed (touching the panel key for instructing the clamp operation), the clamp control processing program corresponding to the selected clamp operation mode is activated and the clamp operation is started. It Since Modes 1 to 3 among the above Modes 1 to 5 are related to the present invention, Modes 1 to 1 will be described below.
Only 3 will be described.

Mode 1 (first clamp operation mode)
Corresponds to a conventional operation mode, and is for clamping a general substrate S such as a resin substrate. As shown in FIG. 6, after the substrate S is brought close to the upper surface of the guide groove 44 ( (A) and (b) of the same figure are pressed against the side surface of the guide groove 44 ((c) of the same figure), and then are pressed against the upper surface of the guide groove 44 completely ((d) of the same figure). ).

Therefore, when the mode 1 is selected and the clamp operation is started, the control device 37, as shown in FIG. 11A, according to the above-mentioned clamp control data.
For the lifting motor 53 of the backup lifting device 36,
A backup rising pulse signal (hereinafter referred to as “backup pulse”) BP for instructing the rising of the backup table 35 (that is, the clamp plate 73) is output, and its rising position is monitored by the detection signal from the optical sensor 61 (see FIG. 10). , Its backup pulse BP
At the same time, a cylinder pressing width-shifting pulse signal (hereinafter referred to as “width-shifting cylinder pulse”) CP for instructing the widthwise shifting of the substrate S is output to the air cylinder 46 (see FIG. 10).

In this case, first, as shown in FIG. 11A, at time t1, the lifting motor 53 is driven (for example, FIG. 6A, timing t in FIG. 11A).
1: Hereinafter, the timing tx is simply represented by tx and illustrated. In this case, at t1, FIG. 6A, the substrate S is brought closer to the upper surface of the guide groove 44 by the clamp plate 73 (t2, FIG. 6B), and then pressed against the side surface of the guide groove 44 by the piston rod 46a. (T3 to t4, FIG.
(C)) While maintaining this state, the clamp plate 73 is operated so as to be pressed completely against the upper surface of the guide groove 44 (t4 to t5, FIG. 6D).

As described above, in the clamp device 21, the mode 1 (first clamp operation mode) corresponding to the conventional operation mode can be selected, and the substrate S can be clamped thereby, so that the conventional function is completely achieved. Can be covered. In the clamp device 21 of the present embodiment, the standard substrate S such as a resin substrate is used as a target for the mode 1 (first
Clamp according to the clamp operation mode.

Next, in the mode 2 (second clamp operation mode), the substrate S positioned by the marks on the substrate S is positioned.
Is for clamping, as shown in FIG.
The operation is performed so that the substrate S is simply pressed against the upper surface of the guide groove 44.

Therefore, when the mode 2 is selected and the clamp operation is started, the control device 37, as shown in FIG. 11B, according to the above-mentioned clamp control data.
A backup pulse BP is output to the lifting motor 53, and its rising position is monitored by a detection signal from the optical sensor 61 (see FIG. 10).
P is not output.

In this case, as shown in FIG. 11B, the elevating motor 53 is driven (t6, for example, FIG. 7A),
The clamp plate 73 simply guides the substrate S to the guide groove 4
4 to be pressed against the upper surface (t7, FIG.
(B)).

That is, in the substrate S which is positioned by the mark on the substrate S, the width adjustment is not particularly required. Therefore, the clamp device 21 can select the mode 2 (second clamp operation mode), and thus the clamp can be performed. Control can be omitted, and the time required for its processing and operation can be shortened.

Next, in mode 3 (third clamp operation mode), a ceramic substrate that is hard and easily chipped, or a substrate S that requires high-accuracy positioning (positioning of end faces) is used.
Is for clamping, as shown in FIG.
After the substrate S is brought close to the upper surface of the guide groove 44 ((a) and (b) in the same figure), it is moved toward and away from the side surface of the guide groove (advance and retreat) ((c) in the same figure), and once Is released ((d) in the same figure), and then is completely pressed against the upper surface of the guide groove 44 ((e) in the same figure), and is again operated so as to be completely pressed against the side surface of the guide groove 44. This is the case ((f) in the figure).

Therefore, when the mode 3 is selected and the clamp operation is started, the control device 37, as shown in FIG. 11C, according to the above-mentioned clamp control data.
A backup pulse BP is output to the lifting motor 53, and its rising position is monitored by a detection signal from the optical sensor 61 (see FIG. 10), and the air cylinder 4 is timed with the backup pulse BP.
6, the width-shifting cylinder pulse CP is output (see FIG. 10).

In this case, as shown in FIG. 11C, the elevating motor 53 is driven (t8, for example, FIG. 8A),
After the substrate S is brought close to the upper surface of the guide groove 44 by the clamp plate 73 (t9, FIG. 8B), the substrate S is brought closer to the side surface of the guide groove 44 by the piston rod 46a (t10, FIG. 8C). )), It is once released (t11, same figure (d)), and then it is completely pressed against the upper surface of the guide groove 44 by the clamp plate 73 (t).
12-t13, (e) in the same figure, again, the piston rod 4
Further, it is operated so as to be completely pressed against the side surface of the guide groove 44 by 6a (t14 to t15, FIG.

In the above example, the clamping operation in mode 3 is divided into two stages (t8 to t11 and t12 to t15), but it may be divided into three or more stages.

As described above, in the clamp device 21, the mode 3 (third clamp operation mode) can be selected. In the mode 3, the clamp plate (backup member) 73 is raised step by step to raise the substrate S. Guide groove 4
In the process of gradually approaching the upper surface of 4, the piston rod (clamp member) 46a is moved back and forth each time,
The substrate S is pressed (applied) to the guide groove 44.

Therefore, in the clamping operation in the mode 3, as the substrate S approaches the upper surface of the guide groove 44,
The end surface of the substrate S conforms to the side surface of the guide groove 44, and finally the substrate S is pressed against the upper surface of the guide groove 44 by the clamp plate (backup member) 73 and guided by the piston rod (clamp member) 46a. In the state of being pressed against the side surface of the groove 44, the end surface of the substrate S closely contacts the side surface of the guide groove 44 without a gap and is positioned with high accuracy.

That is, in the conventional clamp, the end surface of the substrate is rubbed against the side surface of the guide groove corresponding to the groove bottom of the guide groove, the side surface of the guide groove is worn and the end surface of the substrate is chipped, and the accuracy of the substrate is improved. However, there is a problem that the chipping of the end face of the substrate adheres to the land and the electronic component is not properly mounted. However, the clamp of the mode 3 described above causes the substrate S to rise step by step. In order to carry out
The occurrence of such a problem can be prevented, and the positioning can be performed accurately.

Therefore, the clamp device 21 of the present embodiment.
Then, the mode 3 (third clamp operation mode) is applied to the substrate S such as a ceramic substrate that easily wears or easily breaks the guide groove 44 or the substrate S that requires high-precision positioning (positioning of the end face). Perform the clamp.

As described above, in this clamp device 21, any one of modes 1 to 3 (first to third clamp operation modes) can be selected and designated, so that a standard substrate such as a resin substrate can be selected. Then, in the case where the substrate S is clamped by the mode 1 (first clamp operation mode) and the substrate S is positioned by the positioning mark on the substrate S, the mode 2 (second clamp operation mode) is used. When the substrate S is clamped and the guide groove such as the ceramic substrate is easily worn, the substrate S is clamped in the mode 3 (third clamp operation mode).

That is, in this clamp device 21, a clamping method can be selected according to the material of the substrate S and the positioning method, and depending on the substrate S, the positioning accuracy can be prioritized and the time required for clamping can be shortened. can do.

In this embodiment, the piston rod 46a of the air cylinder 46 is used as the clamp member. That is, the device itself has a driving part and clamps the substrate S.
Alternatively, the substrate S may be clamped by using the movement of one of the substrate introduction tables (for example, the movable side substrate introduction table 31b).

In this embodiment, the clamp plate 73 arranged on the backup table 35 is used as the backup member. That is, although a member dedicated to vertically clamping the substrate S is used, a so-called backup pin (for example, backup pin 34) may be used as the “backup member” here.

By the way, the clamp device 21 of the electronic component mounting apparatus 1 of the present embodiment also serves as the above-mentioned control device 37, and regardless of the manual mounting or the automatic mounting of the backup pin 34, the plurality of backups described above are used. A function as a backup pin recognition device 38 for recognizing whether or not the pin 34 is correctly mounted on the corresponding substrate S is incorporated.

Therefore, with this clamp device 21 (backup pin recognition device 38), in manual mounting,
The erroneous mounting of the backup pin 34 can be recognized mainly, and the mounting error such as the fall of the backup pin 34 can be recognized mainly in the automatic mounting. Therefore, the backup pin recognition process and the configuration therefor will be described below.

As described above with reference to FIG. 10, the hard disk 1
20 stores the mounting pattern data in an NC data area (pin position storage unit) 121. In this case, as the mounting pattern data, position (mounting pattern) data of a plurality of backup pins 34 and movement path data for recognizing the backup pins are stored. Further, the mounting pattern data is provided in addition to the NC data for each board S.

Further, in order to recognize the backup pin 34 by imaging the tip (upper end) of the backup pin 34 which is erected (mounted) on the backup table 35, the board recognition camera mounted on the head units 6a and 6b described above. 9 are connected (see FIGS. 1, 2, 3, 5, and 10).

Therefore, in the clamp device 21, when the backup pin recognition process is activated, the board recognition camera 9 is moved in accordance with the movement path indicated by the arrow in FIG. 5 indicated by the movement path data stored as NC data.

In this case, the board recognition camera 9 stops at the position of each set hole 78 in the figure to recognize the position of the backup pin 34 (resultantly the presence or absence thereof), and reports the recognition result to the control device 37. (Output. The control device 37 stores the recognition result in the NC data area 121 in association with the mounting pattern data as pattern data (recognition pattern data) to be compared (matched) with the above-described mounting pattern data.

When the recognition by the board recognition camera 9 is completed, the control device 37 (by the CPU 101 (pin comparison unit)) compares the mounting pattern data with the recognition pattern data, and the patterns (pin positions) match each other. When it is determined that there is no such information, the fact is displayed (notified) on the display screen of the touch panel (notification unit) 110.

As a result, the user can recognize erroneous mounting of the backup pin 34 mainly in the manual mounting, and can mainly recognize the backup pin 3 in the automatic mounting.
You can recognize mounting mistakes such as the fall of 4.

A beep function such as a buzzer or an alarm is provided as a user interface, and the beep sound or the display on the touch panel 110 notifies the user that the pattern (pin position) does not match. Is also good. Further, a recognition mark is preferably attached to the tip of the backup pin 34 in order to ensure image pickup (recognition) by the board recognition camera 9.

[0092]

As described above, according to the method and apparatus for clamping a substrate of the present invention, the clamping operation in the width direction of the substrate and the clamping operation in the vertical direction are performed stepwise and alternately. Therefore, the final clamping can be performed while the substrate is sufficiently fit in the guide groove. Therefore, the substrate can be accurately clamped in the width direction and the height direction. Further, since the movement of the substrate can be made extremely small in the final clamping operation, wear of the guide groove and chipping of the substrate can be minimized, and the reliability of the device can be improved.

Further, according to the other substrate clamping apparatus of the present invention, the clamping method can be selected according to the material of the substrate and the positioning method. Therefore, depending on the substrate, the positioning accuracy is prioritized or the clamping is performed. The time required can be shortened, and an appropriate clamp form can be taken for each type of substrate.

[Brief description of drawings]

FIG. 1 is a plan view of an electronic component mounting device to which a clamping method and a clamping device according to an embodiment of the present invention are applied.

FIG. 2 is a side view of the clamp device according to the embodiment.

FIG. 3 is a front view of a clamp device according to an embodiment showing a state of a backup pin.

FIG. 4 is a front view of a clamp device according to an embodiment showing a state of a backup plate.

FIG. 5 is a plan view of a backup table of the clamp device according to the embodiment.

FIG. 6 is an explanatory diagram showing a clamp operation in a first clamp operation mode.

FIG. 7 is an explanatory diagram showing a clamp operation in a second clamp operation mode.

FIG. 8 is an explanatory diagram showing a clamp operation in a third clamp operation mode.

FIG. 9 is a cross-sectional view showing a state in which a backup pin is sucked by a suction nozzle of a mounting head.

FIG. 10 is a block diagram of a control system of the clamp device according to the embodiment.

FIG. 11 is an explanatory diagram of control signals for each of first, second and third clamp operation modes.

[Explanation of symbols]

1 Electronic component mounting device 21 Clamp device 31b Movable side substrate introduction table 34 backup pin 35 backup table 36 Backup lifting device 37 Control device 44 Guide groove 46 air cylinder 46a Piston rod 73 Clamp plate 100 control unit body 110 touch panel 120 hard disk S substrate

─────────────────────────────────────────────────── ─── Continuation of front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) H05K 13/04

Claims (3)

(57) [Claims] 1. A substrate is stepped up by raising a backup member until both side edges are guided by "U" -shaped guide grooves and the substrate introduced at a predetermined position is pressed against the upper surface of the guide groove. Up and down clamping step of upwardly pushing up, a step of repeatedly moving the clamp member forward and backward in the width direction of the substrate for each stepwise pushing operation, and repeatedly pushing the substrate against the one guide groove, and the clamp member. And a left and right clamping step of advancing the substrate in the width direction of the substrate and finally pressing the substrate against the side surface of the one guide groove. 2. A "ko" for guiding the side edges of the substrate, respectively.
A pair of substrate introduction bases each having a V-shaped guide groove for guiding the substrate into the guide groove and introducing the substrate into a predetermined position, and introduced into the predetermined position toward the guide groove of the one substrate introduction base. A clamp member for pressing the substrate in the width direction thereof, an advancing / retracting unit for advancing / retreating the clamp member in the width direction of the substrate, a backup member for pressing the substrate introduced at a predetermined position from below, and raising / lowering the backup member. In a substrate clamping device comprising an elevating means and a control means for controlling the operation of the advancing / retreating means and the elevating means, the control means controls the backup member until the substrate is pressed against the upper surface of the guide groove. While gradually raising, the clamp member is advanced and retracted for each stepwise movement of the backup member to finally push the substrate against the side surface of the guide groove. A board clamping device characterized by the following. 3. A "ko" for guiding the side edges of the substrate, respectively.
A pair of substrate introduction bases each having a V-shaped guide groove for guiding the substrate into the guide groove and introducing the substrate into a predetermined position, and introduced into the predetermined position toward the guide groove of the one substrate introduction base. A clamp member for pressing the substrate in the width direction thereof, an advancing / retracting unit for advancing / retreating the clamp member in the width direction of the substrate, a backup member for pressing the substrate introduced at a predetermined position from below, and raising / lowering the backup member. In a substrate clamping device comprising an elevating means and a control means for controlling the operation of the advancing and retracting means and the elevating means, the control means can instruct three or more types of clamping operations by the advancing and retracting means and the elevating means. Clamping operation instructing means and clamping operation selecting means capable of selecting any one of the three or more clamping operations of the clamping operation instructing means. However, the clamp operation instructing means at least raises the backup member before the substrate is pressed against the upper surface of the guide groove, then advances the clamp member to press the substrate against the side surface of the guide groove, and further, A first clamp operation mode in which a backup member is raised to press the substrate against the upper surface of the guide groove, and a second clamp in which the backup member is raised to press the substrate against the upper surface of the guide groove without advancing the clamp member. In the operation mode, the backup member is raised stepwise until the side edge of the substrate is pressed against the upper surface of the guide groove, and the clamp member is advanced and retracted for each stepwise raising operation of the backup member. And a third clamp operation mode in which the substrate is pressed against the side surface of the guide groove. Pump device.