JP2001102794A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2001102794A5 JP2001102794A5 JP1999281337A JP28133799A JP2001102794A5 JP 2001102794 A5 JP2001102794 A5 JP 2001102794A5 JP 1999281337 A JP1999281337 A JP 1999281337A JP 28133799 A JP28133799 A JP 28133799A JP 2001102794 A5 JP2001102794 A5 JP 2001102794A5
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- component
- component supply
- mounting head
- suction nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 16
- 230000000875 corresponding Effects 0.000 claims description 4
- 238000005457 optimization Methods 0.000 claims 2
Description
【０００９】
【課題を解決するための手段】
上記目的を達成するために、本発明は以下のように構成する。本発明の実装順序の最適化方法は、一定経路を間欠回転移動する装着ヘッドが所定の部品供給位置に停止したときに、前記装着ヘッドに設けた吸着ノズルにて部品を吸着し、前記装着ヘッドが所定の部品装着位置に停止したときに、吸着した部品を基板に装着する部品装着装置における実装順序の最適化方法であって、前記装着ヘッドが部品供給位置に停止した状態での前記吸着ノズルによる吸着動作位置が複数設定されていて何れかを選択できる装着ヘッドを用い、次に装着すべき部品を保持した部品供給手段の移動量が最小となる部品供給位置を選択して前記部品供給手段を移動させる第１工程と、前記装着ヘッドが前記第１工程で選択した部品供給位置に向かって移動する間に前記吸着ノズルの吸着動作位置を前記部品供給位置に対応させて選択する第２工程とを備えたものであり、部品供給位置までの部品供給手段の移動量を小さくすることができ、それだけ移動時間を短くすることができ、装着速度の高速化を図ることができる。0009
[Means for solving problems]
In order to achieve the above object, the present invention is configured as follows. In the method for optimizing the mounting order of the present invention, when the mounting head that intermittently rotates and moves in a fixed path stops at a predetermined component supply position, the mounting head sucks the components with the suction nozzle provided on the mounting head. Is a method for optimizing the mounting order in a component mounting device that mounts a suctioned component on a substrate when is stopped at a predetermined component mounting position, and the suction nozzle in a state where the mounting head is stopped at a component supply position. Using a mounting head in which a plurality of suction operation positions are set and one of them can be selected, the component supply position that minimizes the movement amount of the component supply means holding the component to be mounted next is selected and the component supply means. The first step of moving the suction nozzle and the second step of selecting the suction operation position of the suction nozzle corresponding to the component supply position while the mounting head moves toward the component supply position selected in the first step. The movement amount of the parts supply means to the parts supply position can be reduced, the movement time can be shortened accordingly, and the mounting speed can be increased.
【００１０】
また、本発明の実装順序の最適化方法は、一定経路を間欠回転移動する装着ヘッドが所定の部品供給位置に停止したときに、前記装着ヘッドに設けた吸着ノズルにて部品を吸着し、前記装着ヘッドが所定の部品装着位置に停止したときに、吸着した部品を基板に装着する部品装着装置における実装順序の最適化方法であって、前記装着ヘッドが部品装着位置に停止した状態での前記吸着ノズルによる装着動作位置が複数設定されていて何れかを選択できる装着ヘッドを用い、次に装着すべき部品の装着位置までの基板の移動量が最小となる部品装着位置を選択して基板を移動させる第１工程と、部品の吸着後、前記装着ヘッドが前記第１工程で選択した部品装着位置に向かって移動する間に前記吸着ノズルの装着動作位置を前記部品装着位置に対応させて選択する第２工程とを備えたものであり、部品装着位置までの基板の移動量を小さくすることができ、それだけ移動時間を短くすることができ、装着速度の高速化を図ることができる。0010
Further, in the method of optimizing the mounting order of the present invention, when the mounting head that intermittently rotates and moves along a constant path stops at a predetermined component supply position, the components are sucked by the suction nozzle provided on the mounting head, and the parts are sucked. This is a method for optimizing the mounting order in a component mounting device for mounting the attracted components on a substrate when the mounting head is stopped at a predetermined component mounting position, and is described above in a state where the mounting head is stopped at the component mounting position. Use a mounting head that has multiple mounting operation positions set by the suction nozzle and can select one, and select the component mounting position that minimizes the movement amount of the board to the mounting position of the component to be mounted next. The mounting operation position of the suction nozzle is selected in correspondence with the component mounting position while the mounting head moves toward the component mounting position selected in the first step after the first step of moving and the suction of the component. The second step is provided, and the amount of movement of the substrate to the component mounting position can be reduced, the moving time can be shortened accordingly, and the mounting speed can be increased.
【００１１】
また、本発明の部品装着方法は、一定経路を間欠回転移動する装着ヘッドが所定の部品供給位置に停止したときに、前記装着ヘッドに設けた吸着ノズルにて部品を吸着し、前記装着ヘッドが所定の部品装着位置に停止したときに、吸着した部品を基板に装着する部品装着方法であって、複数の吸着ノズルが前記装着ヘッドの周囲に配設され、前記装着ヘッド自身が回転できる前記装着ヘッドを用い、次に装着すべき部品の極性情報を判断する第１工程と、次の実装点との基板上の相対位置関係と前記第１工程で得た極性情報をもとに、前記装着ヘッドが部品装着位置に移動する間に前記装着ヘッドの回転を行うかどうか判断する第２工程と、前記第２工程の判断結果により前記装着ヘッドの回転を実施させる第３工程とを備えたものであり、部品装着位置までの基板の移動量を小さくすることができ、それだけ移動時間を短くすることができ、装着速度の高速化を図ることができる。0011
Further, in the component mounting method of the present invention, when the mounting head that intermittently rotates and moves in a fixed path stops at a predetermined component supply position, the component is sucked by the suction nozzle provided on the mounting head, and the mounting head causes the mounting head. A component mounting method in which a suctioned component is mounted on a substrate when stopped at a predetermined component mounting position, wherein a plurality of suction nozzles are arranged around the mounting head and the mounting head itself can rotate. The mounting is based on the relative positional relationship between the first step of determining the polarity information of the component to be mounted next using the head and the next mounting point on the substrate and the polarity information obtained in the first step. A second step of determining whether or not to rotate the mounting head while the head moves to the component mounting position, and a third step of rotating the mounting head based on the determination result of the second step. Therefore, the amount of movement of the substrate to the component mounting position can be reduced, the moving time can be shortened accordingly, and the mounting speed can be increased.
Claims (8)
前記装着ヘッドが部品供給位置に停止した状態での前記吸着ノズルによる吸着動作位置が複数設定されていて何れかを選択できる装着ヘッドを用い、
次に装着すべき部品を保持した部品供給手段の移動量が最小となる部品供給位置を選択して前記部品供給手段を移動させる第１工程と、
前記装着ヘッドが前記第１工程で選択した部品供給位置に向かって移動する間に前記吸着ノズルの吸着動作位置を前記部品供給位置に対応させて選択する第２工程と
を備えたことを特徴とする実装順序の最適化方法。When the mounting head, which rotates a fixed path intermittently, stops at a predetermined component supply position, the suction nozzle provided on the mounting head sucks a component, and the mounting head stops at a predetermined component mounting position A method of optimizing the mounting order in a component mounting apparatus for mounting a suctioned component on a substrate;
In the state where the mounting head is stopped at the component supply position, a plurality of suction operation positions by the suction nozzle are set, and any one can be selected.
A first step of selecting a component supply position at which the movement amount of the component supply unit holding the component to be mounted next is minimized, and moving the component supply unit;
And a second step of selecting the suction operation position of the suction nozzle corresponding to the component supply position while the mounting head moves toward the component supply position selected in the first step. How to optimize the implementation order.
前記装着ヘッドが部品供給位置に停止した状態での前記吸着ノズルによる吸着動作位置が複数設定されていて何れかを選択できる装着ヘッドを用い、
今後の装着する各部品に対し、装着すべき部品を保持した部品供給手段の移動量の総和が最小となるように部品供給位置を選択して部品供給手段を移動させる第１工程と、
前記装着ヘッドが前記第１工程で選択した部品供給位置に向かって移動する間に前記吸着ノズルの吸着動作位置を前記部品供給位置に対応させて選択する第２工程と
を備えたことを特徴とする実装順序の最適化方法。When the mounting head, which rotates a fixed path intermittently, stops at a predetermined component supply position, the suction nozzle provided on the mounting head sucks a component, and the mounting head stops at a predetermined component mounting position A method of optimizing the mounting order in a component mounting apparatus for mounting a suctioned component on a substrate;
In the state where the mounting head is stopped at the component supply position, a plurality of suction operation positions by the suction nozzle are set, and any one can be selected.
A first step of selecting the component supply position and moving the component supply unit such that the sum of the moving amounts of the component supply units holding the component to be mounted is minimized for each component to be mounted in the future;
And a second step of selecting the suction operation position of the suction nozzle corresponding to the component supply position while the mounting head moves toward the component supply position selected in the first step. How to optimize the implementation order.
前記装着ヘッドが部品装着位置に停止した状態での前記吸着ノズルによる装着動作位置が複数設定されていて何れかを選択できる装着ヘッドを用い、
次に装着すべき部品の装着位置までの基板の移動量が最小となる部品装着位置を選択して基板を移動させる第１工程と、
部品の吸着後、前記装着ヘッドが前記第１工程で選択した部品装着位置に向かって移動する間に前記吸着ノズルの装着動作位置を前記部品装着位置に対応させて選択する第２工程と
を備えたことを特徴とする実装順序の最適化方法。When the mounting head, which rotates a fixed path intermittently, stops at a predetermined component supply position, the suction nozzle provided on the mounting head sucks a component, and the mounting head stops at a predetermined component mounting position A method of optimizing the mounting order in a component mounting apparatus for mounting a suctioned component on a substrate;
In the state where the mounting head is stopped at the component mounting position, a plurality of mounting operation positions by the suction nozzle are set, and any one can be selected.
A first step of selecting a component mounting position at which the amount of movement of the substrate to the mounting position of the component to be mounted next is minimized, and moving the substrate;
And a second step of selecting the mounting operation position of the suction nozzle in correspondence with the component mounting position while the mounting head moves toward the component mounting position selected in the first step after suction of the component. An implementation order optimization method characterized by
前記装着ヘッドが部品供給位置に停止した状態での前記吸着ノズルによる吸着動作位置が複数設定されていて何れかを選択できる装着ヘッドを用い、
次に装着すべき部品を保持した部品供給手段の移動量が最小となる部品供給位置を選択して前記部品供給手段を移動させる第１工程と、
前記装着ヘッドが前記第１工程で選択した部品供給位置に向かって移動する間に前記吸着ノズルの吸着動作位置を前記部品供給位置に対応させて選択する第２工程とを備え、
前記第２工程において、現実装点と次実装点の部品供給手段による部品供給位置に基づき、前記吸着ノズルの吸着動作位置を選択することを特徴とする部品装着方法。When the mounting head, which rotates a fixed path intermittently, stops at a predetermined component supply position, the suction nozzle provided on the mounting head sucks a component, and the mounting head stops at a predetermined component mounting position A component mounting method for mounting a suctioned component on a substrate;
In the state where the mounting head is stopped at the component supply position, a plurality of suction operation positions by the suction nozzle are set, and any one can be selected.
A first step of selecting a component supply position at which the movement amount of the component supply unit holding the component to be mounted next is minimized, and moving the component supply unit;
A second step of selecting the suction operation position of the suction nozzle in correspondence with the component supply position while the mounting head moves toward the component supply position selected in the first step;
The component mounting method, wherein in the second step, the suction operation position of the suction nozzle is selected based on the component supply position by the component supply means at the current mounting point and the next mounting point.
複数の吸着ノズルが前記装着ヘッドの周囲に配設され、前記装着ヘッド自身が回転できる前記装着ヘッドを用い、
次に装着すべき部品の極性情報を判断する第１工程と、
次の実装点との基板上の相対位置関係と前記第１工程で得た極性情報をもとに、前記装着ヘッドが部品装着位置に移動する間に前記装着ヘッドの回転を行うかどうか判断する第２工程と、
前記第２工程の判断結果により前記装着ヘッドの回転を実施させる第３工程とを備えたことを特徴とする部品装着方法。When the mounting head, which rotates a fixed path intermittently, stops at a predetermined component supply position, the suction nozzle provided on the mounting head sucks a component, and the mounting head stops at a predetermined component mounting position A component mounting method for mounting a suctioned component on a substrate;
A plurality of suction nozzles are disposed around the mounting head, and the mounting head can rotate.
A first step of determining polarity information of a part to be mounted next;
Based on the relative positional relationship on the substrate with the next mounting point and the polarity information obtained in the first step, it is determined whether the mounting head is rotated while moving to the component mounting position. Second step,
And a third step of rotating the mounting head according to the determination result of the second step.
前記装着ヘッドが部品供給位置に停止した状態での前記吸着ノズルによる吸着動作位置が複数設定されていて何れかを選択できる装着ヘッドを用い、
次に装着すべき部品を保持した部品供給手段の移動量が最小となる部品供給位置を選択して前記部品供給手段を移動させ、
前記装着ヘッドが前記選択した部品供給位置に向かって移動する間に前記吸着ノズルの吸着動作位置を前記部品供給位置に対応させて選択し、
前記吸着動作位置の選択において、現実装点と次実装点の部品供給手段による部品供給位置に基づき、前記吸着ノズルの吸着動作位置を選択することを特徴とする部品装着装置。When the mounting head, which rotates a fixed path intermittently, stops at a predetermined component supply position, the suction nozzle provided on the mounting head sucks a component, and the mounting head stops at a predetermined component mounting position A component mounting apparatus for mounting a suctioned component on a substrate,
In the state where the mounting head is stopped at the component supply position, a plurality of suction operation positions by the suction nozzle are set, and any one can be selected.
Selecting a component supply position at which the movement amount of the component supply unit holding the component to be mounted next is minimized, and moving the component supply unit;
While the mounting head moves toward the selected component supply position, the suction operation position of the suction nozzle is selected according to the component supply position,
In the selection of the suction operation position, the suction operation position of the suction nozzle is selected based on the component supply position by the component supply means of the current mounting point and the next mounting point.
前記装着ヘッドが部品供給位置に停止した状態での前記吸着ノズルによる吸着動作位置が複数設定されていて何れかを選択できる装着ヘッドを用い、
次に装着すべき部品を保持した部品供給手段の移動量が最小となる部品供給位置を選択して前記部品供給手段を移動させる第１工程と、
前記装着ヘッドが前記第１工程で選択した部品供給位置に向かって移動する間に前記吸着ノズルの吸着動作位置を前記部品供給位置に対応させて選択する第２工程と
をコンピュータにより行うことを特徴とする記録媒体。When the mounting head, which rotates a fixed path intermittently, stops at a predetermined component supply position, the suction nozzle provided on the mounting head sucks a component, and the mounting head stops at a predetermined component mounting position A recording medium storing a program for performing optimization of the mounting order in a component mounting apparatus for mounting a suctioned component on a substrate;
In the state where the mounting head is stopped at the component supply position, a plurality of suction operation positions by the suction nozzle are set, and any one can be selected.
A first step of selecting a component supply position at which the movement amount of the component supply unit holding the component to be mounted next is minimized, and moving the component supply unit;
While the mounting head is moved toward the component supply position selected in the first step, a second step of selecting the suction operation position of the suction nozzle corresponding to the component supply position is performed by a computer. And a recording medium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28133799A JP2001102794A (en) | 1999-10-01 | 1999-10-01 | Method and apparatus for component mounting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28133799A JP2001102794A (en) | 1999-10-01 | 1999-10-01 | Method and apparatus for component mounting |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001102794A JP2001102794A (en) | 2001-04-13 |
| JP2001102794A5 true JP2001102794A5 (en) | 2004-12-24 |
Family
ID=17637710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28133799A Pending JP2001102794A (en) | 1999-10-01 | 1999-10-01 | Method and apparatus for component mounting |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001102794A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003101291A (en) * | 2001-09-25 | 2003-04-04 | Fuji Mach Mfg Co Ltd | Method for assembling electric circuit and system for mounting electric component |
| JP4719639B2 (en) * | 2006-07-07 | 2011-07-06 | 株式会社日立ハイテクインスツルメンツ | Setting device and program |
| JP4954723B2 (en) * | 2006-07-12 | 2012-06-20 | ヤマハ発動機株式会社 | Component mounting apparatus, component mounting system, and component mounting method |
| JP6883646B2 (en) * | 2017-03-29 | 2021-06-09 | 株式会社Ｆｕｊｉ | Parts mounting machine |
| CN110476495B (en) * | 2017-04-05 | 2020-11-20 | 株式会社富士 | Feeder |
-
1999
- 1999-10-01 JP JP28133799A patent/JP2001102794A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3313224B2 (en) | Electronic component mounting equipment | |
| JP4834106B2 (en) | Method and automatic mounting machine for mounting electrical components on a substrate | |
| JP2008016695A5 (en) | ||
| JP2001102794A5 (en) | ||
| JP6499768B2 (en) | Component mounter, component holding member imaging method | |
| JP4504157B2 (en) | Mounting head for electronic component mounting device | |
| JP3790020B2 (en) | Surface mount machine | |
| JP3245409B2 (en) | Semiconductor device | |
| JP6236307B2 (en) | Component mounter | |
| US8898893B2 (en) | Method and apparatus for applying fluid during a placement cycle | |
| US6585476B1 (en) | Surface mounting device | |
| JP4887016B2 (en) | Electronic component mounting device | |
| JP2007096176A (en) | Electronic component mounting apparatus | |
| JP2003289200A (en) | Component mounting method, component mounting device, and mounting order determination program | |
| JPH11121990A (en) | Component installing device | |
| JP3638233B2 (en) | Electronic component mounting order optimizing method, electronic component mounting order optimizing device in electronic component mounting apparatus, computer-readable recording medium recording electronic component mounting order optimizing program, and electronic component mounting apparatus | |
| WO2023228322A1 (en) | Die pickup method and device | |
| JP2006128482A (en) | Mounting head of electronic component mounter | |
| JPH07202491A (en) | Chip resistor fitting method and device | |
| JP2006186097A (en) | Viscous fluid coating method and program | |
| JP3087632B2 (en) | Electronic component mounting equipment | |
| JP3821526B2 (en) | Component mounting equipment | |
| JPH0715195A (en) | Electronic parts mounting device | |
| JP2808862B2 (en) | Electronic component mounting method | |
| JPH11340684A (en) | Operating equipment |