JP2001102794A - Method and apparatus for component mounting - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase a speed for component mounting by shortening a moving distance of a component-supply means and a substrate in a method for a component mounting wherein a component is chucked by a vacuum-chucking nozzle of head for mounting at a prescribed component-supply position, and the component chucked at a specified component-placing position is placed on a substrate. SOLUTION: This method for a component placement includes a first process and a second process. In the first process, there are set a plurality of positions for a vacuum-chucking nozzle to execute either of a chucking operation or a mounting operation in a state of the chuck being stopped at a component-supply position or component mounting position, and the nozzle can select an appropriate chucking or placement position, next a component supply or mounting position is elected so that a movement amount of a component supply means holding a component to be installed, or a movement amount of a substrate to the mounting position of the component becomes minimum, and then the component supply means or the substrate is moved. In the second process, while the head is being moved toward the component- chucking position, the position of the chucking nozzle is selected to corresponding to the component chucking position or the component mounting position selected in the first process.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for mounting components such as electronic components on a substrate.

[0002]

2. Description of the Related Art As shown in FIG. 14, a conventional general high-speed type electronic component mounting apparatus takes out a component from an optional component supply means 3 of a component supply unit 2 at a mounting unit 1 and performs XY.
The components are automatically mounted on the board 5 set on the table 4. Reference numeral 6 denotes a transport rail for loading / unloading the substrate 5, and reference numeral 7 denotes a display unit for displaying an operation state or an abnormal state of the component mounting apparatus.

[0005] In the component supply section 2, as shown in FIG. 15, the component supply means 3 in which the component reel 8 wound on a reel while holding the component on a tape is set to a component supply table 9 which can move left and right. The component supply table 9 is moved along the guide rail 9a to position an arbitrary component supply means 3 at a component supply position 10 set at one place.

In the mounting section 1, a plurality of mounting heads 12 are provided on the outer periphery of a rotating table 11 that rotates intermittently, and the components of the component supply means 3 positioned at the component supply position 10 are supplied to the mounting head 12. The components held by suction are provided by the provided suction nozzles, and then, when the rotary table 11 rotates and the mounting head 12 stops at the component mounting position, the components held by suction are mounted on the substrate 5 positioned by the XY table 4. Is configured.

[0005] Each mounting head 12 is provided with one or a plurality of suction nozzles, and when a plurality of suction nozzles are provided, a suction nozzle suitable for the type of component can be selected. In any case, when the mounting head 12 stops at the component suction position or the component mounting position, the only or selected suction nozzle is located at the component suction position or the component mounting position, and the mounting head 12 moves up and down. Is configured to perform component suction or component mounting.

[0006]

In recent years, it has been required to further increase the component mounting speed. In this case, the rotational speed of the rotary table 11 in the mounting section 1 is increased to reduce the moving time of the mounting head 12. Although it is relatively easy to reduce the length, the time that can be used to move the component supply table 9 and the XY table 4 is more limited than the movement time of the mounting head, so it is difficult to further shorten the movement time. is there.

That is, the component supply table 9 can start moving only after a component is sucked by the suction nozzle and rises to a predetermined height, and the next suction nozzle is moved to a predetermined height higher than the component suction height. The movement must be completed before descending to a high position, and the time during which the XY table 4 can move is also similarly limited in the case of component mounting. To further reduce the moving time, the component supply table 9 or X
It is extremely difficult to increase the moving speed of the Y table 4 because it is already near the limit. Therefore, it is necessary to shorten the moving distance of the component supply table 9 and the XY table 4 in order to further increase the mounting speed of components, but this is not possible with the conventional configuration, and this is the biggest obstacle to increasing the mounting speed. ing.

SUMMARY OF THE INVENTION The present invention has been made in consideration of the above-described conventional problems, and has as its object to provide a component mounting method and apparatus capable of increasing a mounting speed by shortening a moving distance of component supply means and a board. I have.

[0009]

To achieve the above object, the present invention is configured as follows. According to the component mounting method of the present invention, when a mounting head that moves intermittently on a fixed path stops at a predetermined component supply position, a component is suctioned by a suction nozzle provided on the mounting head, and the mounting head mounts a predetermined component. A component mounting method for mounting components picked up when stopped at a position on a substrate, wherein a plurality of suction operation positions are set by suction nozzles when the mounting head is stopped at the component supply position, and any one of the positions can be selected. Using the mounting head,
Next, a first step of selecting a component supply position at which the moving amount of the component supply unit holding the component to be mounted is minimized and moving the component supply unit, and a process of moving the mounting head toward the component suction position. And a second step of selecting the suction nozzle position in correspondence with the component suction position in the first step, whereby the movement amount of the component supply means to the component supply position can be reduced, and the moving time is correspondingly reduced. The length can be shortened, and the mounting speed can be increased.

When the mounting head that intermittently moves on a fixed path stops at a predetermined component supply position, the component is sucked by a suction nozzle provided on the mounting head, and the mounting head stops at the predetermined component mounting position. This is a component mounting method for mounting components picked up at the time of mounting on a substrate, wherein a plurality of suction operation positions are set by suction nozzles in a state where the mounting head is stopped at a component supply position, and a mounting head capable of selecting any of the positions. A first step of selecting a component supply position and moving the component supply unit so that the total amount of movement of the component supply unit holding the component to be mounted is minimized with respect to a component to be mounted in the future; And a second step of selecting a suction nozzle position corresponding to the component suction position in the first step while the head moves toward the component suction position. It is possible to reduce the amount of movement of the plate, it can be shortened that much moving time, it is possible to increase the speed of mounting speed.

Further, when the mounting head, which intermittently moves on a fixed path, stops at a predetermined component supply position, the components are sucked by a plurality of suction nozzles provided on the mounting head, and the mounting head is moved to a predetermined component mounting position. This is a component mounting method for mounting components picked up on the board when stopped at the same time, using a mounting head that can rotate itself with multiple suction nozzles attached, and attributes such as the polarity of the component to be mounted next The rotation of the mounting head during the movement of the mounting head to the component mounting position based on the relative positional relationship on the board with the next mounting point and the component attribute information obtained in the first process. The method includes a second step of determining whether or not to perform the operation and a third step of rotating the mounting head based on the information of the second step. I can do that It is possible to shorten the travel time only, it is possible to increase the speed of mounting speed.

Further, the component mounting apparatus of the present invention comprises a suction head for sucking components with a plurality of suction nozzles, an XY table for positioning a component supply unit for supplying components and mounting a printed circuit board. The mounting operation is performed based on the component mounting data generated by the component mounting method according to any one of Items 1, 2, and 3, and the mounting can be performed with a small moving amount of the board or the component supply unit. I can do it.

Further, a plurality of mounting operation positions by the suction nozzle in a state where the mounting head is stopped at the component mounting position are set and a mounting head which can select any one is used. A first step of moving the board by selecting a component mounting position that minimizes the amount of movement of the board, and setting the suction nozzle position to the first step while the mounting head moves toward the component mounting position after component suction By providing the second step of selecting according to the position, the amount of movement of the board to the component mounting position can be reduced, the moving time can be shortened accordingly, and the mounting speed can be increased. it can.

Further, a plurality of suction or mounting operation positions are set by the suction nozzle in a state where the mounting head is stopped at the component supply position or the component mounting position, and a mounting head can be selected from the plurality of operation positions. A first step of selecting a component supply position at which the movement amount of the component supply unit holding the component is minimized and moving the component supply unit; and setting a suction nozzle position while the mounting head moves toward the component suction position. A second step of selecting the component in accordance with the component suction position in one step, and a third step of selecting a component mounting position that minimizes the amount of movement of the board to the mounting position of the component to be mounted next and moving the board And a fourth step of selecting a suction nozzle position corresponding to the component suction position of the third step while the mounting head moves toward the component mounting position after the component suction. It is possible to obtain the same effect on both.

Further, the component mounting apparatus of the present invention suctions a component with a suction nozzle provided in the mounting head when the mounting head that intermittently moves on a fixed path stops at a predetermined component supply position. In a component mounting apparatus that mounts a component sucked on a substrate when stopped at a predetermined component mounting position, a suction nozzle for performing a suction operation or a mounting operation with the mounting head stopped at a component supply position or a component mounting position A means for setting a plurality of positions and selecting one of the positions is provided. By selecting the suction nozzle position, the above method can be performed to realize high-speed mounting.

Specifically, the mounting head is provided with a rotating body rotatable about a vertical rotation axis, and the suction nozzle is disposed on the rotating body at a position eccentric to the rotation axis. The operation position of the suction nozzle can be selected by the rotation of the rotating body.

[0017] Further, a nozzle block is provided on the rotating body, the nozzle block being rotatable and positionable about an inclined axis which intersects obliquely with respect to the axis of rotation and having a plurality of types of suction nozzles arranged therearound. By rotating the nozzle block according to the type of parts, it is possible to select an appropriate suction nozzle by rotating the nozzle block according to the type of parts. In addition to the selection, the operation position of the suction nozzle can be selected by the rotation of the rotating body.

A plurality of types of suction nozzles are provided around the rotating body in parallel with the axis of the rotary shaft, and a means for switching the vertical position of each suction nozzle is provided. An appropriate suction nozzle can be selected by selecting the upper and lower positions, and the operating position of the suction nozzle can be selected by rotating the rotating body.

In addition, the rotary body is provided with a nozzle block which is rotatable about a horizontal axis perpendicular to the axis of rotation and has a plurality of types of suction nozzles disposed therearound. Depending on the type of parts, even if the arrangement plane is eccentrically arranged with respect to the rotation axis of the rotating body, any suction nozzle can be positioned parallel to the rotation axis by rotating the nozzle block. By rotating the nozzle block, an appropriate suction nozzle can be selected, and the operation position of the suction nozzle can be selected by rotating the rotating body.

Further, according to the component mounting method of the present invention, a plurality of mounting heads disposed around a rotary table intermittently rotating in one direction are sequentially stopped at a component supply position, while the mounting head is moved in a direction in contact with a rotary circle of the rotary table. A suction nozzle provided on a mounting head at a component supply position, the component supply means for supplying a component to be sucked is sequentially stopped at a predetermined position among a number of component supply means mounted in parallel on a moving component supply table. In the component mounting method of mounting the sucked component on the substrate when the mounting head reaches the component mounting position due to the intermittent rotation of the rotary table, the mounting head stops at the component supply position. As the suction operation position by the suction nozzle in the state, from the reference point where the rotating circle of the rotary table and the moving direction line of the component supply table are in contact Select one of two positions: a first suction operation position deviated upstream in the turntable rotation direction and a second suction operation position deviated downstream in the turntable rotation direction from the reference point. Using a suction head configured so as to be able to move, the component supply table is pitch-moved in the direction opposite to the rotation direction of the rotary table, and the first suction operation position is selected in the first cycle at the position corresponding to this. The component is sucked from the positioned component supply means, and the second
The next mounting head that reaches the component supply position in the cycle
The pick-up operation position is selected, the component is picked up from the next component supply means positioned by pitching to the corresponding position, and the third mounting head that has reached the component supply position is moved in the third cycle to the third mounting head. The pick-up operation position is selected, and the component is continuously sucked from the component supply means used in the second cycle, which is moved by the pitch to the position corresponding to the pick-up operation position, and reaches the component supply position in the fourth cycle. The mounting head of No. 4 is selected as the second suction operation position, and the component is sucked from the third component supply means positioned by being pitch-moved to the corresponding position, and then reaches the next component supply position. The mounting head picks up components from the third component supply means in the same manner as in the first cycle, and then picks up the components by repeating the above-described cycle. The weight is large and the mounting speed is high. It is possible to reduce the amount of movement per cycle of component feeding tables which has been a bottleneck in achieving, it is possible to shorten the much moving time, it is possible to increase the speed of mounting speed.

In the above invention, when the pitch between the component supply means on the component supply table is p, the deviations of the first suction operation position and the second suction operation position from the reference point are each p / 4. If one pitch movement of the component supply table is set to p / 2, the moving amount per cycle of the component supply table can be reduced to half of the conventional example, and the mounting speed can be reduced. And the pitch movement amount of the component supply table can be reduced by p / 2.
It is preferable because it can be fixed.

In the above invention, if one part cassette is provided with a plurality of rows of component collecting tapes, and each of the component collecting tapes constitutes the component supply means, the pitch p itself between the component supply means can be reduced. , Which can contribute to a higher mounting speed.

In the component mounting method of the present invention, when the component suction operation in any one of the first cycle to the fourth cycle is repeated with the component supply table stopped, the mounting head coming to the component supply position next. Is selected as a corresponding suction operation position, and the components supplied from the same component supply unit are suctioned, so that the components can be adapted to the actual use state.

Further, in the component mounting apparatus of the present invention, the plurality of mounting heads disposed around the rotary table intermittently rotating in one direction are sequentially stopped at the component supply position, and in the direction in contact with the rotary circle of the rotary table. A suction nozzle provided on a mounting head at a component supply position, the component supply means for supplying a component to be sucked is sequentially stopped at a predetermined position among a number of component supply means mounted in parallel on a moving component supply table. The component is picked up from the component supply means, and the picked-up component is recognized by the component recognition camera when the mounting head reaches the component recognition position due to the intermittent rotation of the rotary table, and then the component is picked up when it reaches the component mounting position. In a component mounting apparatus configured to mount the
As a suction operation position of the suction nozzle when the mounting head is stopped at the component supply position, the suction head is displaced upstream from the reference point where the rotating circle of the rotary table and the moving direction line of the component supply table are in contact with each other in the rotary table rotation direction. Any one of three positions: a first suction operation position, a second suction operation position deviated downstream from the reference point in the rotary table rotation direction, and a third suction operation position that is the reference point position. When the mounting head is in the component recognition position and the component mounting position, the suction nozzle is positioned at the reference point and the component is recognized and the component is mounted, regardless of the suction operation position. In the case where components are sucked at the first and second suction operation positions, the mounting speed can be increased as described above. When adsorbing component in a third adsorption operation position of the can perform component recognition of the recognition camera to maintain the correct suction attitude.

In particular, if the suction operation position of the mounting head is selected in accordance with the size of the component, and more specifically, the third suction operation position is selected for a large component having a side of 5 mm or more. In addition, it is possible to prevent such inconvenience that a large part is partially out of the field of view of the recognition camera. That is, a large component is temporarily sucked at the first and second suction operation positions,
When the recognition camera recognizes the suction nozzle moved to the reference point at the component recognition position, the posture of the large component is tilted by the moving angle of the suction nozzle, and the reference center line of the recognition camera's field of view and the reference center of the large component. As a result of the occurrence of the inclination of the angle corresponding to the movement angle between the line and the line, there is a disadvantage that a part of the large part is out of the field of view of the recognition camera. If only the large components are sucked at the third suction operation position, it is possible to perform component recognition in a state where the reference center line and the reference center line of the field of view of the recognition camera match, thereby solving the above-described disadvantage. In addition to this, it is possible to increase the suction speed for small components.

[0026]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An electronic component mounting method and apparatus according to one embodiment of the present invention will be described below with reference to FIGS. The overall configuration of the electronic component mounting machine is shown in FIG.
Since this is substantially the same as the conventional example described with reference to FIG. 15, the description thereof will be referred to, and only the features of the present embodiment will be described.

5 and 6, a plurality of mounting heads 12 are arranged at equal intervals on the outer peripheral portion of the turntable 11 of the mounting section 1.
Are arranged. 13 is a main body of the mounting head 12,
A cam follower (not shown) is supported on the turntable 11 via a slide guide 14 so as to be vertically movable, and engages with a groove cam (not shown) provided around the turntable 11 above the main body 12. ) Is mounted, and the mounting head 12 moves up and down for component suction, component mounting, and the like as the rotary table 11 rotates.

The main body 13 is provided with a rotation shaft 15 rotatable about a vertical rotation axis O, and is driven by a motor 16 disposed above the main body 13 via a reduction mechanism 17 such as a harmonic reduction mechanism. And can be rotated forward and backward. A rotating body 18 is fixed to a lower end of the rotating shaft 15. The rotary body 18 includes a nozzle block 19 that can be rotationally positioned around an inclined axis P that intersects at 45 ° with the rotational axis O of the rotational shaft 15 and that has a plurality of types of suction nozzles 20 disposed therearound. It is arranged. By rotating the nozzle block 19, an arbitrary suction nozzle 20 can be selectively positioned at a position parallel to the rotation axis O and eccentric by a predetermined radius r.

Thus, as shown in FIG.
Is rotated by ± θ from the origin position, so that the suction nozzle 20 is moved along the center line C passing through the rotation center of the rotary table 11.
Can be switched by d (= 2r sin θ) with.

In FIG. 5, reference numeral 21 denotes a suction air connection connector attached to the lower end of the main body 13, reference numeral 22 denotes an air passage provided in the main body 13, and reference numeral 23 denotes an air passage provided in the rotary shaft 15. is there. At the upper end of the air passage 23, an annular groove 23a and a radial hole 23b on the outer periphery of the rotating shaft 15 are provided, so that communication with the air passage 22 is ensured even when the rotating shaft 15 rotates. Reference numeral 24 denotes a filter disposed at the lower end of the rotary shaft 15, and reference numeral 25 denotes an air passage formed in the rotary body 18 so as to communicate the fitting portion 15 a at the lower end of the rotary shaft 15 and the shaft support 19 a of the nozzle block 19.

Reference numeral 26 denotes a rotation support shaft of the nozzle block 19, and one end thereof is fitted into a bottomed hole 19b which also serves as an air passage and is drilled at the shaft center position of the nozzle block 19 from the side opposite to the shaft support portion 19a. The other end is fixed to the rotating body 18. A spring 27 is interposed between the rotating body 18 and the nozzle block 19 and biases the nozzle block 19 toward the shaft support 19a. An air passage 25 and a bottomed hole 19b are formed in the shaft support 19a of the nozzle block 19.
An air passage 19c composed of an annular groove and a radial hole is formed so that the air passage 19c communicates even when is rotated. In addition, the rotation support shaft 26
Is formed with an air passage 28 communicating the bottomed hole 19b and the air passage 20a of the suction nozzle 20 located vertically downward in the nozzle block 19. Reference numeral 29 denotes a spring that urges the suction nozzle 20 downward so as to be able to retract and rise.

The shaft support 19a of the nozzle block 19
An engagement ridge 19d protrudes from the tip surface of the nozzle block 19, and the nozzle block 19 is rotated by a rotary operation shaft 30 that can engage with the engagement ridge 19d at a predetermined stop position of the mounting head 12, and an arbitrary protrusion is formed. The suction nozzle 20 is configured to be used in a vertically downward use state.

The operation of the above configuration will be described with reference to FIG. In the case where the component a is currently sucked and the component b is sucked next, in the present embodiment, as shown in (1) of FIG. 8A, the mounting head 12 stopped at the component supply position. In A1, A1 is selected from the suction nozzle positions A1 and A2, and the component a is sucked at A1. On the other hand, the component supply means 3 holding the component b to be sucked next is located farther away from the component supply means 3 holding the component a in the rotation direction of the turntable 11. Therefore, the component supply position is selected so that the movement amount of the component supply means 3 holding the component b to be mounted next is minimized, and the component supply means is moved by the distance La,
As shown in (2) of FIG. 8A, in the subsequent mounting head 12, while the mounting head 12 moves toward the component supply position, the rotating shaft 15 is rotated to set the suction nozzle positions B1, B2. B2 is selected and the suction nozzle position B2 is selected.
Sucks the part b.

On the other hand, in the conventional example, as shown in (1) of FIG. 8B, the mounting head 1 stopped at the component supply position.
In FIG. 8B, a single suction nozzle is used to suck the component a at the suction nozzle position A, and no matter where the component supply means 3 holding the component b to be sucked next is located. As shown in (2), the component supply means 3 holding the component b is moved to the component supply position Lb before the next component suction.
And the component b is sucked at the suction nozzle position B at the component supply position.

As described above, in the present embodiment, the moving amount of the component supply means 3 to the component supply position is set to La with respect to the conventional Lb.
As described above, the distance d between the selected positions A1 and A2 of the suction nozzle 20 can be reduced (see FIG. 7), the moving time can be shortened accordingly, and the mounting speed can be increased. 1 and 2, the operation of the component supply unit at that time will be described with an example of the operation of picking up three components. FIG. 1 is a diagram for explaining the suction position and the movement of the component supply unit when the positions of the component supply unit at the current mounting point and the next mounting point are considered. When only the current mounting point and the next mounting point are considered, the rule that minimizes the amount of movement of the component supply unit is that the component supply unit moves by one pitch in the plus direction at the current mounting point at the right suction position, and When the component supply unit does not move at the next mounting point, the component supply unit moves by one pitch in the minus direction at the next mounting point, and no movement of the component supply unit occurs at the current mounting point.

In FIG. 1, regarding the operation of picking up three components, (1) when Z1 → Z2 → Z2 → Z2 → Z1,
(2) In the case of Z1 → Z2 → Z3, (3) Z2 → Z1 → Z
For the case 2, the movement of the suction position and the movement of the component supply unit will be described. First, in (1), the part supply unit number 1
A component (hereinafter, referred to as Z1) is suctioned (left suction) at the left suction position, and the next Z2 component is suctioned at the right suction position with the Z axis moved by a half pitch. (In this way, Z
The movement amount of the shaft is halved). Next, in order to suck a component of Z2, the Z axis is moved by one pitch to perform left suction.
Similarly, when the suction operation is performed as shown in FIG. 1, the operation of one pitch or more of the Z axis occurs at the underlined arrow portion during the suction operation of Z1 → Z2 → Z2 → Z2 → Z1 (twice). . Therefore, the Z-axis half pitch movement is performed twice, so that the moving time of the component supply unit can be shortened, and the mounting speed can be increased. Similarly, for (2), Z1 → Z2 → Z3 (two operations of one pitch or more of the Z-axis), and for (3), Z2 → Z1 → Z2 (two Z operations)
(The operation of the shaft 1 pitch or more), and it is not sufficient to reduce the movement amount of the component supply section under this condition.

Therefore, conditions up to one mounting point will be considered. FIG. 2 is a view for explaining the suction position and the movement of the component supply unit when one mounting point is considered in addition to FIG. In this case, the rule for minimizing the movement amount of the component supply unit is that the component supply unit is suctioned right when the previous mounting point <current mounting point, and left when the component supply unit is the previous mounting point> current mounting point. Suction and parts supply part is the previous mounting point =
If current mounting point and current mounting point <next mounting point, left suction,
The component supply unit is the previous mounting point = the current mounting point and the current mounting point>
In the case of the next mounting point, the right suction, the component supply unit holds the suction position when the previous mounting point = current mounting point and the current mounting point = next mounting point.

In FIG. 2, (1) Z1 → Z2 → Z2 → Z2
→ In case of Z1, (2) In case of Z1 → Z2 → Z3, (3)
The suction position and the movement of the component supply unit for the case of Z2 → Z1 → Z2 will be described. When comparing FIG. 1 and FIG. 2,
The movement of the component supply unit by one pitch or more is (1) twice → 0 times,
It can be seen that the number has decreased from (2) twice to once, and (3) twice to once. 2, the movement amount of the component supply unit can be further reduced, the movement time can be shortened accordingly, and the mounting speed can be increased.

In the above description, the case where the component is picked up by the component supply unit 2 has been described. However, even when the component is mounted on the board 5 on the XY table 4, the operation of the suction nozzle 20 is performed according to the next mounting position. By selecting the position, similarly, the moving distance of the XY table 4 can be shortened to shorten the moving time. That is, a component mounting position where the amount of movement of the substrate 5 to the mounting position of the next component to be mounted is minimized is selected and the substrate 5 is moved on the XY table 4, and the mounting head 12 after the component suction is mounted. By selecting the position of the suction nozzle 20 corresponding to the selected component mounting position while moving toward the position, the amount of movement of the substrate 5 to the component mounting position can be reduced, and the moving time can be reduced accordingly. Can be shortened,
The mounting speed can be increased.

FIG. 3 is an example for explaining that the moving distance of the XY table is shortened by rotating the head with respect to the non-polar component. FIG. 3 shows that, after mounting the component at the mounting point 1, the head is rotated by 180 degrees, so that the movement amount of the component on the XY table approaches 15 mm and overlaps with the mounting point 2. This indicates that the movement of the XY table is unnecessary. In this example, the movement amount of the XY table is completely zero. However, by rotating the head, the movement amount of the XY table can be reduced.

Here, whether to rotate the head is determined by
This will be described with reference to the flowchart of FIG. In the first step, the mounting position of the component to be mounted next, polarity information, etc. are read, the presence or absence of polarity is determined in the second step, and whether the head should be rotated in the third step (that is, if the head is rotated) However, when the XY movement amount to the next mounting point is small, it is determined that the head is rotated.) It is determined that the head is rotated in the fourth step.

It is needless to say that this effect is remarkable when a non-polar small chip component occupies 70% or more of the total number of components in a cellular phone or a personal computer substrate.

Next, another embodiment will be described with reference to FIG. Note that components having the same functions as those of the above-described embodiment are denoted by the same reference numerals, description thereof will be omitted, and only different points will be described.

In FIG. 9, a plurality of kinds of suction nozzles 20 are arranged on the outer periphery of a rotating body 18 fixed to the lower end of a rotating shaft 15 in parallel with the center of the rotating shaft. Each suction nozzle 2
Numeral 0 is attached to the lower end of a movable shaft 31 supported on the outer periphery of the rotating body 18 so as to be movable up and down.
2b and the upper end of the movable shaft 31 and the rotating body 1
A spring 33 for urging downward is interposed between the spring 8 and the spring 8.

Each movable shaft 31 is provided on the outer periphery of the rotating body 18.
A locking pawl 34 swingable between a position engaging with the positioning step portion 32a and a disengagement position is provided correspondingly, and a ring is urged therearound toward the engaging position. Spring 3
5 is fitted outside. The locking claw 34 is provided at its lower end with an engaging portion 34a for the positioning step portions 32a and 32b, a fulcrum projecting portion 34b in the middle, and a swing operation portion 34c at its upper end, and is engaged by pressing the swing operation portion 34c. The dowel 34a moves to the disengaged position, and the movable shaft 31 moves to the lowered position.

An air passage 36 communicating with the suction nozzle 20 is formed below the movable shaft 31, and an air passage 37 composed of a radial groove and an outer annular groove is formed below the air passage 23 of the rotating shaft 15. When any movable shaft 31 is locked at the lowered position, the air passage 36 of the movable shaft 31 and the air passages 37 and 23 of the rotating shaft 15 are configured to communicate with each other. Thus, by pressing the swing operation portion 34c of the locking claw 34 to position the movable shaft 31 at the lowered position, suction can be performed by the suction nozzle 20.

Also in this embodiment, by operating the locking claw 34 corresponding to the appropriate suction nozzle 20 according to the type of the component, the suction nozzle 20 is lowered to be in the operating state, and in this state the rotating body 18 By rotating, the operation position of the suction nozzle 20 can be selected, and the same effect as in the above embodiment can be obtained by performing the suction or mounting operation.

Next, another embodiment will be described with reference to FIG.
0 will be described. Note that components having the same functions as those of the above-described embodiment are denoted by the same reference numerals, description thereof will be omitted, and only different points will be described.

In FIG. 10, a rotating body 18 fixed to the lower end of the rotating shaft 15 is constituted by a U-shaped bracket opened downward, and rotates about a horizontal axis perpendicular to the rotating axis O. A nozzle block 38, which is positionable and has a plurality of types of suction nozzles 20 disposed therearound, is disposed, and the plane of placement of the suction nozzles 20 is deviated from the rotation axis O of the rotating body 18 by an eccentric amount e. The nozzle block 38 is rotated and the arbitrary suction nozzle 20
Can be positioned in parallel with the rotation axis O.

Also in the present embodiment, an appropriate suction nozzle 20 can be selected by rotating the nozzle block 38 according to the type of component, and the operating position of the suction nozzle 20 can be selected by rotating the rotating body 18. The same effect as the above embodiment can be obtained by performing the same suction or mounting operation.

Next, another embodiment will be described with reference to FIG.
1, will be described with reference to FIG.

As shown in FIG. 11, the component mounting method according to this embodiment employs a rotary table 11 that rotates intermittently in one direction S.
Are sequentially stopped at the component supply position F, and a large number of components mounted in parallel on the component supply table 9 that moves in the direction W in contact with the rotating circle M of the rotary table 11. The component supply means 3 for supplying the component to be sucked out of the component supply means 3 is sequentially stopped at a predetermined position, and the component is supplied from the component supply means 3 by the suction nozzle 20 provided on the mounting head 12 at the component supply position F. When the mounting head 12 reaches the component recognition position G due to the intermittent rotation of the rotary table 11, the picked-up component is recognized by the component recognition camera 51. It is designed to be attached to.

The mounting head 12 sets the rotation circle M of the rotary table 11 and the component supply table 9 as the suction operation position of the suction nozzle 20 when stopped at the component supply position F.
And a first suction operation position K deviated upstream from the reference point C in the rotary table rotation direction S with respect to the reference point C, and a second suction operation position K deviated downstream from the reference point C in the rotary table rotation direction S. The two suction operation positions L and two positions can be selected. Specifically, the mounting head shown in FIG. 9 and the mounting head shown in FIG. 5 described above may be used.

On the component supply table 9, component supply means 3 are arranged in parallel at a pitch p, and the component supply table 9 moves at a pitch of P / 2 in a direction W opposite to the rotation direction S of the rotary table 11. I have.

The deviations of the first suction operation position K and the second suction operation position L from the reference point C are each p / 4. In the suction head 12a in which the first suction operation position K is selected in the first cycle shown in FIG. 12A, the component Z is supplied from the component supply means 3a positioned at the corresponding position.
Then, the next mounting head 12b that has reached the component supply position F in the second cycle shown in FIG. 12B is selected as the second suction operation position L, and p / 2 is reached until the corresponding position.
The component Zb1 is sucked from the next component supply means 3b positioned by the pitch movement, and the third mounting head 1 reaches the component supply position F in the third cycle shown in FIG.
2c is selected as the first suction operation position K, and the component Zb2 is continuously moved from the component supply means 3b used in the second cycle, which has been moved by p / 2 pitches and positioned to the corresponding position.
In the fourth cycle shown in FIG. 12D, the fourth mounting head 12d that has reached the component supply position F is selected as the second suction operation position L, and p / P is moved to a position corresponding to this.
Third component supply means 3 moved and moved by two pitches
Then, the component Zc1 is sucked from c, and subsequently, (e) of FIG.
As shown in (2), the component Zc2 is sucked from the third component supply means 3c by the mounting head 12e that reaches the component supply position F in the same manner as in the first cycle, and the above process is repeated to pick up the component. .

It should be noted that the component picking operation in any of the first cycle to the fourth cycle is performed by the component supply table 9.
If you want to repeat while stopping the pitch without moving it,
Next, the mounting head 12 that comes to the component supply position F is selected to the corresponding suction operation position, and the component supplied from the same component supply unit 3 may be sucked. For example, FIG.
If the component is to be sucked again from the component supply means 3a in the state shown in (a), the next mounting head 12b may be selected to the first suction operation position K and the component may be sucked.

As described above, according to the present embodiment, the movement amount of the component supply means 3 in each cycle can be set to half (p / 2) of the pitch p between the component supply means 3 and the conventional example. It can be reduced by half compared to. Since a large number of component supply means 3 are mounted on the component supply table 9 and the inertia thereof is extremely large, how to reduce the movement amount of the component supply table 9 in each cycle is to shorten the component mounting tact. However, according to the present embodiment, the pitch movement of the component supply table 9 can be reduced by half as compared with the conventional example, and the component mounting tact can be greatly reduced. .

The present embodiment is based on the premise that at least two or more components are continuously sucked from the same component supply means 3. However, when only one component is picked up from one component supply unit 3 or when the pitch between component supply units storing large components is larger than p, the first cycle to the fourth cycle may be used. Since the suction operation cannot be performed, the suction and mounting operations in the special case may be performed after the suction operation in the above-described series of cycles is completed.

The smaller the pitch p between the component supply means 9 mounted on the component supply table 9, the smaller the movement amount of the component supply table 9 in one cycle. For this reason, it is preferable to use a component cassette provided with a plurality of rows of component assembly tapes in a single component cassette (see Japanese Patent Publication No. 7-114319).

Next, another embodiment will be described with reference to FIG.
1, will be described with reference to FIG. In this embodiment, the reference point at which the rotating circle M of the rotary table 11 and the moving direction line of the component supply table 9 are in contact with each other as the suction operation position of the suction nozzle 20 when the mounting head 12 is stopped at the component supply position F. A first suction operation position K deviated to the upstream side in the rotary table rotation direction from C, a second suction operation position L deviated to the downstream side in the rotation table rotation direction from the reference point C, and the reference point It is configured to be able to select any one of three positions with the third suction operation position C which is a position.

When the mounting head 12 reaches the component recognition position G, the suction nozzle 20 is positioned at the reference point C, regardless of the suction operation position, and the component recognition camera 51 is moved.
To perform position recognition. Further, when the mounting head 12 reaches the component mounting position H, the suction nozzle 20 is positioned at the reference point C, and if the position correction is necessary based on the data obtained from the component recognition camera 51, the position correction for that is performed. After the operation, the components are mounted on the board 5.

For small components, as described with reference to FIG. 12, component suction is performed by selecting the first or second suction operation position K, L, and the mounting speed is greatly increased. I have.

On the other hand, for a large part (for example, a part having a side of 5 mm or more), the third suction operation position C is selected to perform the part suction. This is a large part recognition camera 51
This is to prevent a part from deviating from the visual field 51a.

That is, as shown in FIG.
If the large component Z is sucked at the first suction operation position K and the recognition camera 51 recognizes the large component Z at the component recognition position G while moving the suction nozzle 20 to the reference point C, the movement angle of the suction nozzle 20 That is, the attitude of the large component is tilted by θ, that is, ∠KOC in the figure, and an inclination corresponding to the movement angle θ is generated between the reference center line of the visual field 51a of the recognition camera 51 and the reference center line t of the large component Z. As a result, large parts Z
Is inconveniently deviated from the visual field 51a.

On the other hand, the large part Z is shown in FIG.
As shown in (3), if the suction is performed at the third suction operation position C, the component can be recognized in a state where the reference center line t of the large component Z and the reference center line of the visual field 51a match. , The above disadvantages can be solved.

By realizing at least one of the component mounting methods of the first, second and third aspects, a method in which the mounting order is optimized can be obtained. Further, the above-described method of optimizing the mounting order can be systematized to obtain a mounting data creation system. Further, the mounting method of the present invention is stored in a recording medium as a computer program, and the component mounting machine can be operated by using the recording medium.

[0067]

According to the component mounting method of the present invention, the moving amount of the component supply means to the component supply position is achieved by using a mounting head in which a plurality of suction operation positions by the suction nozzle are set and any one of which can be selected. Can be reduced, the moving time can be shortened accordingly, and the mounting speed can be increased. In particular, if the component supply table is pitch-moved in one direction and a plurality of components are sucked from the same component supply means, one of the component supply tables can be picked up.
The amount of movement per cycle can be halved compared to the conventional example, and the mounting speed can be greatly increased.

Further, according to the component mounting apparatus of the present invention, high-speed mounting can be realized by implementing the above method.

[Brief description of the drawings]

FIG. 1 is a diagram for explaining a suction position and a movement of a component supply unit when the positions of a component supply unit at a current mounting point and a next mounting point are considered.

FIG. 2 is a view for explaining a suction position and a movement of a component supply unit when one mounting point is considered in addition to FIG. 1;

FIG. 3 is a diagram for explaining that a moving distance of an XY table is reduced by rotating a head with respect to a nonpolar component;

FIG. 4 is a flowchart showing whether to rotate a head in FIG.

FIG. 5 is a vertical sectional front view of a mounting head in the electronic component mounting apparatus according to one embodiment of the present invention;

FIG. 6 is a cross-sectional plan view taken along the line II of FIG. 1;

FIG. 7 is an explanatory diagram of a position switching state of the suction nozzle in the embodiment.

FIG. 8 is an explanatory diagram of a component supply process according to the embodiment and a conventional example.

FIG. 9 is a longitudinal sectional front view of a mounting head in an electronic component mounting apparatus according to another embodiment of the present invention.

10A and 10B show a mounting head in an electronic component mounting apparatus according to still another embodiment of the present invention, wherein FIG. 10A is a perspective view and FIG. 10B is a schematic side view.

FIG. 11 is a schematic plan view showing still another embodiment of the present invention.

FIG. 12 is an explanatory view showing the component suction method in order of (a) to (e).

FIG. 13 shows two cases of the component recognition method (a).
Explanatory drawing comparing (b)

FIG. 14 is a perspective view showing the overall schematic configuration of a conventional electronic component mounting apparatus.

FIG. 15 is a perspective view showing a component supply unit and a mounting unit in the conventional example.

[Explanation of symbols]

 Reference Signs List 3 Component supply means 5 Board 9 Component supply table 10 Component supply position 11 Rotary table 12 Mounting head 18 Rotating body 19 Nozzle block 20 Suction nozzle 31 Movable shaft 34 Locking claw 38 Nozzle block 51 Component recognition camera K First suction operation position L Second suction operation position C Third suction operation position

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E313 AA02 AA11 AA15 CC03 CC04 CD02 CD05 CD06 DD02 DD03 DD05 DD13 DD31 EE02 EE03 EE05 EE24 EE25 EE37 FF24 FF26

Claims (4)

[Claims] When a mounting head that rotates intermittently on a fixed path stops at a predetermined component supply position, a component is sucked by a suction nozzle provided on the mounting head, and the mounting head stops at a predetermined component mounting position. This is a component mounting method for mounting components picked up at the time of mounting on a substrate, wherein a plurality of suction operation positions are set by suction nozzles in a state where the mounting head is stopped at a component supply position, and a mounting head capable of selecting any of the positions. A first step of selecting a component supply position at which the moving amount of the component supply unit holding the component to be mounted next and moving the component supply unit and moving the component supply unit toward the component suction position; And a second step of selecting a suction nozzle position corresponding to the component suction position in the first step. 2. When a mounting head that intermittently moves on a fixed path stops at a predetermined component supply position, a component is sucked by a suction nozzle provided on the mounting head, and the mounting head stops at a predetermined component mounting position. This is a component mounting method for mounting components picked up at the time of mounting on a substrate, wherein a plurality of suction operation positions are set by suction nozzles in a state where the mounting head is stopped at a component supply position, and a mounting head capable of selecting any of the positions. First, a component supply position is selected and the component supply unit is moved such that the total amount of movement of the component supply unit holding the component to be mounted is minimized with respect to the component to be mounted in the future.
And a second step of selecting a suction nozzle position corresponding to the component suction position of the first step while the mounting head moves toward the component suction position. 3. When a mounting head that intermittently rotates on a fixed path stops at a predetermined component supply position, a plurality of suction nozzles provided on the mounting head suck components, and the mounting head moves to a predetermined component mounting position. This is a component mounting method for mounting components picked up on the board when stopped at the same time, using a mounting head that can rotate itself with multiple suction nozzles attached, and attributes such as the polarity of the component to be mounted next The rotation of the mounting head during the movement of the mounting head to the component mounting position based on the relative positional relationship on the board with the next mounting point and the component attribute information obtained in the first process. A component mounting method comprising: a second step of determining whether to perform the mounting; and a third step of rotating the mounting head based on the information of the second step. 4. A component mounting machine comprising a suction head for sucking a component by a plurality of suction nozzles, a component supply unit for supplying the component, and an XY table for mounting and positioning a printed circuit board. A component mounting apparatus which mounts at least one component mounting method among the component mounting methods described above.