JP3899950B2 - Electronic component mounting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting method for transferring and mounting an electronic component on a substrate by a transfer head.
[0002]
[Prior art]
A mounting apparatus for mounting electronic components on a board is provided with a component supply unit in which a number of parts feeders such as tape feeders for storing electronic components are arranged in parallel, and electronic components are transferred from these parts feeders by a transfer head. The mounting operation of picking up and transferring and mounting on the substrate is repeated. In this mounting operation, vacuum suction is widely used as a means for holding electronic components.
[0003]
In holding an electronic component by this vacuum suction, a malfunction that does not necessarily hold and release the electronic component reliably due to the stability of the vacuum suction state is likely to occur. For example, in the mounting operation of mounting electronic components on the board, the electronic components are detached from the suction nozzle by stopping the vacuum suction, but at this time, the electronic components do not leave the attachment surface of the suction nozzle for some reason. There is. In such a case, the electronic component is not mounted on the substrate in the mounting operation, and a so-called “take-away component” is generated that returns to the component supply unit together with the transfer head without being mounted.
[0004]
[Problems to be solved by the invention]
When the transfer head moves to the next component pick-up operation with the electronic components not mounted in this way held, the suction nozzle cannot pick up the original electronic components to be picked up and is not mounted last time. Move to the board while holding the take-out part of the minute.
[0005]
At this time, if the part shape is different from the correct part to be originally taken out, it is detected that the part is a take-out part by being recognized by the part recognition camera in the process of moving to the board. However, when the shape of the take-out component is similar to the shape of the electronic component to be extracted next, it is not correctly determined whether or not it is a regular component, and erroneous mounting in which the take-out component is mounted as it is occurs. For this reason, a dedicated component detection means is required to reliably detect a take-away component, and it is difficult to reliably detect a take-away component with a simple method in conventional electronic component mounting. There was a point.
[0006]
Therefore, an object of the present invention is to provide an electronic component mounting method capable of reliably detecting a take-out component by a simple method.
[0007]
[Means for Solving the Problems]
The electronic component mounting method according to claim 1 is an electronic component mounting method in which an electronic component is taken out from a component supply unit by a transfer head and transferred and mounted on a substrate, and the electronic component is sucked and held by a suction nozzle of the transfer head. By picking up the pick-up step, a head moving step of moving the transfer head holding the electronic component in the suction nozzle to the substrate, and imaging the electronic component held in the suction nozzle in the moving process of the transfer head from below A component recognition step for recognizing the electronic component, and a component mounting step for mounting the electronic component on the substrate after the component recognition step, wherein the first nozzle angle and the component indicating the θ rotation position of the suction nozzle in the pickup step The combination with the second nozzle angle indicating the θ rotation position of the suction nozzle in the recognition step is the same mounting turn. The first nozzle angle θ1 and the second nozzle angle θ2 are always set to the same angle, the nozzle angle is not changed between pick-up and component recognition, and the first nozzle angle θ1 is set to each mounting turn. By increasing each by π / 2 or an arbitrary angle, the first nozzle angle in the preceding mounting turn is different from the second nozzle angle in the subsequent mounting turn in two consecutive mounting turns by the suction nozzle. In the component recognition step after the pickup step, the direction of the electronic component in the image of the electronic component obtained by imaging and the direction of the electronic component in the image of the electronic component that should be originally acquired in the subsequent mounting turn Based on whether the electronic component held by the suction nozzle is a regular component, the transfer head is Electronic parts when returning from the plate to the component supply section detects takeaway parts back remains attached without leaving from the suction nozzle.
[0008]
According to the present invention, a combination of the first nozzle angle indicating the θ rotation position of the suction nozzle in the pickup process and the second nozzle angle indicating the θ rotation position of the suction nozzle in the component recognition process is determined by the suction nozzle. By combining the first nozzle angle in the preceding mounting turn and the second nozzle angle in the subsequent mounting turn in two consecutive mounting turns, the electronic component on the acquired image in the component recognition process It is possible to determine whether or not an electronic component is different depending on the rotation angle, and it is possible to reliably detect a taken-out component by a simple method.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a functional explanatory diagram of a mounting head of the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. FIG. 4 is an explanatory diagram of the mounting angle in the electronic component mounting method of the embodiment, FIG. 4 is an explanatory diagram of the nozzle angle in the electronic component mounting method of the embodiment of the present invention, and FIG. 5 is the electronic component mounting of the embodiment of the present invention. FIG. 6 and FIG. 7 are process explanatory diagrams of an electronic component mounting method according to an embodiment of the present invention, and FIG. 8 is a component in the electronic component mounting method according to an embodiment of the present invention. It is an image figure of the electronic component for recognition.
[0010]
First, the overall structure of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, a transport path 2 is arranged in the X direction at the center of a base 1. The transport path 2 transports and positions the substrate 3. A component supply unit 4 is disposed on both sides of the conveyance path 2, and a large number of tape feeders 5 are arranged in parallel in the component supply unit 4. The tape feeder 5 feeds the tape holding the electronic component P (see FIG. 2) mounted on the substrate 3 to a pickup position by the transfer head 8 described below by pitch feeding.
[0011]
Y-axis tables 6A and 6B are provided at both ends of the base 1, and X-axis tables 7A and 7B are installed on the Y-axis tables 6A and 6B. The X-axis tables 7A and 7B are equipped with a transfer head 8 and a camera 9 that moves integrally with the transfer head 8, respectively. By driving the Y-axis table 6A and the X-axis table 7A, the upper transfer table 8A and 7B are driven. The loading head 8 and the camera 9 also drive the Y-axis table 6B and the X-axis table 7B, so that the lower transfer head 8 and the camera 9 move in the horizontal direction. By this horizontal movement, the transfer head 8 picks up the electronic component P from the pickup position 5a of the tape feeder 5 by the suction nozzle 8a (see FIG. 2), and transfers and mounts it on the substrate 3 positioned in the transport path 2.
[0012]
A camera 10 is disposed on the movement path of the transfer head 8 from the component supply unit 4 to the substrate 3. When the transfer head 8 holding the electronic component P moves above the camera 10, the camera 10 acquires a scanning image of the electronic component P held by the suction nozzle 8a. The position of the electronic component P is recognized by performing recognition processing on the image data obtained by this imaging, and the position of the transfer head 8 is controlled based on the position recognition result when the electronic component P is mounted on the substrate 3. .
[0013]
Next, the function of the transfer head 8 will be described with reference to FIG. The transfer head 8 includes a suction nozzle 8a for sucking and holding the electronic component P at the lower end. The transfer head 8 is provided with a Z-axis motor and a θ-axis motor 11 (not shown), and the suction nozzle 8a is moved up and down by driving the Z-axis motor to be supplied to the pickup position 5a of the tape feeder 5. P is adsorbed and held. Then, by controlling the drive of the θ-axis motor 11 by the control unit 12, the suction nozzle 8a rotates around the nozzle axis.
[0014]
The θ-axis motor 11 includes an encoder 11a, and a pulse signal from the encoder 11a is sent to the nozzle angle detector 13. The nozzle angle detector 13 detects the nozzle angle indicating the θ rotation position of the suction nozzle 8 a based on this pulse signal, and transmits the detection result to the controller 12. A nozzle angle storage unit 14 is connected to the control unit 12, and the control unit 12 monitors the detection result of the nozzle angle detection unit 13, and based on the nozzle angle stored in the nozzle angle storage unit 14, the θ-axis motor. By controlling 11, the nozzle angle of the suction nozzle 8 a can be set to an arbitrary angle.
[0015]
Next, the relationship between the electronic component mounting operation by the transfer head 8 and the nozzle angle of the suction nozzle 8a will be described with reference to FIGS. As shown in FIG. 3, in the electronic component mounting operation, the transfer head 8 mounted on the X-axis table 7 </ b> A (7 </ b> B) is picked up by the tape feeder 5 by the suction nozzle 8 a of the transfer head 8 in the component supply unit 4. The electronic component P is sucked and held from the position 5a (pickup process).
[0016]
Next, the transfer head 8 holding the electronic component P on the suction nozzle 8a moves toward the substrate 3 (head moving step). In this movement process, when the transfer head 8 moves in the X direction above the camera 10, the electronic component P held by the suction nozzle 8a is imaged from below. The position of the electronic component P is recognized by performing recognition processing on the imaging result (component recognition step). Thereafter, the transfer head 8 moves above the substrate 3, and the electronic component P held by the suction nozzle 8a is mounted on the substrate 3 based on the component recognition result (component mounting step).
[0017]
The nozzle angle indicating the θ rotation position of the suction nozzle 8a in the pickup process, the component recognition process, and the component mounting process is determined in advance for each mounting turn. That is, in the pick-up process, as shown in FIG. 4A, the electronic component P supplied in a predetermined direction into the pick-up position 5a of the tape feeder 5 is the first rotating position of the suction nozzle 8a set in advance. Pickup is performed in accordance with the nozzle angle θ1.
[0018]
In the component recognition step, as shown in FIG. 4B, the suction nozzle 8a holding the electronic component P is moved above the camera 10 in a state where the θ rotation position of the suction nozzle 8a is adjusted to the second nozzle angle θ2. . Further, in the component mounting process, as shown in FIG. 4C, the electronic component P is mounted on the substrate in a state where the θ rotation position of the suction nozzle 8a holding the electronic component P is set to the third nozzle angle θ3. To do.
[0019]
FIG. 5 shows nozzle angle data stored in the nozzle angle storage unit 14 shown in FIG. As shown in FIG. 5A, these nozzle angles θ1, θ2, and θ3 are stored for each mounting turn in which the transfer head 8 takes out the electronic component P from the component supply unit 4 and transfers and mounts it on the substrate 3. ing. In FIG. 5A, the subscripts i and j of θ (i, j) are the distinction between θ1, θ2, and θ3, respectively, and the mounting turn NO. Is shown.
[0020]
FIG. 5B shows an example in which these nozzle angles are set based on one setting pattern. In the setting pattern used here, the first nozzle angle θ1 and the second nozzle angle θ2 are always set to the same angle so that the nozzle angle is not changed between pickup and component recognition. Then, the first nozzle angle θ1 is increased by π / 2 for each mounting turn, and the first nozzle angle θ1 in the mounting turn and the mounting angle of the component on the board 3 (the angle in the mounting direction of the electronic component). The angle αi determined based on the above is used as the third nozzle angle θ3.
[0021]
Next, a mounting operation example based on the nozzle angle setting shown in FIG. 5B will be described with reference to FIGS. FIG. 6A shows a state in which the transfer chip 8 picks up the rectangular chip type electronic component P1 from the pickup position 5a of one tape feeder 5 of the component supply unit 4. Here, in accordance with the nozzle angle data of FIG. 5B, the electronic component P in a posture in which the long side is set in the X direction in the state where the θ rotation position of the suction nozzle 8a is set to the first nozzle angle θ1 = 0. Pick up.
[0022]
After the pickup, the electronic component P held by the transfer head 8 moves upward of the camera 10 as shown in FIG. At this time, the θ rotation position of the suction nozzle 8a is the second nozzle angle θ2 = 0, and the electronic component P moves in the X direction over the camera 10 in the same posture as during pickup. After the component recognition, as shown in FIG. 6C, the electronic component P moves onto the mounting point 3a of the board 3, and the mounting operation for lowering the suction nozzle 8a and landing the electronic component P is performed. Is called. The θ rotation position of the suction nozzle 8a at this time is the third nozzle angle α1, and in this example, α1 = 0, so that the suction nozzle 8a performs the mounting operation while maintaining the θ rotation position in the component recognition process. Do.
[0023]
FIG. 7A shows that the electronic component P is not separated from the suction nozzle 8a for some reason in this mounting operation, and the electronic component P is returned to the component supply unit 4 from the substrate 3 when the transfer head 8 returns to the component supply unit 4. This shows a case where a “take-away part” that returns while adhering to 8a occurs. Even in such a case, in this embodiment, the take-out component is detected by the following method.
[0024]
That is, during the return operation of the transfer head 8, an operation of changing the θ rotation position of the suction nozzle 8a is performed. Here, the first nozzle angle θ1 = π / 2 is set in accordance with the nozzle angle data of FIG. Thereby, the posture of the electronic component P1 brought back by the suction nozzle 8a is changed to a posture in which the long side direction coincides with the Y direction.
[0025]
Thereafter, as shown in FIG. 7B, the transfer head 8 holding the take-out component returns to the component supply unit 4 and picks up the electronic component from the tape feeder 5 to be picked up next. At this time, since the electronic component P1 brought back remains attached to the lower end portion of the suction nozzle 8a, the transfer head 8 cannot pick up the electronic component P2 to be originally picked up. Then, as shown in FIG. 7C, the camera 10 moves to the camera 10 and moves for imaging by the camera 10. Then, the camera 10 acquires an image of the electronic component P <b> 1 with the long side direction held in the Y direction.
[0026]
FIG. 8A shows an image of the electronic component P1 obtained by this imaging. Here, as described above, the long side direction of the electronic component P1 in the image is the Y direction. However, this mounting turn NO. As shown in FIG. 8B, the correct image of the electronic component P2 to be originally acquired in 2 is an image in which the long side direction coincides with the X direction, and thus the electronic component sucked and held by the suction nozzle 8a. P1 is the mounting turn NO. 2, it is detected that there is a high possibility of being a take-out component rather than the electronic component P2 that should be originally acquired.
[0027]
In this way, by setting the nozzle angle in advance, even if the shape of the take-out component is similar to the shape of the electronic component to be taken out next, it is a regular component in the component recognition process after pickup. Therefore, it is possible to correctly determine whether or not the component is mounted as it is and to prevent erroneous mounting. Moreover, it is possible to reliably detect the take-out component by a simple method of setting the nozzle angle without requiring a dedicated component detection means for detecting the take-out component.
[0028]
In the above embodiment, as an example of the nozzle angle setting pattern, first, the first nozzle angle θ1 and the second nozzle angle θ2 are always set to the same angle. If it is preferable to use different nozzle angles in recognition, the first nozzle angle θ1 and the second nozzle angle θ2 may be different. In the present embodiment, an example is shown in which the first nozzle angle θ1 is increased by π / 2 for each mounting turn. However, the present invention is not limited to this, and an arbitrary angle other than π / 2 may be set. . In short, in two consecutive mounting turns, the first nozzle angle θ1 in the preceding mounting turn and the second nozzle angle θ2 in the subsequent mounting turn may be different.
[0029]
【The invention's effect】
According to the present invention, a combination of the first nozzle angle indicating the θ rotation position of the suction nozzle in the pickup process and the second nozzle angle indicating the θ rotation position of the suction nozzle in the component recognition process is determined by the suction nozzle. Since the first nozzle angle in the preceding mounting turn and the second nozzle angle in the subsequent mounting turn are different in two consecutive mounting turns, the rotation angle of the electronic component on the acquired image in the recognition process Thus, it is possible to determine whether or not the electronic component is different, and the take-out component can be reliably detected by a simple method.
[Brief description of the drawings]
FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a functional explanatory diagram of a mounting head of the electronic component mounting apparatus according to an embodiment of the present invention. FIG. 4 is an explanatory diagram of a mounting operation in the electronic component mounting method of the embodiment. FIG. 4 is an explanatory diagram of a nozzle angle in the electronic component mounting method of the embodiment of the invention. FIG. 5 is an electronic component of the embodiment of the invention. FIG. 6 is an explanatory diagram of nozzle angle data of the mounting apparatus. FIG. 6 is a process explanatory diagram of an electronic component mounting method according to an embodiment of the present invention. FIG. 7 is a process explanatory diagram of an electronic component mounting method according to an embodiment of the present invention. FIG. 8 is an image of an electronic component for component recognition in the electronic component mounting method according to the embodiment of the present invention.
3 Substrate 4 Component supply unit 5 Tape feeder 8 Transfer head 8a Adsorption nozzle 10 Camera 13 Nozzle angle detection unit 14 Nozzle angle storage unit θ1 First nozzle angle θ2 Second nozzle angle θ3 Third nozzle angles P, P1, P2 electronic components

Claims (1)

An electronic component mounting method in which an electronic component is taken out from a component supply unit by a transfer head and transferred and mounted on a substrate, wherein the pickup component holds the electronic component by the suction nozzle of the transfer head, and holds the electronic component in the suction nozzle A head moving step of moving the transfer head to the substrate, a component recognition step of recognizing the electronic component by imaging the electronic component held by the suction nozzle from below in the moving process of the transfer head, A component mounting step of mounting the electronic component on a substrate after the component recognition step, and a first nozzle angle indicating a θ rotation position of the suction nozzle in the pickup step and a θ rotation position of the suction nozzle in the component recognition step. The combination of the second nozzle angle shown and the first nozzle angle θ1 in the same mounting turn and the second nozzle angle The nozzle angle θ2 is always set to the same angle, the nozzle angle is not changed between pickup and component recognition, and the first nozzle angle θ1 is increased by π / 2 or an arbitrary angle for each mounting turn. Thus, in two consecutive mounting turns by the suction nozzle, the first nozzle angle in the preceding mounting turn is different from the second nozzle angle in the subsequent mounting turn ,
In the component recognition step after the pick-up step, the suction nozzle is based on the direction of the electronic component in the image of the electronic component obtained by imaging and the direction of the electronic component in the image of the electronic component that should be originally acquired in the subsequent mounting turn. It is determined whether or not the electronic component held by the electronic component is a regular component, and when the transfer head returns from the substrate to the component supply unit, the electronic component does not leave the suction nozzle and returns without being removed. An electronic component mounting method comprising detecting a component.

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