JPS62199322A - Part packaging apparatus - Google Patents

Abstract

PURPOSE:To obtain positive detection of mischuck free from restrictions such as shape and size of parts in a part packaging apparatus for packaging small electronic parts by providing a vision recognition unit including an image pick-up camera and an arithmetic and control unit. CONSTITUTION:According to a command from a CPU 51, a head body 21 is moved, and a chuck member 22 is lowered on a magazine 13 to hold a part 12 by suction, with three parts in total sucked sequentially. Then, the chuck member 22 is moved to a position above an ITV camera 46 in directly opposite relation to the same, and according to the positional information of each part, a processing circuit 47 calculates a correction value at packaging and discriminates whether or not any mischuck exists. Then, the part 12 is selected by a command from a control unit, and is packaged, after corrected in correspondence to the positional error and attitude error. This apparatus, which performs packaging by vision recognition and not by mechanical positioning of parts, is free from restrictions such as marring, size and shape of parts.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to an improvement of a component mounting device suitable for mounting small electronic components.

(Prior Art) Recently, in the production of various electrical devices, a large number of electronic components are mounted on a circuit board. This type of work is carried out by the component mounting device without any manual intervention.

This device uses, for example, a vacuum chuck to pick up parts from a place where predetermined parts are stored, and then moves the large chuck using an XY table or the like to mount the parts at a predetermined position on a circuit board.

For this part supply, there is a device that handles parts one by one, a device that picks up multiple parts at the same time and mounts these parts at the same time, and a rotary table equipped with multiple chucks that sequentially picks up multiple parts at predetermined positions. Various types of devices are used, such as a rotating device that supplies components and sequentially mounts the components on the circuit board at other predetermined positions.

However, in such conventional devices, the positioning of parts is done by mechanical movement, so the shapes and sizes of parts are limited, and if there is a chuck error in which the parts are not picked up in the correct position, etc. There were inconveniences such as damage to parts. To solve this problem, for example, some devices use visual recognition devices to position ICs with narrow lead spacing, but this takes 94 to 6 seconds per lead, resulting in extremely low productivity. There was an inconvenience.

Furthermore, parts chuck errors are detected by relying on the vacuum pressure after the parts are picked up to determine whether the parts are good or not, but there are restrictions on the shape of the part to be picked up. There was an inconvenience that it was difficult to detect the parts.

(Problems to be Solved by the Invention) As mentioned above, conventional component mounting devices perform positioning by mechanical operation, which has the disadvantage that there is a limit to the shape and size of components, and it is not easy to change product types. Furthermore, there are disadvantages in that detection of chuck errors is limited by the shape of the parts.

The present invention has been made to eliminate the above-mentioned disadvantages, and an object of the present invention is to provide a component mounting device that is not limited by the shape and size of components and can also reliably detect chuck errors.

[Structure of the invention]

(Means and Effects for Solving the Problems) The present invention includes a component storage section that accommodates components, a plurality of chuck bodies that hold the components, and a head body that is rotatably supported and supports the chuck bodies. a head drive unit that rotates the head body and moves the chuck body in the front-rear, left-right, and up-down directions; a transport unit that transports the object to be mounted to the mounting position; and an imaging device provided at a predetermined position. A component equipped with a visual recognition section that has a camera and detects the position and orientation of a component at a predetermined position, and an arithmetic control section that corrects the position of the chuck body and detects chuck mistakes based on the detection signal from the visual recognition section. It is a mounting device. Since the visual recognition device performs positioning and detects chuck errors, it is possible to easily respond to changes in the shape and size of parts.

(Example) Hereinafter, details of the present invention will be explained with reference to an illustrated embodiment.

This embodiment includes a base (1), a component storage section (2), a head section (3), a \rad drive section (4), and a transport section (5).
, a visual recognition section (6), and an arithmetic control section (7). The base (1) is formed in the shape of a box with an upper surface having a mounting surface υ, and each part is mounted and mounted on this. The component housing part (2) is a small rectangular parallelepiped chip component α.
It is constructed by installing a plurality of magazines in which the number 2 is arranged and housed. - Rad section (3) is a head drive section (4) which will be described later.
A head body 121) rotatably supported by a head body 121), three chuck bodies attached to the head body 121 to be able to move up and down, a spring body +23) that always urges this downward, and a cam mechanism (not shown). It consists of an elevating body (to) that is moved up and down by the chuck body and engaged with the chuck body.

The lower end of the chuck body @ is opened to serve as a vacuum chuck, and the upper end is connected to a vacuum source. When the elevating body 4 is lowered by a cam mechanism (not shown), it is pushed downward by the spring body (C). Chip parts absorb and release υ. Next, the head drive unit (4) is attached to the horizontal guide body 1) supported on the plane ση, the vertical hoist guide C2 and the θ drive body (toward) supported by this, and the horizontal guide body (not shown). It consists of a horizontal feed mechanism housed in the body 131), a vertical feed mechanism housed in the vertical strap guide body, etc. The above-mentioned head body Qυ is controlled to rotate at a desired angle by the θ driving member ω. The chuck body 4 is conveyed in the left-right direction indicated by the arrow c3!9 along the horizontal guide body 131), and is conveyed in the front-rear direction indicated by the arrow (to) by the vertical guide body 131).

That is, the chaff body (22 is driven in the front-rear direction, left-right direction, and up-down direction, and is rotationally driven together with the head body (21J).Next, the conveyance section (5) has a pair of spaced-apart, opposing, extending laterally. Guide body (41), +411 and a pair of belt conveyors t4s5 installed next to these,
n3, and a positioning stopper (not shown). Then, the circuit board A4 as the object to be mounted is placed on the belt conveyor (4 corners, (c)) and is stopped at a predetermined position by the positioning stopper. When the mounting of the component α2 is completed, the circuit board A4 is placed on the belt conveyor (4 sides, (c)) and stopped by the positioning stopper. The visual recognition unit (6) then passes the belt conveyor (4a
, (1, TV camera I installed near the outside of 43
AQ and processing circuits (four (dedicated) are provided between this and the arithmetic control section (7). Next, the arithmetic control section (7) is the CPU 51).

It consists of six memories, a judgment circuit for chuck error judgment, an arithmetic circuit, and a drive circuit for driving the head drive section (4). These details will be described together with the explanation of their operation.

Next, the operation of the above embodiment will be explained. First, the CPU
The head body Qυ moves according to the command, and the magazine (3)
Once it reaches the top, the chuck body (2) descends and holds one part (13), and reaches the adjacent part α2, and the chuck body (2) moves to the same position to hold each part (13). Once the position information is obtained, it is directly compared with the reference position, and a correction value for mounting is calculated by an arithmetic circuit in the processing circuit (47).The correction value is also determined via the CPU 61). It is input to the circuit and it is determined whether there is a chuck error or not. 3
Immediately after the position information of each component O3 is obtained, the component (13) is transported to the position where it should be installed in accordance with a command between the control devices, correction is made according to the position error and orientation error, and the component α2 is installed. In this example, adhesive is applied in advance to the position where it should be installed in the previous process*, and all that is required is to place the parts there and press them.Once all the parts have been installed in this way, the control The circuit board is sent to the next process according to the command from the device (7).

Note that in this example, explanation was given regarding chip components, but
It may be an irregularly shaped part, and the mechanisms of the head body, head, and drive section are limited to these, and other mechanisms may be used.

〔Effect of the invention〕

As described in detail above, the component mounting device of the present invention does not mechanically position the component, but uses visual recognition to recognize and calculate the position, corrects it, and then mounts the component. There are no restrictions on the shape. Furthermore, since the head body rotates, there are no restrictions on the mounting direction of the parts by calculating the rotation angles in the front, back, left, right, and θ directions. Furthermore, since a plurality of chuck bodies are used, the mounting speed for one piece is as fast as 1 to 2 seconds, and parts of various sizes can be mounted by using chuck bodies of different sizes.

Detection of component chuck errors is also performed by visual recognition, making it possible to mount irregularly shaped chip components.

[Brief explanation of drawings]

(2)...Component storage section, (3)...Head section, (
4)...Head drive section, (5)...Transportation section, (6)
... visual recognition section, (force... calculation control section, a3...
・Parts, tall...head body, @...chuck body, 144...mounted body, (4e...imaging camera. Agent: Patent attorney Yudo Noriyuki Chika Kikuo Takehana

Claims (3)

[Claims] (1) A component accommodating portion that accommodates a plurality of components in an aligned manner, a plurality of chuck bodies that hold the components, and a circumference supported rotatably around an axis extending in the vertical direction and centered on the axis. a head portion having a head body that holds the chuck bodies evenly spaced and movable up and down; a head drive unit that rotates the head body and moves the chuck body in front and rear, left and right, and up and down directions; and the above parts. has a conveyance section that conveys the object to be mounted to a predetermined position, and an image pickup camera provided at a predetermined position, and detects the position and orientation of the component supported by the chuck body facing directly from above at the predetermined position. a visual recognition unit that recognizes and sends out the detected signal as a detection signal; and a visual recognition unit that instructs the head drive unit to correct the position and orientation of the recognized component with respect to the mounting position based on the detection signal, and detects a chuck error. A component mounting device characterized by comprising a calculation control section. (2) The component mounting device according to claim 1, wherein the chuck body is a vacuum chuck. (3) The component mounting device according to claim 1 or 2, wherein the component is an electronic component and the object to be mounted is a circuit board.