CN101573008A - 电子装置壳体及其制造方法 - Google Patents
电子装置壳体及其制造方法 Download PDFInfo
- Publication number
- CN101573008A CN101573008A CNA2008103013811A CN200810301381A CN101573008A CN 101573008 A CN101573008 A CN 101573008A CN A2008103013811 A CNA2008103013811 A CN A2008103013811A CN 200810301381 A CN200810301381 A CN 200810301381A CN 101573008 A CN101573008 A CN 101573008A
- Authority
- CN
- China
- Prior art keywords
- metal body
- electronic device
- case
- fastening structure
- plastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims abstract description 79
- 239000002184 metal Substances 0.000 claims abstract description 79
- 239000004033 plastic Substances 0.000 claims abstract description 65
- 229920003023 plastic Polymers 0.000 claims abstract description 65
- 238000000465 moulding Methods 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims description 24
- 230000004927 fusion Effects 0.000 claims description 11
- 238000001816 cooling Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 5
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 5
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 3
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- 229910000861 Mg alloy Inorganic materials 0.000 claims description 2
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 2
- 229920001577 copolymer Polymers 0.000 claims description 2
- 239000004973 liquid crystal related substance Substances 0.000 claims description 2
- -1 polybutylene terephthalate Polymers 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 4
- 239000000047 product Substances 0.000 description 8
- 238000005242 forging Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 238000005267 amalgamation Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0249—Details of the mechanical connection between the housing parts or relating to the method of assembly
- H04M1/0252—Details of the mechanical connection between the housing parts or relating to the method of assembly by means of a snap-on mechanism
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/08—Means for collapsing antennas or parts thereof
- H01Q1/084—Pivotable antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2258—Supports; Mounting means by structural association with other equipment or articles used with computer equipment
- H01Q1/2266—Supports; Mounting means by structural association with other equipment or articles used with computer equipment disposed inside the computer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/40—Radiating elements coated with or embedded in protective material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Signal Processing (AREA)
- General Engineering & Computer Science (AREA)
- Casings For Electric Apparatus (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Details Of Aerials (AREA)
Abstract
Description
Claims (10)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008103013811A CN101573008B (zh) | 2008-04-28 | 2008-04-28 | 电子装置壳体及其制造方法 |
US12/187,395 US20090265915A1 (en) | 2008-04-28 | 2008-08-07 | Insert-molded cover and method for manufacturing same |
JP2008254691A JP2009266195A (ja) | 2008-04-28 | 2008-09-30 | 電子装置の筐体及びその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008103013811A CN101573008B (zh) | 2008-04-28 | 2008-04-28 | 电子装置壳体及其制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101573008A true CN101573008A (zh) | 2009-11-04 |
CN101573008B CN101573008B (zh) | 2012-05-16 |
Family
ID=41213577
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008103013811A Expired - Fee Related CN101573008B (zh) | 2008-04-28 | 2008-04-28 | 电子装置壳体及其制造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20090265915A1 (zh) |
JP (1) | JP2009266195A (zh) |
CN (1) | CN101573008B (zh) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7976758B2 (en) | 2008-06-27 | 2011-07-12 | Shenzhen Futaihong Precision Industry Co., Ltd. | Method of making a shell of portable electronic device |
CN103563171A (zh) * | 2011-08-12 | 2014-02-05 | 夏普株式会社 | 结构物的制造方法 |
CN103975006A (zh) * | 2011-09-20 | 2014-08-06 | 提克纳有限责任公司 | 用于电子装置的包覆成型的复合结构 |
CN104752818A (zh) * | 2013-12-30 | 2015-07-01 | 上海德门电子科技有限公司 | 一种载体为模内注塑机壳的pds天线及其制作方法 |
CN106462199A (zh) * | 2016-09-30 | 2017-02-22 | 北京小米移动软件有限公司 | 金属壳体的制作方法及金属壳体、电子设备 |
CN108539371A (zh) * | 2018-04-02 | 2018-09-14 | Oppo广东移动通信有限公司 | 天线组件的加工方法、天线组件及电子设备 |
CN113442365A (zh) * | 2021-06-18 | 2021-09-28 | 富钰精密组件(昆山)有限公司 | 注塑成型方法、金属外壳的制作方法及金属外壳 |
CN113783986A (zh) * | 2020-06-10 | 2021-12-10 | 宏达国际电子股份有限公司 | 无线通讯装置及壳体总成 |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101573009A (zh) * | 2008-04-28 | 2009-11-04 | 富准精密工业(深圳)有限公司 | 电子装置壳体及其制造方法 |
KR20120073618A (ko) | 2010-12-27 | 2012-07-05 | 삼성전자주식회사 | 액정모듈 조립체 및 이를 가지는 디스플레이 장치 |
US8772650B2 (en) * | 2011-01-10 | 2014-07-08 | Apple Inc. | Systems and methods for coupling sections of an electronic device |
JP5450551B2 (ja) * | 2011-09-29 | 2014-03-26 | 富士フイルム株式会社 | 放射線撮影用カセッテ |
US9124680B2 (en) * | 2012-01-19 | 2015-09-01 | Google Technology Holdings LLC | Managed material fabric for composite housing |
JP5903632B2 (ja) * | 2012-09-07 | 2016-04-13 | パナソニックIpマネジメント株式会社 | 板状の筐体部材、及び、そのインサート射出成形方法 |
JP6072597B2 (ja) * | 2013-04-25 | 2017-02-01 | シャープ株式会社 | 樹脂成形品 |
US20150072594A1 (en) * | 2013-09-09 | 2015-03-12 | Apple Inc. | Method for detecting a polishing compound and related system and computer program product |
US9983622B2 (en) | 2013-10-31 | 2018-05-29 | Hewlett-Packard Development Company, L.P. | Method of applying a transfer film to metal surfaces |
JP6264905B2 (ja) * | 2014-01-31 | 2018-01-24 | 住友電気工業株式会社 | 複合部材、及び複合部材の製造方法 |
CN105522684B (zh) * | 2014-12-25 | 2018-11-09 | 比亚迪股份有限公司 | 一种金属-树脂复合体及其制备方法和一种电子产品外壳 |
KR101596316B1 (ko) * | 2015-02-03 | 2016-02-22 | 몰렉스 엘엘씨 | 전자기기용 카드 트레이 및 이를 이용한 트레이 캐리어 조립체 |
JP6457907B2 (ja) * | 2015-09-11 | 2019-01-23 | 富士通クライアントコンピューティング株式会社 | 情報処理装置及び情報処理システム |
EP3504946B1 (en) * | 2017-01-23 | 2022-08-10 | Hewlett-Packard Development Company, L.P. | Casings of electronic devices |
EP4329442A1 (en) * | 2021-06-03 | 2024-02-28 | Samsung Electronics Co., Ltd. | Electronic device comprising housing, and housing manufacturing method |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3016331B2 (ja) * | 1993-09-07 | 2000-03-06 | 富士通株式会社 | 電子機器筐体の製造方法 |
US5574628A (en) * | 1995-05-17 | 1996-11-12 | The Whitaker Corporation | Rigid PCMCIA frame kit |
JP3106120B2 (ja) * | 1997-05-16 | 2000-11-06 | 三菱電機株式会社 | 携帯型電子機器 |
US6012493A (en) * | 1997-09-11 | 2000-01-11 | Atd Corporation | Bonded metal-plastic composite structures |
US6574096B1 (en) * | 2000-09-29 | 2003-06-03 | Apple Computer, Inc. | Use of titanium in a notebook computer |
CN1400858A (zh) * | 2001-07-30 | 2003-03-05 | 宏达国际股份有限公司 | 可携式电子产品的外壳及其制法 |
JP2003202938A (ja) * | 2002-01-09 | 2003-07-18 | Matsushita Electric Ind Co Ltd | 携帯型情報処理装置 |
US7118697B2 (en) * | 2002-07-02 | 2006-10-10 | Adc Dsl Systems Inc. | Method of molding composite objects |
US8367210B2 (en) * | 2002-11-08 | 2013-02-05 | Taisei Plas Co., Ltd. | Composite article of aluminum alloy with resin and method for production thereof |
JP2005010699A (ja) * | 2003-06-23 | 2005-01-13 | Toppan Printing Co Ltd | ディスプレイユニット用ホルダ |
JP4213634B2 (ja) * | 2004-06-24 | 2009-01-21 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 通信機能を備えた携帯情報端末 |
JP2006210526A (ja) * | 2005-01-26 | 2006-08-10 | Matsushita Electric Works Ltd | 電磁波シールド筐体 |
US7385806B2 (en) * | 2005-07-27 | 2008-06-10 | Kim Liao | Combination housing of a notebook computer |
CN2824508Y (zh) * | 2005-09-09 | 2006-10-04 | 英业达股份有限公司 | 固定机构 |
JP2008003714A (ja) * | 2006-06-20 | 2008-01-10 | Toshiba Corp | 部品結合構造および電子機器 |
JP2007223323A (ja) * | 2007-02-23 | 2007-09-06 | Taisei Plas Co Ltd | 電子機器筐体とその成形方法 |
CN101372143A (zh) * | 2007-08-24 | 2009-02-25 | 深圳富泰宏精密工业有限公司 | 嵌件成型品 |
-
2008
- 2008-04-28 CN CN2008103013811A patent/CN101573008B/zh not_active Expired - Fee Related
- 2008-08-07 US US12/187,395 patent/US20090265915A1/en not_active Abandoned
- 2008-09-30 JP JP2008254691A patent/JP2009266195A/ja active Pending
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7976758B2 (en) | 2008-06-27 | 2011-07-12 | Shenzhen Futaihong Precision Industry Co., Ltd. | Method of making a shell of portable electronic device |
CN101616560B (zh) * | 2008-06-27 | 2012-05-23 | 深圳富泰宏精密工业有限公司 | 金属壳体及其制造方法 |
CN103563171A (zh) * | 2011-08-12 | 2014-02-05 | 夏普株式会社 | 结构物的制造方法 |
CN103975006A (zh) * | 2011-09-20 | 2014-08-06 | 提克纳有限责任公司 | 用于电子装置的包覆成型的复合结构 |
CN103975006B (zh) * | 2011-09-20 | 2016-03-09 | 提克纳有限责任公司 | 用于电子装置的包覆成型的复合结构 |
CN104752818A (zh) * | 2013-12-30 | 2015-07-01 | 上海德门电子科技有限公司 | 一种载体为模内注塑机壳的pds天线及其制作方法 |
CN106462199A (zh) * | 2016-09-30 | 2017-02-22 | 北京小米移动软件有限公司 | 金属壳体的制作方法及金属壳体、电子设备 |
CN108539371A (zh) * | 2018-04-02 | 2018-09-14 | Oppo广东移动通信有限公司 | 天线组件的加工方法、天线组件及电子设备 |
CN108539371B (zh) * | 2018-04-02 | 2021-03-02 | Oppo广东移动通信有限公司 | 天线组件的加工方法、天线组件及电子设备 |
CN113783986A (zh) * | 2020-06-10 | 2021-12-10 | 宏达国际电子股份有限公司 | 无线通讯装置及壳体总成 |
CN113783986B (zh) * | 2020-06-10 | 2024-04-09 | 宏达国际电子股份有限公司 | 无线通讯装置及壳体总成 |
CN113442365A (zh) * | 2021-06-18 | 2021-09-28 | 富钰精密组件(昆山)有限公司 | 注塑成型方法、金属外壳的制作方法及金属外壳 |
Also Published As
Publication number | Publication date |
---|---|
US20090265915A1 (en) | 2009-10-29 |
CN101573008B (zh) | 2012-05-16 |
JP2009266195A (ja) | 2009-11-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20091104 Assignee: Fuyu Precision Components (Kunshan) Co.,Ltd. Assignor: Fuzhun Precision Industry (Shenzhen) Co.,Ltd.|Foxconn Technology Co.,Ltd. Contract record no.: 2015990000067 Denomination of invention: Electronic device shell and manufacture method thereof Granted publication date: 20120516 License type: Exclusive License Record date: 20150213 |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120516 |