CN101563964A - 框架加强结构和包括所述结构的电子设备 - Google Patents
框架加强结构和包括所述结构的电子设备 Download PDFInfo
- Publication number
- CN101563964A CN101563964A CNA2007800447992A CN200780044799A CN101563964A CN 101563964 A CN101563964 A CN 101563964A CN A2007800447992 A CNA2007800447992 A CN A2007800447992A CN 200780044799 A CN200780044799 A CN 200780044799A CN 101563964 A CN101563964 A CN 101563964A
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- CN
- China
- Prior art keywords
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
- H04M1/185—Improving the rigidity of the casing or resistance to shocks
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Casings For Electric Apparatus (AREA)
- Telephone Set Structure (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP332667/2006 | 2006-12-08 | ||
JP2006332667A JP4821592B2 (ja) | 2006-12-08 | 2006-12-08 | 枠体の補強構造及び該構造を備えた電子機器 |
PCT/JP2007/073256 WO2008069152A1 (ja) | 2006-12-08 | 2007-11-30 | 枠体の補強構造及び該構造を備えた電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101563964A true CN101563964A (zh) | 2009-10-21 |
CN101563964B CN101563964B (zh) | 2012-11-14 |
Family
ID=39492047
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007800447992A Expired - Fee Related CN101563964B (zh) | 2006-12-08 | 2007-11-30 | 框架加强结构和包括所述结构的电子设备 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8446740B2 (zh) |
EP (1) | EP2091313A4 (zh) |
JP (1) | JP4821592B2 (zh) |
CN (1) | CN101563964B (zh) |
WO (1) | WO2008069152A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014198196A1 (en) * | 2013-06-09 | 2014-12-18 | Shenzhen Byd Auto R&D Company Limited | Shell and preparing method and use of the same |
CN108947541A (zh) * | 2018-06-28 | 2018-12-07 | 东莞信柏结构陶瓷股份有限公司 | 3d陶瓷后盖及其制备方法 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9335788B2 (en) * | 2011-09-19 | 2016-05-10 | Samsung Electronics Co., Ltd. | Slim-type display module fixing apparatus for portable terminal |
KR101376623B1 (ko) * | 2012-02-17 | 2014-03-20 | 엘지전자 주식회사 | 이동 단말기 |
JP5800784B2 (ja) * | 2012-10-23 | 2015-10-28 | 三菱電機株式会社 | 空気調和機 |
KR102044471B1 (ko) * | 2013-01-14 | 2019-11-12 | 삼성전자주식회사 | 변형 방지를 위한 프레임 조립 구조 및 이것을 갖는 전자 장치 |
CN106550566B (zh) * | 2015-09-16 | 2022-07-26 | 联想(北京)有限公司 | 具有刚性容置空间的可弯曲装置及电子设备 |
ES2762116T3 (es) * | 2017-03-01 | 2020-05-22 | Guangdong Oppo Mobile Telecommunications Corp Ltd | Conjunto de carcasa, dispositivo electrónico y teléfono móvil que tienen el mismo |
CN111482503A (zh) * | 2019-09-05 | 2020-08-04 | 东莞市利锦电子有限公司 | 一种低内应力的胶铁及其制造方法 |
JP7218714B2 (ja) * | 2019-11-26 | 2023-02-07 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2245322Y (zh) * | 1995-06-05 | 1997-01-15 | 电子工业部第五十四研究所 | 螺装式板金结构机柜 |
USD434771S (en) * | 1999-10-05 | 2000-12-05 | Honda Tsushin Kogyo Co., Ltd. | Upper metal cover for compact flash card |
USD442964S1 (en) * | 1999-10-05 | 2001-05-29 | Honda Tsushin Kogyo Co., Ltd. | Lower metal cover for compact flash card |
JP2001337741A (ja) * | 2000-05-26 | 2001-12-07 | Toshiba Corp | 電子機器 |
JP4553283B2 (ja) * | 2000-08-25 | 2010-09-29 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 保持枠および画像表示装置 |
DE10054081A1 (de) * | 2000-10-31 | 2002-05-08 | Heraeus Gmbh W C | Verfahren zur Herstellung eines Metallträgerrahmens, Metallrägerrahmen und seine Verwendung |
TW540553U (en) * | 2000-12-04 | 2003-07-01 | Chi Mei Optoelectronics Corp | Structure reinforced exterior frame for planar display device |
JP2003078220A (ja) * | 2001-06-18 | 2003-03-14 | Canon Inc | 樹脂成形基板 |
JP3691008B2 (ja) * | 2001-09-17 | 2005-08-31 | Tdk株式会社 | Pcカード用ケース及びpcカード |
JP3835353B2 (ja) * | 2002-06-04 | 2006-10-18 | 松下電器産業株式会社 | カード接続用アダプタ |
CN2598260Y (zh) * | 2003-01-16 | 2004-01-07 | 熊猫电子集团有限公司 | 嵌装式钣金结构通信机柜 |
JP2004228238A (ja) | 2003-01-21 | 2004-08-12 | Mitsubishi Electric Corp | 筐体及び筐体の製造方法 |
JP2005066635A (ja) * | 2003-08-22 | 2005-03-17 | Kobayashi Kinzoku Kogyo Kk | ばね性金属部品の製造方法 |
JP2005303136A (ja) * | 2004-04-14 | 2005-10-27 | Mitsubishi Electric Corp | 防水筐体 |
JP2006050204A (ja) * | 2004-08-04 | 2006-02-16 | Advanex Inc | スライドユニット及び携帯製品 |
TW200617498A (en) * | 2004-11-26 | 2006-06-01 | Sanyo Electric Co | Display device, portable machine and manufacturing method of display device |
DE102006024652B4 (de) | 2005-05-24 | 2012-11-08 | Samsung Electronics Co., Ltd. | Bauelement mit TAB-Packung und zugehöriges Herstellungsverfahren |
CN1874361B (zh) * | 2005-06-03 | 2012-03-07 | 深圳富泰宏精密工业有限公司 | Sim卡固定装置 |
-
2006
- 2006-12-08 JP JP2006332667A patent/JP4821592B2/ja not_active Expired - Fee Related
-
2007
- 2007-11-30 CN CN2007800447992A patent/CN101563964B/zh not_active Expired - Fee Related
- 2007-11-30 US US12/517,976 patent/US8446740B2/en not_active Expired - Fee Related
- 2007-11-30 EP EP07849962.1A patent/EP2091313A4/en not_active Withdrawn
- 2007-11-30 WO PCT/JP2007/073256 patent/WO2008069152A1/ja active Application Filing
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014198196A1 (en) * | 2013-06-09 | 2014-12-18 | Shenzhen Byd Auto R&D Company Limited | Shell and preparing method and use of the same |
CN108947541A (zh) * | 2018-06-28 | 2018-12-07 | 东莞信柏结构陶瓷股份有限公司 | 3d陶瓷后盖及其制备方法 |
CN108947541B (zh) * | 2018-06-28 | 2021-10-19 | 东莞信柏结构陶瓷股份有限公司 | 3d陶瓷后盖及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
US20090268424A1 (en) | 2009-10-29 |
EP2091313A4 (en) | 2014-10-15 |
WO2008069152A1 (ja) | 2008-06-12 |
CN101563964B (zh) | 2012-11-14 |
JP4821592B2 (ja) | 2011-11-24 |
EP2091313A1 (en) | 2009-08-19 |
US8446740B2 (en) | 2013-05-21 |
JP2008147407A (ja) | 2008-06-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: LENOVO INNOVATION CO., LTD. (HONGKONG) Free format text: FORMER OWNER: NEC CORP. Effective date: 20141209 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; TO: HONG KONG, CHINA |
|
TR01 | Transfer of patent right |
Effective date of registration: 20141209 Address after: Hongkong, China Patentee after: LENOVO INNOVATIONS Co.,Ltd.(HONG KONG) Address before: Tokyo, Japan Patentee before: NEC Corp. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121114 Termination date: 20171130 |