CN101540366A - 热交换装置 - Google Patents

热交换装置 Download PDF

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Publication number
CN101540366A
CN101540366A CN200910128030A CN200910128030A CN101540366A CN 101540366 A CN101540366 A CN 101540366A CN 200910128030 A CN200910128030 A CN 200910128030A CN 200910128030 A CN200910128030 A CN 200910128030A CN 101540366 A CN101540366 A CN 101540366A
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CN
China
Prior art keywords
heat
electrode
exchange device
connecting area
heat absorption
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200910128030A
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English (en)
Chinese (zh)
Inventor
堀尾裕磨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Corp
Original Assignee
Yamaha Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Corp filed Critical Yamaha Corp
Publication of CN101540366A publication Critical patent/CN101540366A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN200910128030A 2008-03-19 2009-03-17 热交换装置 Pending CN101540366A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP071723/08 2008-03-19
JP2008071723 2008-03-19

Publications (1)

Publication Number Publication Date
CN101540366A true CN101540366A (zh) 2009-09-23

Family

ID=41087741

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200910128030A Pending CN101540366A (zh) 2008-03-19 2009-03-17 热交换装置

Country Status (3)

Country Link
US (1) US20090236087A1 (ja)
JP (1) JP2009260303A (ja)
CN (1) CN101540366A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103427559A (zh) * 2012-05-23 2013-12-04 瑞美技术有限责任公司 用于电机中的永久磁体的导热涂层
CN107710430A (zh) * 2015-02-19 2018-02-16 马勒国际有限公司 用于热电模块的导热电绝缘连接件
CN108963062A (zh) * 2017-05-25 2018-12-07 格芯公司 基于热电效应的鳍基设备

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2440838B1 (en) * 2009-06-10 2016-09-28 Shirish Devidas Deshpande Customizable, long lasting, thermally efficient, environment friendly, solid-state lighting apparatuses
JP5589672B2 (ja) * 2010-08-20 2014-09-17 富士通株式会社 熱電変換装置およびその製造方法
KR101283184B1 (ko) * 2011-10-19 2013-07-05 엘지이노텍 주식회사 핫플레이트 및 핫플레이트 제조 방법
DE102012214702A1 (de) 2012-08-17 2014-02-20 Behr Gmbh & Co. Kg Thermoelektrische Vorrichtung
DE102012214704A1 (de) 2012-08-17 2014-03-27 Behr Gmbh & Co. Kg Thermoelektrisches Modul
DE102012214701A1 (de) 2012-08-17 2014-02-20 Behr Gmbh & Co. Kg Thermoelektrische Vorrichtung
JP2014086623A (ja) * 2012-10-25 2014-05-12 Furukawa Co Ltd 熱電変換モジュール
JP6297025B2 (ja) * 2013-03-21 2018-03-20 国立大学法人長岡技術科学大学 熱電変換素子
EP3035396A4 (en) * 2013-09-25 2017-04-19 Lintec Corporation Heat-conductive adhesive sheet, manufacturing method for same, and electronic device using same
JP6592996B2 (ja) * 2014-07-09 2019-10-23 ヤマハ株式会社 熱電発電装置
DE102016202435A1 (de) * 2016-02-17 2017-08-17 Mahle International Gmbh Wärmeübertrager
CN108604870B (zh) * 2016-02-18 2020-03-31 三菱电机株式会社 热电转换模块及其制造方法
KR101981855B1 (ko) * 2017-06-29 2019-05-23 울산과학기술원 3d 프린팅 열전 소재용 잉크, 3d 프린팅된 열전 소재를 포함하는 열전 소자 및 그 제조방법
KR102095243B1 (ko) * 2018-04-04 2020-04-01 엘지이노텍 주식회사 열전소자
US11980098B2 (en) 2019-02-12 2024-05-07 Lg Innotek Co., Ltd. Thermoelectric module
US11723275B2 (en) * 2019-02-12 2023-08-08 Lg Innotek Co., Ltd. Thermoelectric module
KR102220946B1 (ko) * 2019-06-18 2021-02-26 엘지이노텍 주식회사 열전소자
US20230124140A1 (en) * 2020-03-23 2023-04-20 Lg Innotek Co., Ltd. Thermoelectric device
FR3117676A1 (fr) * 2020-12-16 2022-06-17 Valeo Systemes Thermiques Module thermoélectrique, échangeur thermique et procédé de fabrication associé

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5713208A (en) * 1996-04-03 1998-02-03 Amana Refrigeration Inc. Thermoelectric cooling apparatus
KR100317829B1 (ko) * 1999-03-05 2001-12-22 윤종용 반도체 제조 공정설비용 열전냉각 온도조절장치
US6759586B2 (en) * 2001-03-26 2004-07-06 Kabushiki Kaisha Toshiba Thermoelectric module and heat exchanger
AT7382U1 (de) * 2003-03-11 2005-02-25 Plansee Ag Wärmesenke mit hoher wärmeleitfähigkeit
JP4404127B2 (ja) * 2007-09-28 2010-01-27 ヤマハ株式会社 熱電モジュール用基板およびこの基板を用いた熱電モジュール
JP2009295878A (ja) * 2008-06-06 2009-12-17 Yamaha Corp 熱交換装置
KR101195674B1 (ko) * 2009-01-29 2012-10-30 야마하 가부시키가이샤 열교환 유닛
JP2011035305A (ja) * 2009-08-05 2011-02-17 Toyota Industries Corp 熱交換器

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103427559A (zh) * 2012-05-23 2013-12-04 瑞美技术有限责任公司 用于电机中的永久磁体的导热涂层
CN107710430A (zh) * 2015-02-19 2018-02-16 马勒国际有限公司 用于热电模块的导热电绝缘连接件
CN108963062A (zh) * 2017-05-25 2018-12-07 格芯公司 基于热电效应的鳍基设备
CN108963062B (zh) * 2017-05-25 2022-07-05 格芯(美国)集成电路科技有限公司 基于热电效应的鳍基设备

Also Published As

Publication number Publication date
JP2009260303A (ja) 2009-11-05
US20090236087A1 (en) 2009-09-24

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Application publication date: 20090923