CN101530009A - 穿孔加工用垫板和穿孔加工方法 - Google Patents
穿孔加工用垫板和穿孔加工方法 Download PDFInfo
- Publication number
- CN101530009A CN101530009A CNA200780037238XA CN200780037238A CN101530009A CN 101530009 A CN101530009 A CN 101530009A CN A200780037238X A CNA200780037238X A CN A200780037238XA CN 200780037238 A CN200780037238 A CN 200780037238A CN 101530009 A CN101530009 A CN 101530009A
- Authority
- CN
- China
- Prior art keywords
- perforation processing
- support board
- lubricating layer
- amino acid
- soluble resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/08—Means for treating work or cutting member to facilitate cutting
- B26D7/088—Means for treating work or cutting member to facilitate cutting by cleaning or lubricating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/16—Perforating by tool or tools of the drill type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B41/00—Boring or drilling machines or devices specially adapted for particular work; Accessories specially adapted therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/127—Lubricants, e.g. during drilling of holes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T408/00—Cutting by use of rotating axially moving tool
- Y10T408/03—Processes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T408/00—Cutting by use of rotating axially moving tool
- Y10T408/55—Cutting by use of rotating axially moving tool with work-engaging structure other than Tool or tool-support
- Y10T408/567—Adjustable, tool-guiding jig
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Drilling And Boring (AREA)
Abstract
Description
Claims (9)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP279025/2006 | 2006-10-12 | ||
JP2006279025A JP4856511B2 (ja) | 2006-10-12 | 2006-10-12 | 孔あけ加工用当て板及び孔あけ加工方法 |
PCT/JP2007/069772 WO2008044710A1 (fr) | 2006-10-12 | 2007-10-10 | Panneau-support pour processus de perforation et procédé de perforation |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101530009A true CN101530009A (zh) | 2009-09-09 |
CN101530009B CN101530009B (zh) | 2011-06-15 |
Family
ID=39282903
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200780037238XA Expired - Fee Related CN101530009B (zh) | 2006-10-12 | 2007-10-10 | 穿孔加工用垫板和穿孔加工方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20100111623A1 (zh) |
JP (1) | JP4856511B2 (zh) |
KR (1) | KR20090078795A (zh) |
CN (1) | CN101530009B (zh) |
TW (1) | TWI410194B (zh) |
WO (1) | WO2008044710A1 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105538384A (zh) * | 2015-12-17 | 2016-05-04 | 山西宇皓新型光学材料有限公司 | 一种切割亚克力板的方法 |
CN108778650A (zh) * | 2016-03-14 | 2018-11-09 | 三菱瓦斯化学株式会社 | 钻孔用盖板和使用其的钻孔加工方法 |
CN112662314A (zh) * | 2020-12-10 | 2021-04-16 | 深圳市柳鑫实业股份有限公司 | 一种环保型pcb钻孔用盖板及其制备方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI423749B (zh) * | 2011-09-26 | 2014-01-11 | Uniplus Electronics Co Ltd | 用於印刷電路板之鑚孔輔助板 |
TWI560049B (en) * | 2014-10-15 | 2016-12-01 | Uniplus Electronics Co Ltd | A drilling entry board |
CN106493522B (zh) * | 2016-12-08 | 2017-12-22 | 中国人民解放军第五七二一工厂 | 一种内孔粘套引孔制孔方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2828129B2 (ja) * | 1993-06-07 | 1998-11-25 | 三菱瓦斯化学株式会社 | プリント配線板の孔明け加工法 |
EP1018858A4 (en) * | 1998-04-06 | 2006-03-08 | Mitsubishi Paper Mills Ltd | METHOD AND DEVICE FOR PRODUCING PCB |
JP3368892B2 (ja) * | 1998-06-18 | 2003-01-20 | 泰雄 福谷 | 水溶性切削液 |
JP2000218599A (ja) * | 1999-01-27 | 2000-08-08 | Unitika Ltd | 孔あけ加工用樹脂シート及び該シートを用いる孔あけ加工法 |
JP4127341B2 (ja) * | 1999-11-19 | 2008-07-30 | 株式会社神戸製鋼所 | 潤滑性樹脂被覆金属板 |
JP4342119B2 (ja) * | 2000-04-06 | 2009-10-14 | 株式会社神戸製鋼所 | 孔開け加工時の保護用あて板及びそれを使用したプリント配線基板の孔開け加工方法 |
US6866450B2 (en) * | 2001-10-31 | 2005-03-15 | Mitsubishi Gas Chemical Company, Inc. | Entry sheet for drilling and method for drilling hole |
JP4010142B2 (ja) * | 2001-12-13 | 2007-11-21 | 三菱瓦斯化学株式会社 | ドリル孔明け用エントリーシート |
JP2003225892A (ja) * | 2002-02-05 | 2003-08-12 | Mitsubishi Gas Chem Co Inc | ドリル孔明け方法 |
JP4541133B2 (ja) * | 2004-12-27 | 2010-09-08 | 昭和電工パッケージング株式会社 | 小口径孔あけ加工用エントリーボードと小口径孔あけ加工方法 |
JP4541132B2 (ja) * | 2004-12-27 | 2010-09-08 | 昭和電工パッケージング株式会社 | 小口径孔あけ加工用エントリーボードと小口径孔あけ加工方法 |
-
2006
- 2006-10-12 JP JP2006279025A patent/JP4856511B2/ja active Active
-
2007
- 2007-10-09 TW TW096137851A patent/TWI410194B/zh not_active IP Right Cessation
- 2007-10-10 WO PCT/JP2007/069772 patent/WO2008044710A1/ja active Application Filing
- 2007-10-10 KR KR1020097007394A patent/KR20090078795A/ko active IP Right Grant
- 2007-10-10 US US12/445,292 patent/US20100111623A1/en not_active Abandoned
- 2007-10-10 CN CN200780037238XA patent/CN101530009B/zh not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105538384A (zh) * | 2015-12-17 | 2016-05-04 | 山西宇皓新型光学材料有限公司 | 一种切割亚克力板的方法 |
CN108778650A (zh) * | 2016-03-14 | 2018-11-09 | 三菱瓦斯化学株式会社 | 钻孔用盖板和使用其的钻孔加工方法 |
CN108778650B (zh) * | 2016-03-14 | 2019-07-26 | 三菱瓦斯化学株式会社 | 钻孔用盖板和使用其的钻孔加工方法 |
CN112662314A (zh) * | 2020-12-10 | 2021-04-16 | 深圳市柳鑫实业股份有限公司 | 一种环保型pcb钻孔用盖板及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
US20100111623A1 (en) | 2010-05-06 |
JP4856511B2 (ja) | 2012-01-18 |
WO2008044710A1 (fr) | 2008-04-17 |
KR20090078795A (ko) | 2009-07-20 |
TWI410194B (zh) | 2013-09-21 |
TW200829105A (en) | 2008-07-01 |
JP2008098437A (ja) | 2008-04-24 |
CN101530009B (zh) | 2011-06-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SHOWA DENKO PACKAGING K.K. Free format text: FORMER OWNER: SHOWA DENKO PACKAGING K.K. SHOWA DENKO K.K. Effective date: 20140307 |
|
TR01 | Transfer of patent right |
Effective date of registration: 20140307 Address after: Tokyo, Japan, Japan Patentee after: Ohtomo Chemical Ins Corp. Patentee after: Showa Denko Packaging K. K. Address before: Tokyo, Japan, Japan Patentee before: Ohtomo Chemical Ins Corp. Patentee before: Showa Denko Packaging K. K. Patentee before: Showa Denko K. K. |
|
TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110615 Termination date: 20141010 |
|
EXPY | Termination of patent right or utility model |