CN101527286B - 半导体模块及其制造方法 - Google Patents

半导体模块及其制造方法 Download PDF

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CN101527286B
CN101527286B CN2009101182487A CN200910118248A CN101527286B CN 101527286 B CN101527286 B CN 101527286B CN 2009101182487 A CN2009101182487 A CN 2009101182487A CN 200910118248 A CN200910118248 A CN 200910118248A CN 101527286 B CN101527286 B CN 101527286B
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elastic
lead
elastic protrusion
base plate
semiconductor chip
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CN101527286A (zh
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成田明仁
佐藤直也
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Seiko Epson Corp
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Abstract

一种半导体模块，包括：形成有集成电路(12)的半导体芯片(10)、与半导体芯片(10)上形成的集成电路(12)电连接的电极(14)、具有位于电极(14)上的开口且形成在半导体芯片(10)上的绝缘膜(16)、配置在绝缘膜(16)上且与绝缘膜(16)相反一侧的表面为凸曲面的弹性突起(18)、从电极(14)上延伸至弹性突起上的布线(20)、形成有与布线(20)在弹性突起上的部分接触的导线(26)的弹性基板(24)、在半导体芯片(10)的形成弹性突起的面与弹性基板的形成导线的面之间保持间隔的粘接剂(22)。弹性基板具有通过弹性变形而形成的第一凹部(28)。导线的与布线接触的接触部形成在第一凹部的表面上。由此提高电连接的可靠性。

Description

半导体模块及其制造方法
技术领域
本发明涉及一种半导体模块及其制造方法。
背景技术
以往，公知有一种将半导体芯片搭载到柔性基板上的称为COF的安装方式(日本专利第3284916号公报)。在该方式中，只能使半导体芯片的焊盘与柔性基板的导线在对置的小的表面之间电连接，难以确保可靠性。此外，在日本特开2007-42867号公报中，与本发明相关，公开了在树脂突起上形成端子的内容。
发明内容
本发明的目的在于提高电连接的可靠性。
(1)本发明的半导体模块，其特征在于，包括：
形成有集成电路的半导体芯片；
形成在所述半导体芯片上并与所述集成电路电连接的电极；
具有位于所述电极上的开口且形成在所述半导体芯片上的绝缘膜；
配置在所述绝缘膜上且与所述绝缘膜相反一侧的表面为凸曲面的弹性突起；
从所述电极上延伸至所述弹性突起上的布线；
形成有与所述布线在所述弹性突起上的部分接触的导线的弹性基板；以及
在所述半导体芯片的形成有所述弹性突起的面与所述弹性基板的形成有所述导线的面之间保持间隔的粘接剂，
所述弹性基板具有通过弹性变形而形成的第一凹部，
所述导线的与所述布线接触的接触部形成在所述第一凹部的表面上。
根据本发明，由于导线和布线在弹性基板上形成的第一凹部的表面接触，因此，与在平坦面接触时相比接触面积增大，电连接的可靠性高。另外，由于通过来自弹性基板和弹性突起双方的弹性力使导线与布线压接，因此进一步提高了可靠性。
(2)在该半导体模块中，也可以构成如下：
所述弹性突起具有通过弹性变形而形成的第二凹部，
所述布线的与所述导线接触的接触部形成在所述第二凹部的表面上。
(3)在本发明的半导体模块中，也可以构成如下：
所述弹性突起的弹性模量比所述弹性基板的弹性模量高。
(4)本发明的半导体模块的制造方法，其特征在于，包括：
(a)将半导体装置通过粘接剂搭载到形成有导线的弹性基板上的工序；然后，(b)使所述粘接剂硬化，以保持半导体芯片与所述弹性基板的间隔的工序，
所述半导体装置具备：
形成有集成电路的所述半导体芯片；
形成在所述半导体芯片上并与所述集成电路电连接的电极；
具有位于所述电极上的开口且形成在所述半导体芯片上的绝缘膜；
配置在所述绝缘膜上且与所述绝缘膜相反一侧的表面为凸曲面的弹性突起；以及
从所述电极上延伸至所述弹性突起上的布线，
在所述(a)工序中，在所述半导体装置与所述弹性基板之间施加按压力，将所述布线的在所述弹性突起上的部分按压到所述导线上，通过所述按压力，借助所述导线使所述弹性基板弹性变形而形成第一凹部，并且使所述导线在所述第一凹部的表面延展。
根据本发明，由于使导线在第一凹部的表面延展，因此，与布线的接触面积增大，电连接可靠性提高。这里，由于弹性突起的表面为凸曲面，因此在使导线延展时不易断裂。而且，因弹性突起的弹性力而应力被分散，这也能防止导线断裂。
(5)在该半导体模块的制造方法中，也可以是：通过所述按压力，借助所述布线使所述弹性突起弹性变形而形成第二凹部。
附图说明
图1是表示本发明实施方式的半导体模块所使用的半导体装置的俯视图；
图2是图1所示的半导体装置的II-II线剖视图；
图3是说明本发明实施方式的半导体模块的制造方法的图；
图4是说明本发明实施方式的半导体模块的制造方法的图；
图5是说明本发明实施方式的半导体模块的图。
图中：1-半导体装置；10-半导体芯片；12-集成电路；14-电极；16-绝缘膜；18-弹性突起；20-布线；22-粘接剂；24-弹性基板；26-导线；28-第一凹部；30-第二凹部。
具体实施方式
(半导体装置)
图1是表示本发明实施方式的半导体模块所使用的半导体装置的俯视图。图2是图1所示的半导体装置的II-II线剖视图。
半导体装置1具有半导体芯片10。半导体芯片10具有矩形面。在半导体芯片10上形成有集成电路12(晶体管等)。在半导体芯片10上，按照与集成电路12电连接的方式形成有多个电极14。电极14排列成一列或多列(平行的多列)。电极14沿半导体芯片10的矩形面的边(例如长方形的长边)排列(平行排列)。电极14通过内部布线(未图示)与集成电路12电连接。在半导体芯片10上，按照使电极14的至少一部分露出的方式形成了具有位于电极14上的开口的绝缘膜16(例如钝化膜)。绝缘膜16可仅由例如SiO2或SiN等无机材料形成。绝缘膜16形成在集成电路12的上方。
在半导体芯片10(绝缘膜16上)设置有弹性突起18。图示了沿半导体芯片10的矩形面的边(例如长方形的长边)延伸(平行延伸)的弹性突起18，多个弹性突起18平行排列。弹性突起18具有弹性变形的性质。作为弹性突起18的材料，例如可使用聚酰亚胺树脂、硅酮改性聚酰亚胺树脂、环氧树脂、硅酮改性环氧树脂、苯并环丁烯(BCB：benzocyclobutene)、聚苯并恶唑(PBO：polybenzoxazole)、丙烯酸树脂、硅酮树脂、酚醛树脂等。
弹性突起18形成为长条状。弹性突起18与沿延长方向的轴AX正交的剖面如图2所示呈弓形(由圆弧和连接其两端的弦构成的图形)。弹性突起18在该剖面中，弓形的弦配置在绝缘膜16上。弹性突起18的表面(朝向与半导体芯片10相反侧的面)为凸曲面。弹性突起18的表面是以弹性突起18的长轴为旋转轴，使位于旋转轴的周围且与旋转轴平行的直线旋转而描绘出的旋转面。弹性突起18的表面呈将圆柱以与其中心轴平行的平面截断而得到的形状的曲面(圆柱的旋转面的一部分)的形状。弹性突起18是按照下面比上面宽的方式逐渐扩展的形状。
在半导体芯片10上形成有多条布线20。作为布线20的材料，可使用Au、Ti、TiW、W、Cr、Ni、Al、Cu、Pd或无铅焊锡等。多条布线20形成为从电极14上到达弹性突起18上。多条布线20彼此相邻之间保持间隔地形成在弹性突起18的上面。一个弹性突起18上形成有多条布线20。布线20按照与沿着弹性突起18的延长方向的轴AX交叉的方式延伸。布线20从电极14上经绝缘膜16到达弹性突起18上。在弹性突起18上，布线20的表面成为随着弹性突起18的表面的曲面。布线20可与电极14直接接触，也可在两者之间介入导电膜(未图示)。布线20越过弹性突起18的与电极14相反一侧的端部而到达绝缘膜16上。
(半导体模块的制造方法)
图3～图4是说明本发明实施方式的半导体模块的制造方法的图。
在本实施方式中，将上述的半导体装置1通过粘接剂22搭载到弹性基板24上。弹性基板24具有弹性变形的性质，可以是由树脂等构成的柔性基板。在弹性基板24上形成有导线26。导线26的与延长方向正交的宽度W1比布线20的与延长方向正交的宽度W2小(参照图5)。
导线26被配置为与沿着弹性突起18的延长方向的轴AX(参照图1)交叉延伸。在半导体装置1与弹性基板24之间施加按压力。通过按压力使弹性突起18上的多条布线20与导线26接触。
如图4所示，通过按压力，并借助导线26使弹性基板24弹性变形而形成第一凹部28，此时，使导线26在第一凹部28的表面上延展。另外，如图5所示，通过按压力，并借助布线20使弹性突起18弹性变形而形成第二凹部30。弹性基板24和弹性突起18均弹性变形。并且，弹性突起18的位于彼此相邻的布线20之间的部分与弹性基板24以弹性力相互密接(参照图5)。
根据本实施方式，由于使导线26在第一凹部28的表面延展，因此，与布线20的接触面积增大，电连接可靠性提高。这里，由于弹性突起18的表面为凸曲面，因此在使导线26延展时其不易断裂。而且，因弹性突起18的弹性力而应力被分散，这也能防止导线26断裂。
通过按压力，粘接剂22在半导体装置1和弹性基板24之间流动(例如排出)。如图5所示，通过热量使粘接剂22硬化收缩，且维持按压力直至粘接剂22硬化。在粘接剂22硬化之后解除按压力。由此制造半导体模块。
(半导体模块)
图5是说明本发明实施方式的半导体模块的图。半导体模块具有上述的半导体装置1和弹性基板24。弹性基板24支承导线26的与弹性突起18相反的一侧。导线26与布线20的位于弹性突起18上的部分接触。
弹性基板24具有通过弹性变形而形成的多个第一凹部28。第一凹部28的内面是曲面，成为与弹性突起18的弹性变形后的表面对应的形状。多条导线26的与多条布线20的接触部分别形成在多个第一凹部28的表面上。
弹性突起18具有通过弹性变形而形成的多个第二凹部30(参照图5)。多条布线20的与多条导线26的接触部分别形成在多个第二凹部30的表面上。弹性突起18的位于彼此相邻的布线20之间的部分与弹性基板24以弹性力相互密接。弹性突起18的弹性模量比弹性基板24的弹性模量高。
粘接剂22在半导体芯片10的形成弹性突起18的面与弹性基板24的形成多条导线26的面之间保持间隔。粘接剂22硬化收缩。粘接剂22内存在因硬化时的收缩引起的残余应力。
根据本实施方式，由于导线26和布线20在弹性基板24上形成的第一凹部28的表面接触，因此，与在平坦面接触时相比接触面积增大，电连接的可靠性高。另外，由于通过来自弹性基板24和弹性突起28双方的弹性力而使导线26与布线20压接，因此进一步提高了可靠性。另外，导线26的与第一凹部28对置的面为曲面。因此，对于导线26的与弹性基板24的接触面而言，与平坦面时相比，形成为曲面(参照图5)则面积增大，因此导线26向弹性基板24的散热性提高。
另外，由于在彼此相邻的布线20之间弹性突起18与弹性基板24密接，因此两者之间的界面仅为一个，所以水分的侵入路径少。在这方面，若两者之间介入粘接剂22，则界面成为两个，水分的侵入路径多，因此容易发生离子迁移，但根据本实施方式能防止该迁移。另外，由于不介入粘接剂22，从而能够从布线29之间排除粘接剂22通常含有的容易离子化的物质(钠、钾等碱金属(第1族元素中除氢之外的元素)或氟、氯、溴等卤族元素(第17族元素))，由此也能防止发生离子迁移。进而，由于粘接剂22若硬化则会收缩，因此若在弹性突起18与弹性基板24之间存在硬化了的粘接剂22则界面容易剥离，但在本发明中，不介入粘接剂22，而且通过弹性力使弹性突起18与弹性基板24密接，因此不易发生两者的剥离。此外，作为具有半导体模块的电子设备，可列举笔记本电脑或移动电话等。
本发明并非限定于上述实施方式，可进行各种变形。例如，本发明包括与实施方式中说明的构成实质上相同的构成(例如，功能、方法和结果相同的构成、或目的和结果相同的构成)。另外，本发明包括替换了实施方式中说明的构成的非本质的部分后的构成。另外，本发明包括能够发挥与实施方式中说明的构成相同的作用效果的构成和实现相同目的的构成。另外，本发明包括在实施方式中说明的构成上添加了公知技术的构成。

Claims (5)

1.一种半导体模块，其特征在于，包括：
形成有集成电路的半导体芯片；
形成在所述半导体芯片上并与所述集成电路电连接的电极；
具有位于所述电极上的开口且形成在所述半导体芯片上的绝缘膜；
配置在所述绝缘膜上且与所述绝缘膜相反一侧的表面为凸曲面的弹性突起；
从所述电极上延伸至所述弹性突起上的布线；
形成有与所述布线在所述弹性突起上的部分接触的导线的弹性基板；以及
在所述半导体芯片的形成有所述弹性突起的面与所述弹性基板的形成有所述导线的面之间保持间隔的粘接剂，
所述弹性基板具有通过弹性变形而形成的第一凹部，
所述导线具有与所述布线接触的接触部，所述接触部形成在所述第一凹部的表面上。
2.根据权利要求1所述的半导体模块，其特征在于，
所述弹性突起具有通过弹性变形而形成的第二凹部，
所述布线的与所述导线相接触的接触部形成在所述第二凹部的表面上。
3.根据权利要求1或2所述的半导体模块，其特征在于，
所述弹性突起的弹性模量比所述弹性基板的弹性模量高。
4.一种半导体模块的制造方法，其特征在于，包括：
(a)将半导体装置通过粘接剂搭载到形成有导线的弹性基板上的工序；然后，(b)使所述粘接剂硬化，以保持半导体芯片与所述弹性基板的间隔的工序，
所述半导体装置具备：
形成有集成电路的所述半导体芯片；
形成在所述半导体芯片上并与所述集成电路电连接的电极；
具有位于所述电极上的开口且形成在所述半导体芯片上的绝缘膜；
配置在所述绝缘膜上且与所述绝缘膜相反一侧的表面为凸曲面的弹性突起；以及
从所述电极上延伸至所述弹性突起上的布线，
在所述(a)工序中，在所述半导体装置与所述弹性基板之间施加按压力，将所述布线的在所述弹性突起上的部分按压到所述导线上，通过所述按压力，借助所述导线使所述弹性基板弹性变形而形成第一凹部，并且使所述导线在所述第一凹部的表面延展。
5.根据权利要求4所述的半导体模块的制造方法，其特征在于，
通过所述按压力，借助所述布线使所述弹性突起弹性变形而形成第二凹部。
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