CN101513142B - 电子元件放置设备和电子元件安装方法 - Google Patents

电子元件放置设备和电子元件安装方法 Download PDF

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Publication number
CN101513142B
CN101513142B CN200780033718.9A CN200780033718A CN101513142B CN 101513142 B CN101513142 B CN 101513142B CN 200780033718 A CN200780033718 A CN 200780033718A CN 101513142 B CN101513142 B CN 101513142B
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CN
China
Prior art keywords
electronic component
paste
film
plate
bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN200780033718.9A
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English (en)
Chinese (zh)
Other versions
CN101513142A (zh
Inventor
冈本一男
西昭一
森田健
日吉正宜
友保和彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006245228A external-priority patent/JP4797895B2/ja
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority claimed from PCT/JP2007/067779 external-priority patent/WO2008032755A1/en
Publication of CN101513142A publication Critical patent/CN101513142A/zh
Application granted granted Critical
Publication of CN101513142B publication Critical patent/CN101513142B/zh
Active legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping
CN200780033718.9A 2006-09-11 2007-09-06 电子元件放置设备和电子元件安装方法 Active CN101513142B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2006245227A JP4797894B2 (ja) 2006-09-11 2006-09-11 電子部品搭載装置および電子部品実装方法
JP245228/2006 2006-09-11
JP245227/2006 2006-09-11
JP2006245228A JP4797895B2 (ja) 2006-09-11 2006-09-11 電子部品搭載装置および電子部品実装方法
PCT/JP2007/067779 WO2008032755A1 (en) 2006-09-11 2007-09-06 Electronic component placing apparatus and electronic component mounting method

Publications (2)

Publication Number Publication Date
CN101513142A CN101513142A (zh) 2009-08-19
CN101513142B true CN101513142B (zh) 2011-04-06

Family

ID=39289032

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200780033718.9A Active CN101513142B (zh) 2006-09-11 2007-09-06 电子元件放置设备和电子元件安装方法

Country Status (2)

Country Link
JP (1) JP4797894B2 (ja)
CN (1) CN101513142B (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011243683A (ja) * 2010-05-17 2011-12-01 Fujitsu Ltd 電子部品の実装方法、電子部品の製造方法および電子部品、電子部品の製造装置
JP2015109397A (ja) * 2013-12-06 2015-06-11 パナソニックＩｐマネジメント株式会社 電子部品実装方法及び電子部品実装システム
CN103781342B (zh) * 2014-02-20 2016-04-13 无锡江南计算技术研究所 单颗bga产品倒装贴片装置及其使用方法
CN104640359B (zh) * 2014-12-31 2017-06-30 广州兴森快捷电路科技有限公司 Pcb钻孔装置及pcb定位结构
JP2019009470A (ja) * 2018-10-09 2019-01-17 パナソニックＩｐマネジメント株式会社 実装構造体
CN112992703A (zh) * 2019-12-18 2021-06-18 恒诺微电子(嘉兴)有限公司 一种芯片焊接工艺

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005305806A (ja) * 2004-04-21 2005-11-04 Nsk Ltd ペースト膜形成装置
EP1445995B1 (en) * 1996-12-27 2007-02-14 Matsushita Electric Industrial Co., Ltd. Method of mounting an electronic component on a circuit board and system for carrying out the method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10247700A (ja) * 1997-03-05 1998-09-14 Canon Inc 電子部品及びその実装方法並びにマスク
JPH11251729A (ja) * 1998-03-05 1999-09-17 Matsushita Electric Ind Co Ltd 粘着性材料の転写装置および転写方法
JP3714097B2 (ja) * 2000-03-21 2005-11-09 松下電器産業株式会社 バンプ付電子部品の実装方法
JP4744689B2 (ja) * 2000-12-11 2011-08-10 パナソニック株式会社 粘性流体転写装置及び電子部品実装装置
JP3855824B2 (ja) * 2002-04-02 2006-12-13 松下電器産業株式会社 電子部品実装装置および電子部品実装方法ならびにペースト供給装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1445995B1 (en) * 1996-12-27 2007-02-14 Matsushita Electric Industrial Co., Ltd. Method of mounting an electronic component on a circuit board and system for carrying out the method
JP2005305806A (ja) * 2004-04-21 2005-11-04 Nsk Ltd ペースト膜形成装置

Also Published As

Publication number Publication date
JP2008066624A (ja) 2008-03-21
JP4797894B2 (ja) 2011-10-19
CN101513142A (zh) 2009-08-19

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