CN1146042C - 凸点的形成方法 - Google Patents

凸点的形成方法 Download PDF

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CN1146042C
CN1146042C CNB981159532A CN98115953A CN1146042C CN 1146042 C CN1146042 C CN 1146042C CN B981159532 A CNB981159532 A CN B981159532A CN 98115953 A CN98115953 A CN 98115953A CN 1146042 C CN1146042 C CN 1146042C
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circuit board
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井上康介
也
米田达也
辅
木本良辅
道
铃木高道
一
铃木顺一
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Hitachi Ltd
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Abstract

在半导体封装体的凸点形成方法中，将半导体芯片安装到柔性基板上。使用导电性糊剂将导电性球暂时固定在与设置在上述柔性基板上的半导体芯片进行电连接的连接端子上。将暂时固定了上述导电性球的上述柔性基板卷绕到卷轴上。其次，从卷轴抽出柔性基板，对暂时固定了导电性球的柔性基板进行加热，以形成凸点。将形成了凸点的柔性基板卷绕到卷轴上。通过清洗、切割柔性基板形成半导体封装体。

Description

凸点的形成方法
本发明涉及在半导体的封装体的形态中，在BGA(球状栅格阵列Ball Grid Array)封装体、CSP(芯片尺寸封装Chip Size Package或芯片比例封装Chip Scale Package)等将焊锡球作为与安装基板的连接材料使用的封装体(以下简单地称为封装体)上安装以焊锡球或金球为代表的导电性球，称为凸点(bump)的连接用的凸起的形成方法。
近年来，在输入输出端子多的LSI中使用的半导体封装基板等中，在其下表面设置以栅格状或锯齿栅格状配置的多个端子电极，采用通过凸点来连接与其对应的电路基板的电路电极的结构。
作为形成焊锡凸点的方法，有在特开平8-115916及特开平9-063737等中公开的方法。在该公开公报中公开了下述的技术：通过将被吸附夹具以真空方式吸引的焊锡球浸在焊剂(flux)液槽中来对焊锡球供给焊剂，将该焊锡球转移到在半导体封装基板上形成的连接端子(pad)上，通过对利用焊剂的粘接力粘接支撑(暂时固定)焊锡球的电子电路基板进行加热(回流reflow)来形成焊锡球。并公开了将焊锡球转移安装到半导体封装基板上的装置。此外，在加热方面，使用市场上一般流通的回流炉即可。
但是，上述的现有方法存在下述问题。
最近以来，广泛地使用带状的柔性基板作为半导体封装基板。在图12中示出使用这样的柔性基板的半导体封装体的例子。在图12中，3是柔性基板，15是焊锡凸点，4是形成焊锡凸点的连接端子(pad)，11是半导体芯片，19是将连接端子4与半导体芯片11连接起来的引线。18是封装树脂，用来固定半导体芯片11和柔性基板3。17是作成口字形的形状的增强板。
在使用上述的柔性基板的半导体封装体的情况下，在形成凸点时，为了使用对于现有形状的非柔性基板的制造装置，预先将该半导体封装基板切割成长方形的小单位。而且，在形成凸点后的组装半导体封装体的最终工序中，为了将半导体封装基板切割成最小单位，需要二次切割工序。因此，存在形成凸点的成本高的问题。
再有，为了将已切割成长方形的半导体封装基板放入转移安装焊锡球的装置、即焊锡球安装器或加热用的回流炉中，必须通过将刚性低且操作难的半导体封装基板固定在刚性高的专用运载夹具上使操作变得容易。对于专用运载夹具，要求高的尺寸精度，而且固定到专用运载夹具上的操作主要用人工来进行。这样，在以往就存在下述问题：由于要准备数目与制品的生产量相称且高价的专用运载夹具，以及进行将切割成长方形的半导体封装基板固定到专用运载夹具上的操作，故形成凸点的成本很高。
为了解决这样的问题，可考虑采取下述的措施：在对焊锡球安装器14和回流炉进行了改造，使其能分别连续地供给带状的半导体封装基板的基础上，使焊锡球安装器和回流炉一体化，通过将结束了焊锡球的转移安装的半导体封装基板直接放入回流炉中，可不需要专用运载夹具和用于形成凸点的基板切割工序。
但是，在该方法中，在进行焊锡球的转移安装的焊锡球安装器中发生故障、装置的运转停止的情况下，要防止在回流炉中因处于加工停顿状态中而处于高温下的半导体封装基板受到损伤是困难的。此外，一般来说，焊锡球的转移安装所需要的时间随重试(retry)操作的有无等而变化，但加热时间的变动与焊锡球及连接到半导体封装基板的半导体受到的热能的总量的变动有关，这成为凸点形成不良的原因。因此，在不容许形成凸点中的加热时间的变动的情况下使焊锡球安装器和回流炉一体化这一点，从两装置的特点来看是不合适的，目前未能实现这一点。
在本发明中，解决了上述问题，对于带状的半导体封装基板，实现了不使用专用运载夹具并且不需要用于形成凸点的切割工序的凸点形成方法。
本发明的一个目的在于，提供能用简单的制造、组装方法在半导体衬底上形成凸点的凸点形成方法。
本发明的另一个目的在于，提供可靠性良好的、在半导体衬底上形成凸点的凸点形成方法。
本发明的再一个目的在于，提供能以低成本在半导体衬底上形成凸点的凸点形成方法。
为了达到上述目的，在用卷轴将带状的半导体封装基板供给焊锡球安装器并转移安装了焊锡球后，将该基板暂时卷绕到卷轴上。使转移安装焊锡球时使用的焊剂等固定液的粘接力比焊锡球的质量和运送时焊锡球受到的各种加速度的积大，以免被转移安装且暂时处于固定状态的焊锡球落下。再有，在将带状的半导体封装基板卷绕到卷轴上时，在上述基板间插入隔离物来防止机械接触，以免被转移安装且暂时处于固定状态的焊锡球由于机械接触而产生位置偏移。
如按照本发明，则能在不需要形成凸点用的切割工序及不使用专用运载夹具的情况下且以低成本来实现对于作为半导体封装基板而广泛使用的带状的柔性基板的凸点形成。而且，可将普通的焊锡球安装器及回流炉的改造限于最小限度。
图1是示出本发明的凸点形成流程的图。
图2是示出以真空方式将焊锡球吸附到安装头上的方法的局部剖面图。
图3是示出将焊剂供给以真空方式吸附到安装头上的焊锡球的方法的局部剖面图。
图4是示出在柔性基板上安装焊锡球的方法的局部剖面图。
图5是示出在实施了焊锡球的安装后的卷绕柔性基板的方法的图。
图6是示出隔离带的一部分的斜视图。
图7是示出将实施了焊锡球的安装后的柔性基板与隔离带一起卷绕到基板卷绕轴上的状态的剖面图。
图8是示出将形成了凸点的柔性基板和隔离带卷绕到基板卷绕轴上的状态的剖面图。
图9是示出将安装了焊锡球的柔性基板加热以形成凸点的方法的图。
图10是示出柔性基板的例子的图。
图11是示出柔性基板的另一个例子的图。
图12是示出使用了柔性基板的半导体封装体的例子的图。
以下，根据附图详细地说明本发明的实施例。再有，由于图中的同一符号示出同一部位，故有时省略重复的说明。此外，关于使用焊锡球作为导电性球的一例及使用焊剂作为固定液的一例的凸点形成方法进行记述，但本凸点形成方法不限定于该组合，也可使用焊锡球以外的金属制的球、用导电体覆盖的球作为导电性球。此外，也可使用焊锡糊剂(paste)或混有导电性粒子的粘接剂作为代替焊剂的固定液。
图1是示出本发明的凸点形成方法的基本流程的图。在图1中，6是在最终工序中进行了切割后对成为半导体封装体的柔性基板进行卷绕的基板卷绕轴，16是半导体封装体。首先，在a中，将半导体芯片连接到柔性基板上，对其进行树脂封装。接着，如b中所示，将柔性基板卷绕到基板卷绕轴6上。其次，在c中从基板卷绕轴6抽出柔性基板，安装焊锡球。将安装了焊锡球的柔性基板如d中那样卷绕到基板卷绕轴6上。其次，在e中从该基板卷绕轴6抽出已安装了焊锡球的柔性基板，对其进行加热。利用加热和冷却，在柔性基板上形成凸点，如f所示，将其卷绕到基板卷绕轴6上。其后，通过清洗、切割柔性基板，完成半导体封装体16。再有，在清洗中，也可在卷绕到基板卷绕轴6上的状态下进行清洗，也可从该基板卷绕轴6抽出柔性基板来对其进行清洗。此外，也有这样的情况：根据顾客的要求，在不进行切割、即在卷绕到基板卷绕轴6上的状态下出厂，在顾客那边根据需要将其切割。
以下，更详细地说明图1中示出的流程。从图2至图4示出图1c中示出的安装焊锡球的方法。在各图中，1是焊锡球，2是焊剂，3是柔性基板，4是在柔性基板上形成的连接端子，5是安装头，11是半导体芯片。
在图2中示出将焊锡球1供给安装头5的方法。将焊锡球1的底面置于网格状薄片的球容器上，利用通过网格状薄片的向上的气流将焊锡球1向上吹。安装头5位于球容器的上方，利用真空吸引将焊锡球1吸引到各个球吸引口上，这样的球吸引口有很多个。
图3示出对于已真空吸引的焊锡球1的焊剂供给方法。预先将焊剂2涂敷在焊剂板上。以真空方式吸引了焊锡球1的安装头5接近并接触该焊剂板上的焊剂面。由此，将焊剂2供给各焊锡球1。
图4示出将焊锡球1安装在柔性基板上的方法。以真空方式吸引了焊锡球1的安装头5接近与半导体芯片11连接的柔性基板3，按压各焊锡球1，通过向大气开放或相反地给予正压来截断真空，利用焊剂2的粘接力将焊锡球1安装在柔性基板3上的连接端子4上。再者，在没有正确地将焊锡球1安装在连接端子4上的情况下，可预先在安装头5的内部设置顶出各焊锡球1的销钉和推出该销钉的机构，通过利用这些销钉和机构，能实现焊锡球1的可靠的安装。
焊剂2的供给，也可在安装焊锡球1之前在连接端子4上通过一般的丝网印刷法、储存斗转移法或散布(dispensing)法来进行。作为焊剂2，必须使用其粘接力比焊锡球的质量和将焊锡球1安装在柔性基板3上后可能受到的加速度的积大的焊剂，以免焊锡球因其后的运送中的冲击及操作者的操作不良等而落下。
必要的焊剂粘接力随所使用的装置或焊锡球尺寸的变化而变化，但通过选择100gf以上的值，在一般的环境下可完全防止焊锡球的落下。再有，此时的焊剂2的粘接力的测定，可用例如MALCOM社制的糊剂粘接试验机来测定。如果焊剂2是导电型糊剂，则可以使用其它类型的糊剂，例如可以使用焊锡糊剂、包含混有导电性粒子的粘接剂的固定液。
在这里，在图10和图11中示出本实施例中的柔性基板3。柔性基板3用聚酰亚胺材料等的耐热性及电绝缘性优良的材料制成，在其上形成了金属布线及连接端子4。此外，12是半导体芯片连接部，13是柔性基板3运送中使用的穿孔。图10中示出的柔性基板3是在宽度方向配置了1个半导体芯片连接部12的例子，图11中示出的柔性基板3是在宽度方向配置了2个半导体芯片连接部12的例子。
在图1的c中，如图1的d及图5所示，将安装了焊锡球1的柔性基板3连续地卷绕到基板卷绕轴6上。此时，为了防止因焊锡球1与其它部件的接触而使其位置在连接端子4上发生偏移，或焊锡球1从连接端子4上脱落，在柔性基板3间卷绕隔离带7，以防止与焊锡球1的机械接触。将隔离带7卷绕到隔离带卷轴8上，与基板卷绕轴6同步地送出隔离带7。图6中以斜视图示出隔离带7的一部分。此外，在图7中以用图5的A-B切断的局部剖面图示出在基板卷绕轴6上交替地卷绕了安装了焊锡球1的柔性基板和隔离带7的情况。这样，隔离带7的宽度与柔性基板3大致相同，在与柔性基板3重叠的状态下，在隔离带7的两面上及在避开柔性基板3上的焊锡球1的位置上具有多个凸起9，该隔离带7具有「H」字形的剖面。此外，该凸起9的高度比焊锡球1的高度及与柔性基板3的相对的面连接的半导体芯片11的从柔性基板3的面伸出的量高。因此，隔离带7不与柔性基板3的焊锡球1接触，可防止焊锡球1从柔性基板3上的连接端子4发生偏移或脱落。再有，由于隔离带的材料用廉价的塑料等就足够了，也不会处于高温下，故可重复使用。在担心发生静电的情况下，也可使用导电型塑料作为上述材料。
在图1的d中，连续地对卷绕到基板卷绕轴6的柔性基板3进行加热。在图9中示出的加热工序中，在安装了焊锡球1后，从卷绕了柔性基板3和隔离带7的基板卷绕轴6抽出柔性基板3，送到回流炉等加热炉中进行加热，使焊锡球1熔融。然后，通过其后的放置冷却，使熔融了的焊锡球1固化，形成凸点。如图9所示，在从基板卷绕轴6抽出柔性基板3时，与柔性基板3一起卷绕的隔离带7由隔离带卷轴8来卷绕。从加热炉10出来的形成了凸点的柔性基板3与下面的工序的情况相一致，可以再次卷绕到基板卷绕轴6上，也可以每隔一定尺寸进行切割，但在本实施例中，如图1的f及图9所示，示出了再次卷绕到与刚才的基板卷绕轴6不同的另一个基板卷绕轴6b上的例子。在所形成的凸点及柔性基板3的损伤成为问题的情况下，在卷绕到基板卷绕轴6b上时也使用隔离带7b是有效的。在图8中示出图9的用C-D线切断的局部剖面图，该图示出在形成凸点后将形成了凸点15的柔性基板3卷绕到另外的基板卷绕轴6b上的状态。该隔离带7b基本上与将焊锡球1安装在柔性基板3上后使用的隔离带相同，但凸起9的高度必须大于所形成的凸点15的高度。
根据需要，在卷绕到基板卷绕轴6b上的原有状态下将已卷绕的柔性基板3放入到批量式的清洗机中，除去焊剂等的残余。
此外，为了在用加热形成了凸点后直接进行柔性基板3的清洗，也可在图3中示出的加热炉10后插入市场上出售的连续清洗装置。此外，如图1的f、g、h所示，也可从基板卷绕轴6抽出柔性基板3，对其连续地进行清洗，其后再次卷绕到基板卷绕轴6上。在这些情况下，都在清洗后将柔性基板3切割成小单位。
相反，也可考虑在将形成了凸点后的柔性基板切割成小单位后用批量式的清洗装置对焊剂等残余进行清洗。
用本实施例可解决现有的凸点形成中的问题，对于带状的半导体封装基板，可实现不使用专用运载夹具等并且不需要形成凸点用的基板的切割工序的凸点形成方法。

Claims (11)

1.一种用于形成大规模集成电路封装体的凸点的形成方法，其特征在于，包括下述步骤：
将半导体芯片安装到柔性印刷电路板上的步骤；
使用从焊剂、焊锡焊剂、包含混有导电性粒子的粘接剂的固定液的任一种中选择的导电性糊剂，将导电性球暂时固定在与设置在上述柔性印刷电路板上的连接端子上从而与所述半导体芯片电连接的步骤；
将暂时固定了上述导电性球的上述柔性印刷电路板卷绕到卷轴上的步骤；
从卷轴抽出暂时固定了上述导电性球的上述柔性印刷电路板，对暂时固定了上述导电性球的上述柔性印刷电路板进行加热，以形成凸点的步骤；
将形成了上述凸点的上述柔性印刷电路板卷绕到卷轴上的步骤；以及
通过清洗、切割上述柔性印刷电路板形成大规模集成电路封装体的步骤。
2.如权利要求1所述的凸点形成方法，其特征在于：
在将暂时固定了上述导电性球的上述印刷电路板卷绕到卷轴上时，在各圈上述印刷电路板之间插入隔离带。
3.如权利要求2所述的凸点形成方法，其特征在于：
从上述已卷绕的卷轴将上述印刷电路板与上述隔离带分离，将上述印刷电路板供给加热工序。
4.如权利要求3所述的凸点形成方法，其特征在于：
在加热工序后，将上述印刷电路板卷绕到上述卷轴上。
5.如权利要求4所述的凸点形成方法，其特征在于：
在加热工序后将上述印刷电路板卷绕到上述卷轴上时，在上述印刷电路板的各圈之间插入另一个隔离带。
6.如权利要求4所述的凸点形成方法，其特征在于：
在加热工序后而且在将上述印刷电路板卷绕到上述卷轴上前，清洗上述印刷电路板。
7.如权利要求4所述的凸点形成方法，其特征在于：
在加热工序后，在已将上述印刷电路板卷绕到上述卷轴上的状态下进行清洗。
8.如权利要求3所述的凸点形成方法，其特征在于：
在加热工序后，将上述印刷电路板切割成小单位。
9.如权利要求8所述的凸点形成方法，其特征在于：
在切割了上述印刷电路板后进行清洗。
10.如权利要求2所述的凸点形成方法，其特征在于：
将上述隔离带的剖面形状作成「H」状，使与导电性粒子相对的凹部的深度大于导电性球的直径。
11.如权利要求5所述的凸点形成方法，其特征在于：
将上述隔离带的剖面形状作成「H」状，使与加热工序中形成的凸点相对的凹部的深度大于上述凸点的高度。
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