CN101501874A - 发光器件及照明装置 - Google Patents
发光器件及照明装置 Download PDFInfo
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- CN101501874A CN101501874A CNA2007800297571A CN200780029757A CN101501874A CN 101501874 A CN101501874 A CN 101501874A CN A2007800297571 A CNA2007800297571 A CN A2007800297571A CN 200780029757 A CN200780029757 A CN 200780029757A CN 101501874 A CN101501874 A CN 101501874A
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- Prior art keywords
- fluorescent material
- light
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- luminescent device
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Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77347—Silicon Nitrides or Silicon Oxynitrides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Luminescent Compositions (AREA)
Abstract
Description
Claims (26)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP221062/2006 | 2006-08-14 | ||
JP2006221062 | 2006-08-14 | ||
PCT/JP2007/064861 WO2008020541A1 (fr) | 2006-08-14 | 2007-07-30 | Dispositif électroluminescent et dispositif d'éclairage |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101501874A true CN101501874A (zh) | 2009-08-05 |
CN101501874B CN101501874B (zh) | 2012-04-04 |
Family
ID=39082067
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007800297571A Active CN101501874B (zh) | 2006-08-14 | 2007-07-30 | 发光器件及照明装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8053970B2 (zh) |
EP (1) | EP2056366B1 (zh) |
JP (1) | JP4963705B2 (zh) |
KR (1) | KR101108975B1 (zh) |
CN (1) | CN101501874B (zh) |
TW (1) | TWI364853B (zh) |
WO (1) | WO2008020541A1 (zh) |
Cited By (13)
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CN102796522A (zh) * | 2011-05-27 | 2012-11-28 | 亿广科技(上海)有限公司 | 荧光粉组合物及使用该荧光粉组合物的白色发光装置 |
CN101760190B (zh) * | 2009-10-30 | 2013-07-03 | 彩虹集团公司 | 一种合成稀土掺杂氮氧化物荧光粉及其制备方法 |
CN103311413A (zh) * | 2012-03-09 | 2013-09-18 | 株式会社东芝 | 白色发光装置 |
CN104263359A (zh) * | 2014-09-12 | 2015-01-07 | 江门市科恒实业股份有限公司 | 一种全光谱led荧光粉及其应用 |
CN105870303A (zh) * | 2016-04-18 | 2016-08-17 | 佛山市中昊光电科技有限公司 | 一种全光谱的led光源 |
CN107565006A (zh) * | 2017-08-30 | 2018-01-09 | 合肥工业大学 | 一种具有日光可见光部分光谱结构的led光源及灯具 |
CN108091751A (zh) * | 2017-12-06 | 2018-05-29 | 佛山市国星光电股份有限公司 | 一种白光led器件及其制备方法、led灯 |
CN108305929A (zh) * | 2013-10-02 | 2018-07-20 | Glbtech株式会社 | 具有高显色性的白光发光装置 |
CN108638707A (zh) * | 2018-06-27 | 2018-10-12 | 朗昭创新控股(深圳)有限公司 | 一种发光黑板 |
CN108732818A (zh) * | 2018-05-29 | 2018-11-02 | 武汉华星光电技术有限公司 | 背光模组、显示装置及背光模组的制作方法 |
CN108799849A (zh) * | 2017-05-02 | 2018-11-13 | 三星电子株式会社 | 白光发光器件 |
CN108828888A (zh) * | 2018-06-27 | 2018-11-16 | 朗昭创新控股(深圳)有限公司 | 一种投影设备 |
CN113544235A (zh) * | 2019-03-19 | 2021-10-22 | 斯坦雷电气株式会社 | 半导体发光装置及半导体发光模块 |
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KR100944085B1 (ko) | 2008-06-23 | 2010-02-24 | 서울반도체 주식회사 | 발광 장치 |
US8158026B2 (en) | 2008-08-12 | 2012-04-17 | Samsung Led Co., Ltd. | Method for preparing B-Sialon phosphor |
WO2010018999A2 (ko) * | 2008-08-12 | 2010-02-18 | 삼성전기주식회사 | β-사이알론 형광체 제조방법 |
WO2011019191A2 (ko) * | 2009-08-10 | 2011-02-17 | 엘지이노텍주식회사 | 형광체, 형광체 제조방법 및 백색 발광 소자 |
KR101172143B1 (ko) * | 2009-08-10 | 2012-08-07 | 엘지이노텍 주식회사 | 백색 발광다이오드 소자용 시온계 산화질화물 형광체, 그의 제조방법 및 그를 이용한 백색 led 소자 |
WO2011024818A1 (ja) | 2009-08-26 | 2011-03-03 | 三菱化学株式会社 | 白色半導体発光装置 |
KR101163902B1 (ko) * | 2010-08-10 | 2012-07-09 | 엘지이노텍 주식회사 | 발광 소자 |
US9909058B2 (en) | 2009-09-02 | 2018-03-06 | Lg Innotek Co., Ltd. | Phosphor, phosphor manufacturing method, and white light emitting device |
KR101144754B1 (ko) * | 2010-01-19 | 2012-05-09 | 일진반도체 주식회사 | 백색 발광장치 및 이의 제조방법 |
WO2011111368A1 (ja) * | 2010-03-12 | 2011-09-15 | 株式会社 東芝 | 白色照明装置 |
TW201138159A (en) * | 2010-04-22 | 2011-11-01 | shi-long Liu | Light emitting diode package structure and its manufacturing method |
KR101261461B1 (ko) * | 2010-07-14 | 2013-05-10 | 엘지이노텍 주식회사 | 액정 표시 장치 |
TWI457418B (zh) * | 2010-09-29 | 2014-10-21 | Au Optronics Corp | 白光發光二極體裝置、發光裝置及液晶顯示器 |
WO2012098932A1 (ja) | 2011-01-18 | 2012-07-26 | シャープ株式会社 | 半導体発光装置 |
KR101781437B1 (ko) * | 2011-04-29 | 2017-09-25 | 삼성전자주식회사 | 백색 발광 장치 및 이를 이용한 디스플레이 및 조명장치 |
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- 2007-07-30 EP EP07805885A patent/EP2056366B1/en active Active
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JP4963705B2 (ja) | 2012-06-27 |
TW200818553A (en) | 2008-04-16 |
KR20090048589A (ko) | 2009-05-14 |
JPWO2008020541A1 (ja) | 2010-01-07 |
US8053970B2 (en) | 2011-11-08 |
WO2008020541A1 (fr) | 2008-02-21 |
EP2056366A4 (en) | 2011-05-25 |
EP2056366A1 (en) | 2009-05-06 |
US20090146549A1 (en) | 2009-06-11 |
KR101108975B1 (ko) | 2012-05-30 |
EP2056366B1 (en) | 2013-04-03 |
CN101501874B (zh) | 2012-04-04 |
TWI364853B (en) | 2012-05-21 |
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