CN101495922B - 光刻系统、热消散方法和框架 - Google Patents

光刻系统、热消散方法和框架 Download PDF

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Publication number
CN101495922B
CN101495922B CN2007800285269A CN200780028526A CN101495922B CN 101495922 B CN101495922 B CN 101495922B CN 2007800285269 A CN2007800285269 A CN 2007800285269A CN 200780028526 A CN200780028526 A CN 200780028526A CN 101495922 B CN101495922 B CN 101495922B
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China
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target
heat
wafer
framework
convexity
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Chinese (zh)
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CN101495922A (zh
Inventor
米歇尔·彼得·丹斯贝格
彼得·克勒伊特
马尔科·扬-哈科·威兰
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ASML Netherlands BV
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Mapper Lithopraphy IP BV
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN2007800285269A 2006-07-28 2007-07-13 光刻系统、热消散方法和框架 Active CN101495922B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US83386506P 2006-07-28 2006-07-28
NL1032251 2006-07-28
NL1032251 2006-07-28
US60/833,865 2006-07-28
PCT/NL2007/000181 WO2008013443A2 (en) 2006-07-28 2007-07-13 Lithography system, method of heat dissipation and frame

Publications (2)

Publication Number Publication Date
CN101495922A CN101495922A (zh) 2009-07-29
CN101495922B true CN101495922B (zh) 2012-12-12

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ID=38582337

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Application Number Title Priority Date Filing Date
CN2007800285269A Active CN101495922B (zh) 2006-07-28 2007-07-13 光刻系统、热消散方法和框架

Country Status (6)

Country Link
EP (1) EP2054771B1 (https=)
JP (1) JP5384339B2 (https=)
KR (1) KR101486407B1 (https=)
CN (1) CN101495922B (https=)
TW (2) TW200813656A (https=)
WO (1) WO2008013443A2 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8325321B2 (en) * 2006-07-28 2012-12-04 Mapper Lithography Ip B.V. Lithography system, method of heat dissipation and frame
JP5529865B2 (ja) 2008-08-08 2014-06-25 エーエスエムエル ネザーランズ ビー．ブイ． 温度安定化システム、リソグラフィ投影装置、および温度制御方法
CN102414781B (zh) * 2009-02-22 2015-07-15 迈普尔平版印刷Ip有限公司 基板支撑结构、箝制准备单元及微影系统
KR101586984B1 (ko) 2009-02-22 2016-01-20 마퍼 리쏘그라피 아이피 비.브이. 리소그래피 머신을 위한 준비 유닛
WO2011101450A1 (en) 2010-02-19 2011-08-25 Mapper Lithography Ip B.V. Substrate support structure, clamp preparation unit, and lithography system
EP2612542B1 (en) 2010-08-30 2017-01-25 Philips Lighting Holding B.V. Management of power-over-ethernet installation
TWI757314B (zh) * 2016-07-28 2022-03-11 荷蘭商Ａｓｍｌ荷蘭公司 基板夾持裝置、用於製造此裝置之方法及用於處理或將樣本成像之儀器及方法
CN110879511B (zh) * 2019-11-28 2021-05-28 昆山龙腾光电股份有限公司 薄膜的定点去除装置、显示基板及其制作方法
NL2024445B1 (en) * 2019-12-12 2021-09-01 Delmic Ip B V Method and manipulation device for handling samples

Citations (4)

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Publication number Priority date Publication date Assignee Title
US5220171A (en) * 1990-11-01 1993-06-15 Canon Kabushiki Kaisha Wafer holding device in an exposure apparatus
JP3398456B2 (ja) * 1994-02-14 2003-04-21 大日本スクリーン製造株式会社 基板冷却装置
US6686598B1 (en) * 2000-09-01 2004-02-03 Varian Semiconductor Equipment Associates, Inc. Wafer clamping apparatus and method
CN1193266C (zh) * 1999-07-26 2005-03-16 三星电子株式会社 晶片加热装置以及使用其加热晶片的方法

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EP0076079A3 (en) * 1981-09-25 1983-08-10 The Secretary of State for Defence in Her Britannic Majesty's Government of the United Kingdom of Great Britain and Improvements in or relating to heat pipes
JPS59117128A (ja) * 1982-12-24 1984-07-06 Hitachi Ltd 温度制御装置を備えたウエハ搭載台
US4911232A (en) * 1988-07-21 1990-03-27 Triangle Research And Development Corporation Method of using a PCM slurry to enhance heat transfer in liquids
JP2731950B2 (ja) * 1989-07-13 1998-03-25 キヤノン株式会社 露光方法
JP2975089B2 (ja) * 1990-11-01 1999-11-10 キヤノン株式会社 露光装置
JPH1092738A (ja) * 1996-09-18 1998-04-10 Canon Inc 基板保持装置およびこれを用いた露光装置
JP2000252352A (ja) * 1999-03-03 2000-09-14 Nikon Corp 基板保持装置及びそれを有する荷電粒子線露光装置
JP2001189374A (ja) * 1999-12-28 2001-07-10 Nikon Corp 基板処理装置及び荷電粒子線露光装置
JP2001189258A (ja) * 1999-12-28 2001-07-10 Nikon Corp 露光装置
JP2003068600A (ja) 2001-08-22 2003-03-07 Canon Inc 露光装置、および基板チャックの冷却方法
JP4366098B2 (ja) * 2003-03-04 2009-11-18 キヤノン株式会社 投影露光装置および方法ならびにデバイス製造方法
DE602004008009T2 (de) * 2003-11-05 2008-04-30 Asml Netherlands B.V. Lithographischer Apparat
US7106416B2 (en) * 2003-12-10 2006-09-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20050128449A1 (en) * 2003-12-12 2005-06-16 Nikon Corporation, A Japanese Corporation Utilities transfer system in a lithography system
JP4680935B2 (ja) * 2004-01-08 2011-05-11 ジクスト、ベルンハルト 冷凍材料の冷却保持用輸送容器
US8749762B2 (en) * 2004-05-11 2014-06-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2006138558A (ja) * 2004-11-12 2006-06-01 Saito Research Institute Inc 調理器
JP4835976B2 (ja) * 2006-01-31 2011-12-14 株式会社ニコン 保持装置及び露光装置
JP5529865B2 (ja) * 2008-08-08 2014-06-25 エーエスエムエル ネザーランズ ビー．ブイ． 温度安定化システム、リソグラフィ投影装置、および温度制御方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5220171A (en) * 1990-11-01 1993-06-15 Canon Kabushiki Kaisha Wafer holding device in an exposure apparatus
JP3398456B2 (ja) * 1994-02-14 2003-04-21 大日本スクリーン製造株式会社 基板冷却装置
CN1193266C (zh) * 1999-07-26 2005-03-16 三星电子株式会社 晶片加热装置以及使用其加热晶片的方法
US6686598B1 (en) * 2000-09-01 2004-02-03 Varian Semiconductor Equipment Associates, Inc. Wafer clamping apparatus and method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特许第3398456号B2 2003.02.14

Also Published As

Publication number Publication date
TW200813656A (en) 2008-03-16
KR20090038026A (ko) 2009-04-17
TW201502720A (zh) 2015-01-16
WO2008013443A3 (en) 2008-05-02
JP2009545157A (ja) 2009-12-17
EP2054771A2 (en) 2009-05-06
CN101495922A (zh) 2009-07-29
TWI534560B (zh) 2016-05-21
KR101486407B1 (ko) 2015-01-26
WO2008013443A2 (en) 2008-01-31
JP5384339B2 (ja) 2014-01-08
EP2054771B1 (en) 2017-08-30

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Effective date of registration: 20190505

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Patentee before: Mapper Lithography IP B. V.