TW200813656A - Lithography system, method of heat dissipation and frame - Google Patents
Lithography system, method of heat dissipation and frame Download PDFInfo
- Publication number
- TW200813656A TW200813656A TW096127402A TW96127402A TW200813656A TW 200813656 A TW200813656 A TW 200813656A TW 096127402 A TW096127402 A TW 096127402A TW 96127402 A TW96127402 A TW 96127402A TW 200813656 A TW200813656 A TW 200813656A
- Authority
- TW
- Taiwan
- Prior art keywords
- target
- patent application
- scope
- heat
- wafer
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 20
- 238000001459 lithography Methods 0.000 title abstract description 6
- 230000017525 heat dissipation Effects 0.000 title description 2
- 239000000463 material Substances 0.000 claims abstract description 46
- 230000007704 transition Effects 0.000 claims abstract description 24
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- 239000000839 emulsion Substances 0.000 claims abstract description 8
- 238000000206 photolithography Methods 0.000 claims description 22
- 239000011358 absorbing material Substances 0.000 claims description 21
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 11
- DCAYPVUWAIABOU-UHFFFAOYSA-N hexadecane Chemical compound CCCCCCCCCCCCCCCC DCAYPVUWAIABOU-UHFFFAOYSA-N 0.000 claims description 10
- 235000011187 glycerol Nutrition 0.000 claims description 5
- 239000012782 phase change material Substances 0.000 claims description 5
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 3
- 239000002923 metal particle Substances 0.000 claims description 2
- 229910052797 bismuth Inorganic materials 0.000 claims 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 1
- 230000009885 systemic effect Effects 0.000 claims 1
- 239000002245 particle Substances 0.000 description 11
- 235000013339 cereals Nutrition 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229960005150 glycerol Drugs 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 230000002745 absorbent Effects 0.000 description 3
- 239000002250 absorbent Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000000609 electron-beam lithography Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- 101150071434 BAR1 gene Proteins 0.000 description 1
- 208000034656 Contusions Diseases 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 102100027340 Slit homolog 2 protein Human genes 0.000 description 1
- 101710133576 Slit homolog 2 protein Proteins 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 206010057040 Temperature intolerance Diseases 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 208000034526 bruise Diseases 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000003574 free electron Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000008543 heat sensitivity Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- -1 helium ions Chemical class 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- OZTBJTIPVIQKFZ-UHFFFAOYSA-N propane-1,1,1,2-tetrol Chemical compound CC(O)C(O)(O)O OZTBJTIPVIQKFZ-UHFFFAOYSA-N 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000008281 solid sol Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
- G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US83386506P | 2006-07-28 | 2006-07-28 | |
| NL1032251 | 2006-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200813656A true TW200813656A (en) | 2008-03-16 |
Family
ID=38582337
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096127402A TW200813656A (en) | 2006-07-28 | 2007-07-27 | Lithography system, method of heat dissipation and frame |
| TW103133925A TWI534560B (zh) | 2006-07-28 | 2007-07-27 | 光微影系統，散熱方法及框架 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103133925A TWI534560B (zh) | 2006-07-28 | 2007-07-27 | 光微影系統，散熱方法及框架 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP2054771B1 (https=) |
| JP (1) | JP5384339B2 (https=) |
| KR (1) | KR101486407B1 (https=) |
| CN (1) | CN101495922B (https=) |
| TW (2) | TW200813656A (https=) |
| WO (1) | WO2008013443A2 (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8325321B2 (en) * | 2006-07-28 | 2012-12-04 | Mapper Lithography Ip B.V. | Lithography system, method of heat dissipation and frame |
| JP5529865B2 (ja) | 2008-08-08 | 2014-06-25 | エーエスエムエル ネザーランズ ビー．ブイ． | 温度安定化システム、リソグラフィ投影装置、および温度制御方法 |
| CN102414781B (zh) * | 2009-02-22 | 2015-07-15 | 迈普尔平版印刷Ip有限公司 | 基板支撑结构、箝制准备单元及微影系统 |
| KR101586984B1 (ko) | 2009-02-22 | 2016-01-20 | 마퍼 리쏘그라피 아이피 비.브이. | 리소그래피 머신을 위한 준비 유닛 |
| WO2011101450A1 (en) | 2010-02-19 | 2011-08-25 | Mapper Lithography Ip B.V. | Substrate support structure, clamp preparation unit, and lithography system |
| EP2612542B1 (en) | 2010-08-30 | 2017-01-25 | Philips Lighting Holding B.V. | Management of power-over-ethernet installation |
| TWI757314B (zh) * | 2016-07-28 | 2022-03-11 | 荷蘭商Ａｓｍｌ荷蘭公司 | 基板夾持裝置、用於製造此裝置之方法及用於處理或將樣本成像之儀器及方法 |
| CN110879511B (zh) * | 2019-11-28 | 2021-05-28 | 昆山龙腾光电股份有限公司 | 薄膜的定点去除装置、显示基板及其制作方法 |
| NL2024445B1 (en) * | 2019-12-12 | 2021-09-01 | Delmic Ip B V | Method and manipulation device for handling samples |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0076079A3 (en) * | 1981-09-25 | 1983-08-10 | The Secretary of State for Defence in Her Britannic Majesty's Government of the United Kingdom of Great Britain and | Improvements in or relating to heat pipes |
| JPS59117128A (ja) * | 1982-12-24 | 1984-07-06 | Hitachi Ltd | 温度制御装置を備えたウエハ搭載台 |
| US4911232A (en) * | 1988-07-21 | 1990-03-27 | Triangle Research And Development Corporation | Method of using a PCM slurry to enhance heat transfer in liquids |
| JP2731950B2 (ja) * | 1989-07-13 | 1998-03-25 | キヤノン株式会社 | 露光方法 |
| JP2975089B2 (ja) * | 1990-11-01 | 1999-11-10 | キヤノン株式会社 | 露光装置 |
| DE69118315T2 (de) * | 1990-11-01 | 1996-08-14 | Canon Kk | Waferhaltebefestigung für Belichtungsgerät |
| JP3398456B2 (ja) * | 1994-02-14 | 2003-04-21 | 大日本スクリーン製造株式会社 | 基板冷却装置 |
| JPH1092738A (ja) * | 1996-09-18 | 1998-04-10 | Canon Inc | 基板保持装置およびこれを用いた露光装置 |
| JP2000252352A (ja) * | 1999-03-03 | 2000-09-14 | Nikon Corp | 基板保持装置及びそれを有する荷電粒子線露光装置 |
| KR100351049B1 (ko) * | 1999-07-26 | 2002-09-09 | 삼성전자 주식회사 | 웨이퍼 가열 방법 및 이를 적용한 장치 |
| JP2001189374A (ja) * | 1999-12-28 | 2001-07-10 | Nikon Corp | 基板処理装置及び荷電粒子線露光装置 |
| JP2001189258A (ja) * | 1999-12-28 | 2001-07-10 | Nikon Corp | 露光装置 |
| US6686598B1 (en) * | 2000-09-01 | 2004-02-03 | Varian Semiconductor Equipment Associates, Inc. | Wafer clamping apparatus and method |
| JP2003068600A (ja) | 2001-08-22 | 2003-03-07 | Canon Inc | 露光装置、および基板チャックの冷却方法 |
| JP4366098B2 (ja) * | 2003-03-04 | 2009-11-18 | キヤノン株式会社 | 投影露光装置および方法ならびにデバイス製造方法 |
| DE602004008009T2 (de) * | 2003-11-05 | 2008-04-30 | Asml Netherlands B.V. | Lithographischer Apparat |
| US7106416B2 (en) * | 2003-12-10 | 2006-09-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US20050128449A1 (en) * | 2003-12-12 | 2005-06-16 | Nikon Corporation, A Japanese Corporation | Utilities transfer system in a lithography system |
| JP4680935B2 (ja) * | 2004-01-08 | 2011-05-11 | ジクスト、ベルンハルト | 冷凍材料の冷却保持用輸送容器 |
| US8749762B2 (en) * | 2004-05-11 | 2014-06-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP2006138558A (ja) * | 2004-11-12 | 2006-06-01 | Saito Research Institute Inc | 調理器 |
| JP4835976B2 (ja) * | 2006-01-31 | 2011-12-14 | 株式会社ニコン | 保持装置及び露光装置 |
| JP5529865B2 (ja) * | 2008-08-08 | 2014-06-25 | エーエスエムエル ネザーランズ ビー．ブイ． | 温度安定化システム、リソグラフィ投影装置、および温度制御方法 |
-
2007
- 2007-07-13 WO PCT/NL2007/000181 patent/WO2008013443A2/en not_active Ceased
- 2007-07-13 JP JP2009521714A patent/JP5384339B2/ja active Active
- 2007-07-13 KR KR1020097004269A patent/KR101486407B1/ko active Active
- 2007-07-13 EP EP07793822.3A patent/EP2054771B1/en active Active
- 2007-07-13 CN CN2007800285269A patent/CN101495922B/zh active Active
- 2007-07-27 TW TW096127402A patent/TW200813656A/zh unknown
- 2007-07-27 TW TW103133925A patent/TWI534560B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20090038026A (ko) | 2009-04-17 |
| TW201502720A (zh) | 2015-01-16 |
| WO2008013443A3 (en) | 2008-05-02 |
| JP2009545157A (ja) | 2009-12-17 |
| EP2054771A2 (en) | 2009-05-06 |
| CN101495922B (zh) | 2012-12-12 |
| CN101495922A (zh) | 2009-07-29 |
| TWI534560B (zh) | 2016-05-21 |
| KR101486407B1 (ko) | 2015-01-26 |
| WO2008013443A2 (en) | 2008-01-31 |
| JP5384339B2 (ja) | 2014-01-08 |
| EP2054771B1 (en) | 2017-08-30 |
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