CN101459055B - 半导体器件的制造方法 - Google Patents
半导体器件的制造方法 Download PDFInfo
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- CN101459055B CN101459055B CN2008101843979A CN200810184397A CN101459055B CN 101459055 B CN101459055 B CN 101459055B CN 2008101843979 A CN2008101843979 A CN 2008101843979A CN 200810184397 A CN200810184397 A CN 200810184397A CN 101459055 B CN101459055 B CN 101459055B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 232
- 238000004519 manufacturing process Methods 0.000 title claims description 33
- 238000000034 method Methods 0.000 claims abstract description 49
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 14
- 238000005520 cutting process Methods 0.000 claims description 59
- 239000000463 material Substances 0.000 abstract description 23
- 238000007789 sealing Methods 0.000 abstract description 4
- 230000001681 protective effect Effects 0.000 abstract 2
- 239000010408 film Substances 0.000 description 119
- 239000010410 layer Substances 0.000 description 44
- 235000012431 wafers Nutrition 0.000 description 38
- 239000000758 substrate Substances 0.000 description 36
- 229910052710 silicon Inorganic materials 0.000 description 19
- 239000010703 silicon Substances 0.000 description 19
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 17
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 238000009713 electroplating Methods 0.000 description 10
- 238000001465 metallisation Methods 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 239000011229 interlayer Substances 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 7
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- 229910052814 silicon oxide Inorganic materials 0.000 description 4
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- 238000005868 electrolysis reaction Methods 0.000 description 2
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- 229910052752 metalloid Inorganic materials 0.000 description 2
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- 239000000126 substance Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
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- 229910052796 boron Inorganic materials 0.000 description 1
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- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- Condensed Matter Physics & Semiconductors (AREA)
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Abstract
Description
Claims (11)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007320303A JP4596001B2 (ja) | 2007-12-12 | 2007-12-12 | 半導体装置の製造方法 |
JP320303/2007 | 2007-12-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101459055A CN101459055A (zh) | 2009-06-17 |
CN101459055B true CN101459055B (zh) | 2010-12-22 |
Family
ID=40753825
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008101843979A Expired - Fee Related CN101459055B (zh) | 2007-12-12 | 2008-12-12 | 半导体器件的制造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7888238B2 (zh) |
JP (1) | JP4596001B2 (zh) |
KR (1) | KR101053026B1 (zh) |
CN (1) | CN101459055B (zh) |
TW (1) | TW200935517A (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4449824B2 (ja) * | 2005-06-01 | 2010-04-14 | カシオ計算機株式会社 | 半導体装置およびその実装構造 |
TWI364793B (en) * | 2007-05-08 | 2012-05-21 | Mutual Pak Technology Co Ltd | Package structure for integrated circuit device and method of the same |
US8456002B2 (en) | 2007-12-14 | 2013-06-04 | Stats Chippac Ltd. | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief |
US9318441B2 (en) | 2007-12-14 | 2016-04-19 | Stats Chippac, Ltd. | Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die |
US8183095B2 (en) | 2010-03-12 | 2012-05-22 | Stats Chippac, Ltd. | Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation |
US8343809B2 (en) * | 2010-03-15 | 2013-01-01 | Stats Chippac, Ltd. | Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die |
US7767496B2 (en) | 2007-12-14 | 2010-08-03 | Stats Chippac, Ltd. | Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer |
JP4645863B2 (ja) * | 2008-09-09 | 2011-03-09 | カシオ計算機株式会社 | 半導体装置の製造方法 |
JP2010263145A (ja) * | 2009-05-11 | 2010-11-18 | Panasonic Corp | 半導体装置及びその製造方法 |
WO2011027193A1 (en) * | 2009-09-04 | 2011-03-10 | X-Fab Semiconductor Foundries Ag | Reduction of fluorine contamination of bond pads of semiconductor devices |
US9548240B2 (en) | 2010-03-15 | 2017-01-17 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package |
US8563405B2 (en) * | 2010-05-06 | 2013-10-22 | Ineffable Cellular Limited Liability Company | Method for manufacturing semiconductor device |
TWI509739B (zh) * | 2010-05-06 | 2015-11-21 | Xenogenic Dev Ltd Liability Company | 半導體裝置的製造方法 |
US10153237B2 (en) * | 2016-03-21 | 2018-12-11 | Xintec Inc. | Chip package and method for forming the same |
JP7065741B2 (ja) * | 2018-09-25 | 2022-05-12 | 東京エレクトロン株式会社 | 半導体装置の製造方法 |
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JP2000150646A (ja) * | 1998-11-11 | 2000-05-30 | Sony Corp | 半導体装置およびその製造方法 |
JP2004296905A (ja) * | 2003-03-27 | 2004-10-21 | Toshiba Corp | 半導体装置 |
JP4285079B2 (ja) | 2003-05-22 | 2009-06-24 | カシオ計算機株式会社 | 半導体装置の製造方法 |
US7944064B2 (en) * | 2003-05-26 | 2011-05-17 | Casio Computer Co., Ltd. | Semiconductor device having alignment post electrode and method of manufacturing the same |
US7804043B2 (en) * | 2004-06-15 | 2010-09-28 | Laserfacturing Inc. | Method and apparatus for dicing of thin and ultra thin semiconductor wafer using ultrafast pulse laser |
JP2006054246A (ja) * | 2004-08-10 | 2006-02-23 | Disco Abrasive Syst Ltd | ウエーハの分離方法 |
JP2006173548A (ja) * | 2004-11-16 | 2006-06-29 | Rohm Co Ltd | 半導体装置および半導体装置の製造方法 |
JP2007165402A (ja) * | 2005-12-09 | 2007-06-28 | Rohm Co Ltd | 半導体装置 |
JP2007287780A (ja) * | 2006-04-13 | 2007-11-01 | Toshiba Corp | 半導体装置の製造方法及び半導体装置 |
KR100703816B1 (ko) * | 2006-04-21 | 2007-04-04 | 삼성전자주식회사 | 웨이퍼 레벨 반도체 모듈과 그 제조 방법 |
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CN101459055A (zh) | 2009-06-17 |
KR20090063126A (ko) | 2009-06-17 |
US20090155982A1 (en) | 2009-06-18 |
US7888238B2 (en) | 2011-02-15 |
KR101053026B1 (ko) | 2011-08-01 |
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