JP7065741B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JP7065741B2 JP7065741B2 JP2018178254A JP2018178254A JP7065741B2 JP 7065741 B2 JP7065741 B2 JP 7065741B2 JP 2018178254 A JP2018178254 A JP 2018178254A JP 2018178254 A JP2018178254 A JP 2018178254A JP 7065741 B2 JP7065741 B2 JP 7065741B2
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Description
[半導体装置の製造方法]
図1は、本開示の第1の実施形態における半導体装置の製造方法の一例を示すフローチャートである。また、図2~図6、図8~図10、および図12~図14は、それぞれの工程における被処理体Wの状態の一例を示す断面図である。
第1の実施形態では、配線材料17を含む複数の構造物が形成された後に、それぞれの構造物の側方に空隙18’が形成され、それぞれの構造物の間に層間絶縁膜21が埋め込まれた。これに対し、本実施形態では、絶縁性を有する部材により構成された複数の構造物が形成された後に、それぞれの構造物の側方に空隙が形成され、それぞれの構造物の間に配線材料17が埋め込まれる点が第1の実施形態とは異なる。
図16は、本開示の第2の実施形態における半導体装置の製造方法の一例を示すフローチャートである。また、図17~図24は、本実施形態の製造方法に含まれるそれぞれの工程における被処理体Wの状態の一例を示す断面図である。なお、以下の説明では、図2および図3も参照される。また、以下の説明において、第1の実施形態と同様の内容については、重複する説明を省略する。
上記した各実施形態では、配線材料17の側方に重合体膜18の形状に応じた空隙18’が形成される。これに対し、本実施形態では、ソース、ドレイン、およびゲートを有する構造体において、ゲートの上方に重合体膜18の形状に応じた空隙18’が形成される。以下、本実施形態における半導体装置の製造方法の一例について、図24~図29を参照しながら説明する。
なお、本願に開示された技術は、上記した実施形態に限定されるものではなく、その要旨の範囲内で数々の変形が可能である。
10 ベース基板
10s ソース領域
10d ドレイン領域
11 絶縁膜
12 ハードマスク膜
13 反射防止膜
14 レジスト膜
15 凹部
16 下地膜
17 配線材料
18 重合体膜
18’ 空隙
19 酸化膜
20 保護膜
21 層間絶縁膜
22 空隙
23 ゲートシリコン膜
4 成膜装置
5 アニール装置
Claims (7)
- 基板上に設けられ、第1の材料を含む複数の構造物の周囲に、複数種類のモノマーの重合により生成された尿素結合を有する重合体の膜である重合体膜を積層する第1の積層工程と、
前記重合体膜の形状を調整する調整工程と、
前記重合体膜を覆うように前記重合体膜の上に仮封止膜を積層する第2の積層工程と、
前記重合体膜を加熱することにより前記重合体を前記複数種類のモノマーに解重合させ、解重合された前記複数種類のモノマーを、前記仮封止膜を介して脱離させる加熱工程と、
前記加熱工程の後に、前記仮封止膜を覆うように前記仮封止膜の上に保護膜を積層する第3の積層工程と、
前記保護膜上であって、隣接する前記構造物の間に、第2の材料により構成された部材を埋め込む埋め込み工程と
を含む半導体装置の製造方法。 - 前記調整工程では、
エッチングにより、それぞれの前記構造物の側方に前記重合体膜が配置されるように、前記重合体膜の形状が調整される請求項1に記載の半導体装置の製造方法。 - 前記第1の材料は、導電性または半導電性を有する材料であり、
前記第2の材料は、絶縁性を有する材料である請求項1または2に記載の半導体装置の製造方法。 - 前記第1の材料は、絶縁性を有する材料であり、
前記第2の材料は、導電性または半導電性を有する材料である請求項1または2に記載の半導体装置の製造方法。 - 前記第1の積層工程では、
第1のモノマーを含むガスと、第2のモノマーを含むガスとが前記基板が収容された容器内に供給され、前記第1のモノマーと前記第2のモノマーとの蒸着重合により生成された前記重合体膜が前記複数の構造物の周囲に積層される請求項1から4のいずれか一項に記載の半導体装置の製造方法。 - 前記第1の積層工程は、前記加熱工程より低い温度で行われる請求項1から5のいずれか一項に記載の半導体装置の製造方法。
- 前記仮封止膜は、酸化膜または窒化膜である請求項1から6のいずれか一項に記載の半導体装置の製造方法。
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CN201910893160.6A CN110942978A (zh) | 2018-09-25 | 2019-09-20 | 半导体装置的制造方法 |
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JP5560144B2 (ja) | 2010-08-31 | 2014-07-23 | 東京エレクトロン株式会社 | 半導体装置の製造方法 |
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