CN101431009B - 喷淋板和基板处理装置 - Google Patents

喷淋板和基板处理装置 Download PDF

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Publication number
CN101431009B
CN101431009B CN2008101755982A CN200810175598A CN101431009B CN 101431009 B CN101431009 B CN 101431009B CN 2008101755982 A CN2008101755982 A CN 2008101755982A CN 200810175598 A CN200810175598 A CN 200810175598A CN 101431009 B CN101431009 B CN 101431009B
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CN
China
Prior art keywords
shower plate
space
processing gas
processing
gas
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Expired - Fee Related
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CN2008101755982A
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English (en)
Chinese (zh)
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CN101431009A (zh
Inventor
舆水地盐
传宝一树
持木宏政
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H01J37/32449—Gas control, e.g. control of the gas flow
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
CN2008101755982A 2007-11-08 2008-11-07 喷淋板和基板处理装置 Expired - Fee Related CN101431009B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007-291064 2007-11-08
JP2007291064A JP5150217B2 (ja) 2007-11-08 2007-11-08 シャワープレート及び基板処理装置
JP2007291064 2007-11-08

Publications (2)

Publication Number Publication Date
CN101431009A CN101431009A (zh) 2009-05-13
CN101431009B true CN101431009B (zh) 2011-01-19

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ID=40622601

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008101755982A Expired - Fee Related CN101431009B (zh) 2007-11-08 2008-11-07 喷淋板和基板处理装置

Country Status (5)

Country Link
US (1) US9136097B2 (https=)
JP (1) JP5150217B2 (https=)
KR (1) KR101037812B1 (https=)
CN (1) CN101431009B (https=)
TW (1) TWI465292B (https=)

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Also Published As

Publication number Publication date
US20090120582A1 (en) 2009-05-14
TWI465292B (zh) 2014-12-21
TW200927291A (en) 2009-07-01
US9136097B2 (en) 2015-09-15
JP2009117711A (ja) 2009-05-28
CN101431009A (zh) 2009-05-13
KR101037812B1 (ko) 2011-05-30
JP5150217B2 (ja) 2013-02-20
KR20090048339A (ko) 2009-05-13

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Granted publication date: 20110119

Termination date: 20171107