CN101403859B - 感光性树脂组合物及其固化物 - Google Patents

感光性树脂组合物及其固化物 Download PDF

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Publication number
CN101403859B
CN101403859B CN2008101683274A CN200810168327A CN101403859B CN 101403859 B CN101403859 B CN 101403859B CN 2008101683274 A CN2008101683274 A CN 2008101683274A CN 200810168327 A CN200810168327 A CN 200810168327A CN 101403859 B CN101403859 B CN 101403859B
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carbons
alkyl
substituted
resin
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CN101403859A (zh
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柴崎阳子
有马圣夫
米田一善
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Taiyo Holdings Co Ltd
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Taiyo Holdings Co Ltd
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Polymerisation Methods In General (AREA)
  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
CN2008101683274A 2007-10-01 2008-09-26 感光性树脂组合物及其固化物 Active CN101403859B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007-257359 2007-10-01
JP2007257359A JP5513711B2 (ja) 2007-10-01 2007-10-01 感光性樹脂組成物及びその硬化物
JP2007257359 2007-10-01

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CN101403859A CN101403859A (zh) 2009-04-08
CN101403859B true CN101403859B (zh) 2013-06-19

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CN2008101683274A Active CN101403859B (zh) 2007-10-01 2008-09-26 感光性树脂组合物及其固化物

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JP (1) JP5513711B2 (enExample)
KR (1) KR101057929B1 (enExample)
CN (1) CN101403859B (enExample)
TW (1) TWI417662B (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5653588B2 (ja) * 2009-03-31 2015-01-14 太陽ホールディングス株式会社 光硬化性樹脂組成物
JP5250479B2 (ja) * 2009-05-18 2013-07-31 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5475350B2 (ja) * 2009-07-02 2014-04-16 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5356934B2 (ja) * 2009-07-02 2013-12-04 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
WO2011062446A2 (ko) * 2009-11-20 2011-05-26 코오롱인더스트리 주식회사 감광성 수지 조성물
KR101759929B1 (ko) * 2009-11-20 2017-07-20 코오롱인더스트리 주식회사 감광성 수지 조성물
JP5415923B2 (ja) * 2009-12-14 2014-02-12 太陽ホールディングス株式会社 感光性樹脂組成物、そのドライフィルム及びそれらを用いたプリント配線板
WO2011122025A1 (ja) * 2010-03-31 2011-10-06 太陽ホールディングス株式会社 光硬化性樹脂組成物
JP5593266B2 (ja) * 2010-04-28 2014-09-17 富士フイルム株式会社 感光性組成物、並びに感光性フィルム、感光性積層体、永久パターン形成方法、及びプリント基板
WO2012035857A1 (ja) * 2010-09-13 2012-03-22 株式会社カネカ 補強板一体型フレキシブルプリント基板、及び補強板一体型フレキシブルプリント基板の製造方法
CN103064254B (zh) * 2011-10-20 2017-11-17 日立化成株式会社 感光性树脂组合物、感光性元件、抗蚀图形的形成方法以及印刷电路板的制造方法
WO2014034928A1 (ja) * 2012-08-31 2014-03-06 ユニバーサル・バイオ・リサーチ株式会社 変形要素内蔵分注チップ、変形要素内蔵分注装置および変形要素内蔵分注処理方法
JP5523592B2 (ja) * 2013-01-08 2014-06-18 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5809182B2 (ja) * 2013-03-26 2015-11-10 株式会社タムラ製作所 感光性樹脂組成物
JP6178164B2 (ja) * 2013-08-23 2017-08-09 富士フイルム株式会社 感光性着色組成物、カラーフィルタ、カラーフィルタの製造方法、有機ｅｌ液晶表示装置
JP5722418B1 (ja) * 2013-12-02 2015-05-20 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
TWI731895B (zh) * 2015-12-08 2021-07-01 日商富士軟片股份有限公司 感放射線性樹脂組成物、硬化膜、圖案形成方法、固體攝影元件及影像顯示裝置
JP6197020B2 (ja) * 2015-12-17 2017-09-13 三井化学株式会社 光硬化性樹脂組成物、表示素子シール剤、液晶シール剤及び液晶表示パネルとその製造方法
TWI639889B (zh) * 2015-12-25 2018-11-01 旭化成股份有限公司 感光性樹脂組合物、感光性樹脂積層體、樹脂圖案製造方法、硬化膜圖案製造方法及顯示裝置
CN108368191A (zh) * 2016-03-29 2018-08-03 株式会社艾迪科 光聚合引发剂组合物及感光性组合物
JP7194492B2 (ja) * 2016-10-24 2022-12-22 東京応化工業株式会社 感光性組成物、感光性組成物の製造方法、光重合開始剤、及び光重合開始剤の調製方法
JP6789193B2 (ja) * 2017-08-09 2020-11-25 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルム、硬化物、およびプリント配線板
JP7029267B2 (ja) * 2017-10-06 2022-03-03 日鉄ケミカル＆マテリアル株式会社 感光性樹脂組成物及び樹脂膜付き基板の製造方法
CN109085129B (zh) * 2018-06-22 2021-10-15 广州兴森快捷电路科技有限公司 阻焊油墨对uv光吸收的定量测试方法
CN111378088B (zh) * 2018-12-29 2023-02-07 太阳油墨（苏州）有限公司 热固化性树脂组合物、干膜、固化物及电子部件
CN118525249A (zh) * 2024-04-12 2024-08-20 徐州博康信息化学品有限公司 潜伏性固化剂、低温固化的感光树脂组合物、图案固化膜的制备方法以及绝缘膜

Citations (4)

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Publication number Priority date Publication date Assignee Title
CN1307693A (zh) * 1998-06-26 2001-08-08 西巴特殊化学品控股有限公司 可光聚合热固性树脂组合物
CN1705646A (zh) * 2002-10-15 2005-12-07 昭和电工株式会社 六芳基二咪唑化合物和含有该化合物的光聚合引发剂组合物
CN1927944A (zh) * 2005-09-06 2007-03-14 太阳油墨制造株式会社 树脂组合物、其固化物及使用其制得的印刷电路板
CN1945434A (zh) * 2005-10-04 2007-04-11 太阳油墨制造株式会社 光固化性·热固化性树脂组合物、其固化物及使用其制得的印刷电路板

Family Cites Families (4)

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JP4008273B2 (ja) * 2002-03-26 2007-11-14 太陽インキ製造株式会社 アルカリ現像型感光性樹脂組成物及びそれを用いたプリント配線基板
JP2007041493A (ja) * 2004-10-20 2007-02-15 Mitsubishi Chemicals Corp 感光性組成物、及び青紫色レーザー用感光性組成物並びにそれを用いた画像形成材料、画像形成材、及び画像形成方法
TW200710572A (en) * 2005-05-31 2007-03-16 Taiyo Ink Mfg Co Ltd Photocuring/thermosetting resin composition, curing/setting product thereof and printed wiring board obtained using the same
JP2007072035A (ja) * 2005-09-06 2007-03-22 Tokyo Ohka Kogyo Co Ltd 感光性組成物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1307693A (zh) * 1998-06-26 2001-08-08 西巴特殊化学品控股有限公司 可光聚合热固性树脂组合物
CN1705646A (zh) * 2002-10-15 2005-12-07 昭和电工株式会社 六芳基二咪唑化合物和含有该化合物的光聚合引发剂组合物
CN1927944A (zh) * 2005-09-06 2007-03-14 太阳油墨制造株式会社 树脂组合物、其固化物及使用其制得的印刷电路板
CN1945434A (zh) * 2005-10-04 2007-04-11 太阳油墨制造株式会社 光固化性·热固化性树脂组合物、其固化物及使用其制得的印刷电路板

Also Published As

Publication number Publication date
TWI417662B (zh) 2013-12-01
CN101403859A (zh) 2009-04-08
KR101057929B1 (ko) 2011-08-18
KR20090033803A (ko) 2009-04-06
JP2009086414A (ja) 2009-04-23
TW200935175A (en) 2009-08-16
JP5513711B2 (ja) 2014-06-04

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Application publication date: 20090408

Assignee: TAIYO INK (SUZHOU) Co.,Ltd.

Assignor: TAIYO HOLDINGS Co.,Ltd.

Contract record no.: 2011990000116

Denomination of invention: Unsaturated group-containing polyimide resin, photosensitive resin composition containing same, and cured product thereof

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Denomination of invention: Unsaturated group-containing polyimide resin, photosensitive resin composition containing same, and cured product thereof

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