JP5513711B2 - 感光性樹脂組成物及びその硬化物 - Google Patents

感光性樹脂組成物及びその硬化物 Download PDF

Info

Publication number
JP5513711B2
JP5513711B2 JP2007257359A JP2007257359A JP5513711B2 JP 5513711 B2 JP5513711 B2 JP 5513711B2 JP 2007257359 A JP2007257359 A JP 2007257359A JP 2007257359 A JP2007257359 A JP 2007257359A JP 5513711 B2 JP5513711 B2 JP 5513711B2
Authority
JP
Japan
Prior art keywords
group
carbon atoms
resin composition
photosensitive resin
substituted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2007257359A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009086414A5 (enExample
JP2009086414A (ja
Inventor
陽子 柴▲崎▼
聖夫 有馬
一善 米田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Holdings Co Ltd filed Critical Taiyo Holdings Co Ltd
Priority to JP2007257359A priority Critical patent/JP5513711B2/ja
Priority to CN2008101683274A priority patent/CN101403859B/zh
Priority to TW097137563A priority patent/TWI417662B/zh
Priority to KR1020080095885A priority patent/KR101057929B1/ko
Publication of JP2009086414A publication Critical patent/JP2009086414A/ja
Publication of JP2009086414A5 publication Critical patent/JP2009086414A5/ja
Application granted granted Critical
Publication of JP5513711B2 publication Critical patent/JP5513711B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Polymerisation Methods In General (AREA)
  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
JP2007257359A 2007-10-01 2007-10-01 感光性樹脂組成物及びその硬化物 Active JP5513711B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007257359A JP5513711B2 (ja) 2007-10-01 2007-10-01 感光性樹脂組成物及びその硬化物
CN2008101683274A CN101403859B (zh) 2007-10-01 2008-09-26 感光性树脂组合物及其固化物
TW097137563A TWI417662B (zh) 2007-10-01 2008-09-30 A photosensitive resin composition and a hardened product thereof
KR1020080095885A KR101057929B1 (ko) 2007-10-01 2008-09-30 감광성 수지 조성물 및 그의 경화물

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007257359A JP5513711B2 (ja) 2007-10-01 2007-10-01 感光性樹脂組成物及びその硬化物

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013161550A Division JP5660690B2 (ja) 2013-08-02 2013-08-02 感光性樹脂組成物及びその硬化物

Publications (3)

Publication Number Publication Date
JP2009086414A JP2009086414A (ja) 2009-04-23
JP2009086414A5 JP2009086414A5 (enExample) 2009-06-04
JP5513711B2 true JP5513711B2 (ja) 2014-06-04

Family

ID=40537910

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007257359A Active JP5513711B2 (ja) 2007-10-01 2007-10-01 感光性樹脂組成物及びその硬化物

Country Status (4)

Country Link
JP (1) JP5513711B2 (enExample)
KR (1) KR101057929B1 (enExample)
CN (1) CN101403859B (enExample)
TW (1) TWI417662B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150046331A (ko) * 2012-08-31 2015-04-29 유니바사루 바이오 리사치 가부시키가이샤 변형요소내장 분주팁, 변형요소내장 분주장치 및 변형요소내장 분주처리방법

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5653588B2 (ja) * 2009-03-31 2015-01-14 太陽ホールディングス株式会社 光硬化性樹脂組成物
JP5250479B2 (ja) * 2009-05-18 2013-07-31 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5475350B2 (ja) * 2009-07-02 2014-04-16 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5356934B2 (ja) * 2009-07-02 2013-12-04 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
WO2011062446A2 (ko) * 2009-11-20 2011-05-26 코오롱인더스트리 주식회사 감광성 수지 조성물
KR101759929B1 (ko) * 2009-11-20 2017-07-20 코오롱인더스트리 주식회사 감광성 수지 조성물
JP5415923B2 (ja) * 2009-12-14 2014-02-12 太陽ホールディングス株式会社 感光性樹脂組成物、そのドライフィルム及びそれらを用いたプリント配線板
WO2011122025A1 (ja) * 2010-03-31 2011-10-06 太陽ホールディングス株式会社 光硬化性樹脂組成物
JP5593266B2 (ja) * 2010-04-28 2014-09-17 富士フイルム株式会社 感光性組成物、並びに感光性フィルム、感光性積層体、永久パターン形成方法、及びプリント基板
WO2012035857A1 (ja) * 2010-09-13 2012-03-22 株式会社カネカ 補強板一体型フレキシブルプリント基板、及び補強板一体型フレキシブルプリント基板の製造方法
CN103064254B (zh) * 2011-10-20 2017-11-17 日立化成株式会社 感光性树脂组合物、感光性元件、抗蚀图形的形成方法以及印刷电路板的制造方法
JP5523592B2 (ja) * 2013-01-08 2014-06-18 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5809182B2 (ja) * 2013-03-26 2015-11-10 株式会社タムラ製作所 感光性樹脂組成物
JP6178164B2 (ja) * 2013-08-23 2017-08-09 富士フイルム株式会社 感光性着色組成物、カラーフィルタ、カラーフィルタの製造方法、有機ｅｌ液晶表示装置
JP5722418B1 (ja) * 2013-12-02 2015-05-20 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
TWI731895B (zh) * 2015-12-08 2021-07-01 日商富士軟片股份有限公司 感放射線性樹脂組成物、硬化膜、圖案形成方法、固體攝影元件及影像顯示裝置
JP6197020B2 (ja) * 2015-12-17 2017-09-13 三井化学株式会社 光硬化性樹脂組成物、表示素子シール剤、液晶シール剤及び液晶表示パネルとその製造方法
TWI639889B (zh) * 2015-12-25 2018-11-01 旭化成股份有限公司 感光性樹脂組合物、感光性樹脂積層體、樹脂圖案製造方法、硬化膜圖案製造方法及顯示裝置
CN108368191A (zh) * 2016-03-29 2018-08-03 株式会社艾迪科 光聚合引发剂组合物及感光性组合物
JP7194492B2 (ja) * 2016-10-24 2022-12-22 東京応化工業株式会社 感光性組成物、感光性組成物の製造方法、光重合開始剤、及び光重合開始剤の調製方法
JP6789193B2 (ja) * 2017-08-09 2020-11-25 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルム、硬化物、およびプリント配線板
JP7029267B2 (ja) * 2017-10-06 2022-03-03 日鉄ケミカル＆マテリアル株式会社 感光性樹脂組成物及び樹脂膜付き基板の製造方法
CN109085129B (zh) * 2018-06-22 2021-10-15 广州兴森快捷电路科技有限公司 阻焊油墨对uv光吸收的定量测试方法
CN111378088B (zh) * 2018-12-29 2023-02-07 太阳油墨（苏州）有限公司 热固化性树脂组合物、干膜、固化物及电子部件
CN118525249A (zh) * 2024-04-12 2024-08-20 徐州博康信息化学品有限公司 潜伏性固化剂、低温固化的感光树脂组合物、图案固化膜的制备方法以及绝缘膜

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY121423A (en) * 1998-06-26 2006-01-28 Ciba Sc Holding Ag Photopolymerizable thermosetting resin compositions
JP4008273B2 (ja) * 2002-03-26 2007-11-14 太陽インキ製造株式会社 アルカリ現像型感光性樹脂組成物及びそれを用いたプリント配線基板
JP4393051B2 (ja) * 2002-10-15 2010-01-06 昭和電工株式会社 ヘキサアリールビイミダゾール化合物およびそれを含む光重合開始剤組成物
JP2007041493A (ja) * 2004-10-20 2007-02-15 Mitsubishi Chemicals Corp 感光性組成物、及び青紫色レーザー用感光性組成物並びにそれを用いた画像形成材料、画像形成材、及び画像形成方法
TW200710572A (en) * 2005-05-31 2007-03-16 Taiyo Ink Mfg Co Ltd Photocuring/thermosetting resin composition, curing/setting product thereof and printed wiring board obtained using the same
KR100787341B1 (ko) * 2005-09-06 2007-12-18 다이요 잉키 세이조 가부시키가이샤 수지 조성물 및 그의 경화물 및 그것을 이용하여 얻어지는인쇄 배선판
JP2007072035A (ja) * 2005-09-06 2007-03-22 Tokyo Ohka Kogyo Co Ltd 感光性組成物
JP4849860B2 (ja) * 2005-10-04 2012-01-11 太陽ホールディングス株式会社 光硬化性・熱硬化性樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150046331A (ko) * 2012-08-31 2015-04-29 유니바사루 바이오 리사치 가부시키가이샤 변형요소내장 분주팁, 변형요소내장 분주장치 및 변형요소내장 분주처리방법

Also Published As

Publication number Publication date
TWI417662B (zh) 2013-12-01
CN101403859A (zh) 2009-04-08
KR101057929B1 (ko) 2011-08-18
KR20090033803A (ko) 2009-04-06
JP2009086414A (ja) 2009-04-23
TW200935175A (en) 2009-08-16
CN101403859B (zh) 2013-06-19

Similar Documents

Publication Publication Date Title
JP5513711B2 (ja) 感光性樹脂組成物及びその硬化物
KR100997862B1 (ko) 감광성 수지 조성물 및 그것을 이용하여 얻어지는 플렉시블배선판
KR101073792B1 (ko) 광경화성 열경화성 수지 조성물, 그의 드라이 필름 및 경화물, 및 이들을 사용한 인쇄 배선판
JP5043516B2 (ja) 光硬化性・熱硬化性樹脂組成物及びそれを用いて得られるプリント配線
JP5301915B2 (ja) 難燃性光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5449688B2 (ja) 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5632146B2 (ja) 硬化性樹脂組成物
KR101212430B1 (ko) 난연성 광경화성 수지 조성물, 그의 드라이 필름 및 경화물, 및 이들을 이용한 인쇄 배선판
JP2010113241A (ja) 光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5854600B2 (ja) 光硬化性樹脂組成物
KR101693053B1 (ko) 난연성 광 경화성 수지 조성물, 그의 드라이 필름 및 경화물, 및 이들을 사용한 인쇄 배선판
KR101451435B1 (ko) 광경화성 수지 조성물, 경화물 패턴 및 인쇄 배선판
JP2013174920A (ja) 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5660690B2 (ja) 感光性樹脂組成物及びその硬化物
JP2012078869A (ja) 光硬化性・熱硬化性樹脂組成物及びそれを用いて得られるプリント配線板
JP5433209B2 (ja) 光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5575858B2 (ja) 難燃性光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090311

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100423

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20111214

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120110

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120312

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20120910

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120925

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121126

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130618

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130802

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20140228

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20140328

R150 Certificate of patent or registration of utility model

Ref document number: 5513711

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250