CN101373761A - 多芯片模块封装件 - Google Patents

多芯片模块封装件 Download PDF

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Publication number
CN101373761A
CN101373761A CNA2007103005651A CN200710300565A CN101373761A CN 101373761 A CN101373761 A CN 101373761A CN A2007103005651 A CNA2007103005651 A CN A2007103005651A CN 200710300565 A CN200710300565 A CN 200710300565A CN 101373761 A CN101373761 A CN 101373761A
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China
Prior art keywords
chip
adhesive agent
module package
bearing member
conduction adhesive
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CNA2007103005651A
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CN101373761B (zh
Inventor
黄志丰
蒋秋志
伍佑国
董利铭
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Fairchild Taiwan Corp
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System General Corp Taiwan
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Abstract

本发明公开了一种多芯片模块封装件，包括：第一芯片，通过第一导电黏着剂接置并电性连接至第一芯片承载件；第二芯片，通过第二导电黏着剂接置并电性连接至与所述第一芯片承载件隔开的第二芯片承载件，其中，所述第二导电黏着剂与第一导电黏着剂是由相同的黏着材料制成；多个导电元件，用以电性连接所述第一芯片至第二芯片；以及封装胶体，包覆所述第一芯片、第一芯片承载件、第二芯片、第二芯片承载件及多个导电元件，并使两芯片承载件部分外露出所述封装胶体，从而通过相互隔开的第一芯片承载件及第二芯片承载件隔离所述第一芯片与第二芯片。

Description

多芯片模块封装件
技术领域
本发明涉及多芯片模块封装件，尤指具有切换芯片及驱动芯片的多芯片模块封装件。
背景技术
智能型电源切换(Smart Power Switching：SPS)封装件为一种应用于电子产品的电源设备，其通常包括晶体管及控制集成电路，其中，所述晶体管为切换芯片，所述控制集成电路为驱动芯片。
鉴于现有智能型电源切换封装件的多种缺陷，美国专利号6,756,689公开一种如图5所示的封装结构。所述封装结构5包括一导线架的芯片座50。切换芯片51及驱动芯片52分别通过导电黏着剂53及绝缘黏着胶带54设置于所述芯片座50上。
但是，此封装结构5存在诸多缺点。例如，由于导电黏着剂53与绝缘黏着胶带54是由不同的材料制成，在将绝缘黏着胶带54接置于芯片座50之前须先执行一固化制程以固化导电黏着剂53，如此不仅增加了封装结构5的制程的复杂度，而且提高了制造成本。并且由于导电黏着剂53与绝缘黏着胶带54的材料不同，其热膨胀系数(Coefficientof Thermal Expansion：CTE)的不匹配导致随后的温度循环中不同的热应力施加于切换芯片51及驱动芯片52上，从而影响封装结构5的信赖性。此外，切换芯片51及驱动芯片52是共平面接置于芯片座50上，因而要求芯片座50的尺寸必须足够芯片接置。然而芯片座50的尺寸愈大，则来自芯片座50的热应力愈大，如此容易使芯片座50与封装胶体55之间发生脱层现象，严重影响封装结构5的信赖性。
如图6所示，美国专利号6,756,689复公开另一种封装结构6，包括：芯片座60；通过导电黏着剂62设置于所述芯片座60上的切换芯片61；通过绝缘黏着胶带64堆叠于所述切换芯片61上的驱动芯片63；以及包覆芯片座60、切换芯片61及驱动芯片63的封装胶体65。
此封装结构是将驱动芯片63堆叠于切换芯片61上而相对缩小芯片座60的尺寸，以避免脱层问题。然而由于导电黏着剂62与绝缘黏着胶带64是由不同的材料制成，在将绝缘黏着胶带64接置于切换芯片61之前仍须先执行固化制程以固化导电黏着剂62。而且由于现有固化制程通常会污染供接置绝缘黏着胶带64的切换芯片61的顶面610，还需执行一后处理制程以清洁所述顶面610，因而增加了总的制程复杂度并提高了制造成本。
如图7所示，美国专利号6,756,689还公开一种封装结构7，其通过一种液态不导电黏着剂74将驱动芯片73黏置于切换芯片71。然而所述液态不导电黏着剂74与导电黏着剂72为不同材料，如此须执行两独立的固化制程，不仅增加了制程复杂性，同时亦提高了制造成本。此外，由于驱动芯片73是通过液态不导电黏着剂74接置于切换芯片71上，因而可能发生芯片倾斜的现象，降低封装结构7的信赖度。
因此，如何改进多芯片模块封装件以有效克服上述现有结构所存在的缺陷，确为所需迫切解决的问题。
发明内容
鉴于前述现有技术的缺陷，本发明的目的在提供一种多芯片模块封装件，其使用相互隔离的芯片承载件及相同的芯片接置黏着剂以保证信赖性，并通过相同的芯片接置黏着剂简化制程、降低制造成本。
为达到前述及其它目的，本发明第一实施例的多芯片模块封装件包括：通过第一导电黏着剂接置并电性连接至第一芯片承载件的第一芯片；通过第二导电黏着剂接置并电性连接至第二芯片承载件的第二芯片，其中，所述第二芯片承载件与第一芯片承载件相互隔开，且所述第二导电黏着剂与第一导电黏着剂由相同的黏着材料制成；用以电性连接所述第一芯片至第二芯片的多个导电元件；以及包覆所述第一芯片、第一芯片承载件、第二芯片、第二芯片承载件及多个导电元件的封装胶体，其中所述第一芯片承载件及第二芯片承载件的部分外露出所述封装胶体。
其中，第一芯片承载件及第二芯片承载件可为导线架或基板，所述第一芯片及第二芯片分别为切换芯片及驱动芯片，所述导电元件为焊线，例如铜线或金线。
本发明第二实施例的多芯片模块封装件包括：芯片承载件；第一芯片，通过第一导电黏着剂接置并电性连接至所述芯片承载件；第二芯片，通过第二导电黏着剂堆叠并电性连接至所述第一芯片，其中，所述第二导电黏着剂与第一导电黏着剂是由相同的黏着材料制成；绝缘层，形成于所述第一芯片的主动面上并夹置于第一芯片及第二导电黏着剂之间以使第二芯片与第一芯片相互隔离；多个导电元件，用以电性连接所述第一芯片至第二芯片；以及封装胶体，包覆所述第一芯片、第二芯片、芯片承载件及多个导电元件，并使所述芯片承载件部分外露出所述封装胶体。
其中，所述绝缘层可由抗蚀剂材料或例如氧化物、氮化物等介电材料或其它不导电材料制成。
本发明第三实施例的多芯片模块封装件包括：芯片承载件；第一芯片，通过第一导电黏着剂接置并电性连接至所述芯片承载件；第二芯片，通过第二导电黏着剂堆叠至所述第一芯片，其中，所述第二导电黏着剂与第一导电黏着剂是由相同的黏着材料制成；绝缘层，形成于所述第二芯片的非主动面上并夹置于第二芯片及第二导电黏着剂之间以使第二芯片与第一芯片相互隔离；多个导电元件，用以电性连接所述第一芯片至第二芯片；以及封装胶体，包覆所述第一芯片、第二芯片、芯片承载件及多个导电元件，并使所述芯片承载件部分外露出所述封装胶体。
本发明第四实施例的多芯片模块封装件包括：芯片承载件；第一芯片，通过第一导电黏着剂接置并电性连接至所述芯片承载件；第二芯片，通过第二导电黏着剂接置并电性连接至所述芯片承载件，其中，所述第二导电黏着剂与第一导电黏着剂是由相同的黏着材料制成；绝缘层，形成于所述第二芯片的非主动面上并夹置于第二芯片及第二导电黏着剂之间以使第二芯片与第一芯片相互隔离；多个导电元件，用以电性连接所述第一芯片至第二芯片；以及封装胶体，包覆所述第一芯片、第二芯片、芯片承载件及多个导电元件，并使承载件部分外露出所述封装胶体。
其中，上述绝缘层可在晶圆级形成，亦即，可在将晶圆切割形成多个独立芯片之前在晶圆上形成上述绝缘层。
综上所述，由于第二导电黏着剂与第一导电黏着剂是由相同的黏着材料制成，可通过同一固化制程加以固化，从而简化了制程并降低了制造成本。绝缘层的设置保证了第一芯片与第二芯片之间的隔离。同时，相同材料制成的第二导电黏着剂与第一导电黏着剂有效克服了热膨胀系数不匹配的问题，从而可提高产品的信赖性。
附图说明
图1是本发明的多芯片模块封装件的第一实施例的剖面示意图；
图2是本发明的多芯片模块封装件的第二实施例的剖面示意图；
图3是本发明的多芯片模块封装件的第三实施例的剖面示意图；
图4是本发明的多芯片模块封装件的第四实施例的剖面示意图；
图5是现有技术的多芯片模块封装件的剖面示意图；
图6是另一现有技术的多芯片模块封装件的剖面示意图；以及
图7是再一现有技术的多芯片模块封装件的剖面示意图。
主要元件符号说明
1、2、3、4                   多芯片模块封装件
10                           第一芯片座
100                          底面
11、21、41、51、61、71       切换芯片
12、22、42                   第一导电黏着剂
13                           第二芯片座
130                          底面
14、23、33、43、52、63、73   驱动芯片
15、24、34、44               第二导电黏着剂
16、25、45                   焊线
17、26、46、55、65           封装胶体
20、40、50、60               芯片座
210                          主动面
211                          焊垫
27、37、47                   绝缘层
330              非主动面
401              顶面
440              底面
5、6、7          封装结构
53、62、72       导电黏着剂
54、64           绝缘黏着胶带
610              顶面
74               液态不导电黏着剂
具体实施方式
以下通过特定的具体实施例说明本发明的实施方式，本领域技术人员可由本说明书所揭示的内容轻易地了解本发明的其它优点与功效。
第一实施例
请参阅图1，为本发明的多芯片模块封装件的第一实施例的剖面示意图。如图1所示，所述多芯片模块封装件1包括：一导线架的第一芯片座10(出于简化目的，仅图标导线架的芯片座10)；切换芯片11，是通过第一导电黏着剂12接置并电性连接至所述第一芯片座10；所述导线架(未图标)的第二芯片座13，与所述第一芯片座10间隔一定距离；驱动芯片14，是通过第二导电黏着剂15接置并电性连接至所述第二芯片座13；多条焊线16，用以电性连接所述切换芯片11至驱动芯片14；以及封装胶体17，包覆所述第一芯片座10、第二芯片座13、切换芯片11、驱动芯片14、以及多条焊线16，并使第一芯片座10的底面100及第二芯片座13的底面130外露出所述封装胶体17。
由于第一芯片座10与第二芯片座13相互隔开，因而第一芯片座10与第二芯片座13的尺寸可较小，以相应减少随后的温度循环中施加其上的热应力，从而有效避免第一芯片座10及第二芯片座13与封装胶体17之间发生脱层，籍以提高所述多芯片模块封装件1的信赖性。
再者，由于相互隔开的第一芯片座10与第二芯片座13实现了切换芯片11与驱动芯片14之间的相互隔离，而第一导电黏着剂12及第二导电黏着剂15为同样的黏着材料例如银胶或焊料，因而只需执行单个固化制程即可同时固化第一导电黏着剂12及第二导电黏着剂15。相应地，第一导电黏着剂12及第二导电黏着剂15可同时施加至对应的第一及第二芯片座10、13，因此避免了现有技术中需在接置绝缘黏着胶带之前先接置导电黏着剂于芯片座上并固化的问题，从而简化了多芯片模块封装件1的制程并降低了成本。此外，相较现有技术需在固化制程完成后在黏置例如聚酰胺的绝缘黏着胶带之前进行必要的清洁制程以清洁受固化制程污染的绝缘黏着胶带的预定黏置区域，本实施例的固化制程是于焊晶制程结束后执行，第二芯片座13无污染之忧，因而不需任何后处理制程，从而有利于进一步简化制程并降低制造成本。
本实施例可使用例如金线或铜线等焊线电性连接切换芯片11与第一芯片座10以及驱动芯片14与第二芯片座13，为简化说明，图中未标示出上述焊线，并且由于打线作业为现有技术，在此略去详细描述。
封装胶体17可通过现有模压制程形成，在此同样略去详细描述。
第二实施例
请参阅图2，为本发明的多芯片模块封装件的第二实施例的剖面示意图。
如图所示，芯片模块封装件2具有一导线架(未图标)的芯片座20，切换芯片21通过第一导电黏着剂22接置于芯片座20并通过多条焊线(未图示)电性连接至所述芯片座20，随后将驱动芯片23通过第二导电黏着剂24堆叠于所述切换芯片21上并通过多条焊线25电性连接至所述切换芯片21，接着形成包覆芯片座20、切换芯片21、驱动芯片23及焊线25的封装胶体26，并使芯片座20的底面(未图示)外露出所述封装胶体26。
为确保切换芯片21与驱动芯片23的隔离，于切换芯片21的主动面210上形成绝缘层27。所述绝缘层27为氧化物或氮化物构成的介电层或阻层，其可形成于供切割形成单个切换芯片21的晶圆上。由于驱动芯片23通过绝缘层27而实现与切换芯片21的隔离，使得第二导电黏着剂24与第一导电黏着剂22可由相同的材料构成，因而可在驱动芯片23的焊晶制程结束后执行固化制程，以避免固化制程污染绝缘层27并使第二导电黏着剂24施加于绝缘层27上而不影响信赖性。
另外，由于固化制程是在焊晶制程及打线制程结束后执行，因而形成于切换芯片21的主动面210上并外露出绝缘层27的焊垫211不会受到污染，从而可保证切换芯片21与驱动芯片23之间通过焊线25实现的电性连接质量。
第三实施例
请参阅图3，为本发明的多芯片模块封装件的第三实施例的剖面示意图。
如图所示，本实施例的多芯片模块封装件3与上述第二实施例的多芯片模块封装件2的结构大体相似，区别仅在于本实施例的绝缘层37是形成于驱动芯片33的非主动面330上，夹置于第二导电黏着剂34与驱动芯片33之间。绝缘层37可形成于供切割形成单个驱动芯片33的晶圆(未图示)底面上，以便在多芯片模块封装件3的装配中无需执行额外的成形制程。
第四实施例
请参阅图4，为本发明的多芯片模块封装件的第四实施例的剖面示意图。
如图所示，本实施例的多芯片模块封装件4具有一导线架(未图标)的芯片座40，以供切换芯片41及驱动芯片43分别通过第一导电黏着剂42及第二导电黏着剂44接置于其上并通过多条焊线(未图示)与其电性连接。驱动芯片43复在其非主动面上形成有绝缘层47，以确保切换芯片41与驱动芯片43的隔离并使第一及第二导电黏着剂42、44得以通过相同的黏着材料制成。本实施例还利用多条焊线45电性连接切换芯片41与驱动芯片43，并形成包覆芯片座40、切换芯片41、驱动芯片43及焊线45的封装胶体46，并使芯片座40的底面440外露出所述封装胶体46。
由于第一及第二导电黏着剂42、44是由相同的黏着材料构成，因此可将第一及第二导电黏着剂42、44同时施加于芯片座40的顶面401，并在完成切换芯片41及驱动芯片43的焊晶制程后只需执行一次固化制程，相较现有技术，本实施例的多芯片模块封装件4的制程更为简化，同时由于固化制程是在焊晶制程及打线制程之后执行，芯片座40的顶面401的预定区域不会受到污染，如此得以提升多芯片模块封装件4的信赖性。
上述实施例仅例示性说明本发明的原理及其功效，而非用于限制本发明，任何本领域技术人员均可在不违背本发明的精神及范畴下，对上述实施例进行修饰与改变。因此，本发明的权利保护范围，应以权利要求书的范围为依据。

Claims (24)

1.一种多芯片模块封装件，包括：
第一芯片，通过第一导电黏着剂接置并电性连接至第一芯片承载件；
第二芯片，通过第二导电黏着剂接置并电性连接至第二芯片承载件，其中，所述第二芯片承载件与第一芯片承载件相互隔开，且所述第二导电黏着剂与第一导电黏着剂由相同的黏着材料制成；
多个导电元件，用以电性连接所述第一芯片至第二芯片；以及
封装胶体，包覆所述第一芯片、第一芯片承载件、第二芯片、第二芯片承载件及多个导电元件，并分别使第一芯片承载件及第二芯片承载件的部分外露出所述封装胶体。
2.根据权利要求1所述的多芯片模块封装件，其中，所述第一芯片承载件及第二芯片承载件为导线架，其分别具有一芯片座，以供接置所述第一芯片及第二芯片。
3.根据权利要求1所述的多芯片模块封装件，其中，所述导电元件为焊线。
4.根据权利要求1所述的多芯片模块封装件，其中，所述第一导电黏着剂与第二导电黏着剂为银胶。
5.根据权利要求1所述的多芯片模块封装件，其中，所述第一芯片为切换芯片，所述第二芯片为驱动芯片。
6.根据权利要求1所述的多芯片模块封装件，其中，所述第一芯片为驱动芯片，所述第二芯片为切换芯片。
7.一种多芯片模块封装件，包括：
芯片承载件；
第一芯片，通过第一导电黏着剂接置并电性连接至所述芯片承载件；
第二芯片，通过第二导电黏着剂堆叠并电性连接至所述第一芯片，其中，所述第二导电黏着剂与第一导电黏着剂是由相同的黏着材料制成；
绝缘层，形成于所述第一芯片上并夹置于第一芯片及第二导电黏着剂之间以使第二芯片与第一芯片相互隔离；
多个导电元件，用以电性连接所述第一芯片至第二芯片；以及
封装胶体，包覆所述第一芯片、第二芯片、芯片承载件及多个导电元件，并使所述芯片承载件部分外露出所述封装胶体。
8.根据权利要求7所述的多芯片模块封装件，其中，所述绝缘层为介电层或防焊层。
9.根据权利要求7所述的多芯片模块封装件，其中，所述绝缘层的材料为氧化物或氮化物。
10.根据权利要求7所述的多芯片模块封装件，其中，所述绝缘层形成于一用以形成第一芯片的晶圆上。
11.根据权利要求7所述的多芯片模块封装件，其中，所述导电元件为焊线。
12.根据权利要求7所述的多芯片模块封装件，其中，所述第一导电黏着剂与第二导电黏着剂为银胶。
13.一种多芯片模块封装件，包括：
芯片承载件；
第一芯片，通过第一导电黏着剂接置并电性连接至所述芯片承载件；
第二芯片，通过第二导电黏着剂堆叠至所述第一芯片，其中，所述第二导电黏着剂与第一导电黏着剂是由相同的黏着材料制成；
绝缘层，形成于所述第二芯片上并夹置于第二芯片及第二导电黏着剂之间以使第二芯片与第一芯片相互隔离；
多个导电元件，用以电性连接所述第一芯片至第二芯片；以及
封装胶体，包覆所述第一芯片、第二芯片、芯片承载件及多个导电元件，并使所述芯片承载件部分外露出所述封装胶体。
14.根据权利要求13所述的多芯片模块封装件，其中，所述绝缘层为介电层或防焊层。
15.根据权利要求13所述的多芯片模块封装件，其中，所述???绝缘层的材料为氧化物或氮化物。
16.根据权利要求13所述的多芯片模块封装件，其中，所述绝缘层形成于一用以形成第二芯片的晶圆上。
17.根据权利要求13所述的多芯片模块封装件，其中，所述导电元件为焊线。
18.根据权利要求13所述的多芯片模块封装件，其中，所述第一导电黏着剂与第二导电黏着剂为银胶。
19.一种多芯片模块封装件，包括：
芯片承载件；
第一芯片，通过第一导电黏着剂接置并电性连接至所述芯片承载件；
第二芯片，通过第二导电黏着剂接置并电性连接至所述芯片承载件，其中，所述第二导电黏着剂与第一导电黏着剂是由相同的黏着材料制成；
绝缘层，形成于所述第二芯片上并夹置于第二芯片及第二导电黏着剂之间以使第二芯片与第一芯片相互隔离；
多个导电元件，用以电性连接所述第一芯片至第二芯片；以及
封装胶体，包覆所述第一芯片、第二芯片、芯片承载件及多个导电元件，并使承载件部分外露出所述封装胶体。
20.根据权利要求19所述的多芯片模块封装件，其中，所述绝缘层为介电层或防焊层。
21.根据权利要求19所述的多芯片模块封装件，其中，所述绝缘层的材料为氧化物或氮化物。
22.根据权利要求19所述的多芯片模块封装件，其中，所述绝缘层形成于一用以形成第二芯片的晶圆上。
23.根据权利要求19所述的多芯片模块封装件，其中，所述导电元件为焊线。
24.根据权利要求19所述的多芯片模块封装件，其中，所述第一导电黏着剂与第二导电黏着剂为银胶。
CN2007103005651A 2007-08-20 2007-12-24 多芯片模块封装件 Expired - Fee Related CN101373761B (zh)

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