CN101373284B - Acf粘贴装置、平板显示器的制造装置及平板显示器 - Google Patents

Acf粘贴装置、平板显示器的制造装置及平板显示器 Download PDF

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Publication number
CN101373284B
CN101373284B CN2008102142317A CN200810214231A CN101373284B CN 101373284 B CN101373284 B CN 101373284B CN 2008102142317 A CN2008102142317 A CN 2008102142317A CN 200810214231 A CN200810214231 A CN 200810214231A CN 101373284 B CN101373284 B CN 101373284B
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CN
China
Prior art keywords
acf
aforesaid substrate
substrate
pressing mechanism
acf8
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN2008102142317A
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English (en)
Chinese (zh)
Other versions
CN101373284A (zh
Inventor
野本秀树
斧城淳
米泽仁志
三浦纮一郎
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Hitachi Ltd
Hitachi High Tech Corp
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Hitachi Ltd
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Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of CN101373284A publication Critical patent/CN101373284A/zh
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Publication of CN101373284B publication Critical patent/CN101373284B/zh
Expired - Fee Related legal-status Critical Current
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Wire Bonding (AREA)
CN2008102142317A 2007-08-21 2008-08-21 Acf粘贴装置、平板显示器的制造装置及平板显示器 Expired - Fee Related CN101373284B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007214892 2007-08-21
JP2007-214892 2007-08-21
JP2007214892A JP5096835B2 (ja) 2007-08-21 2007-08-21 Ａｃｆ貼付け装置及びフラットパネルディスプレイの製造装置

Publications (2)

Publication Number Publication Date
CN101373284A CN101373284A (zh) 2009-02-25
CN101373284B true CN101373284B (zh) 2010-09-15

Family

ID=40447523

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008102142317A Expired - Fee Related CN101373284B (zh) 2007-08-21 2008-08-21 Acf粘贴装置、平板显示器的制造装置及平板显示器

Country Status (4)

Country Link
JP (1) JP5096835B2 (ko)
KR (1) KR100967688B1 (ko)
CN (1) CN101373284B (ko)
TW (1) TWI392037B (ko)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4392766B2 (ja) * 2007-08-21 2010-01-06 株式会社日立ハイテクノロジーズ Ａｃｆ貼り付け装置
JP5337601B2 (ja) * 2009-07-03 2013-11-06 株式会社日立ハイテクノロジーズ 異方性導電フィルム貼り付け装置
CN101807371B (zh) * 2010-04-07 2011-09-28 苏州凯蒂亚半导体制造设备有限公司 平板显示器acf贴敷设备中的预校位装置
CN102184680A (zh) * 2010-09-30 2011-09-14 四川虹欧显示器件有限公司 用于绑定平板显示器的方法和装置
JP5273128B2 (ja) * 2010-11-15 2013-08-28 パナソニック株式会社 テープ貼着装置及びテープ貼着方法
CN102495487B (zh) * 2011-12-29 2014-05-14 苏州光宝康电子有限公司 用于全自动cog邦定机的本压单元
KR101663006B1 (ko) 2015-02-17 2016-10-06 주식회사 제이스텍 Acf 본딩 장치의 acf 리젝트 장치
JP6528116B2 (ja) * 2015-03-06 2019-06-12 パナソニックＩｐマネジメント株式会社 Ａｃｆ貼着方法及びａｃｆ貼着装置
CN105938263B (zh) * 2015-03-06 2020-09-25 松下知识产权经营株式会社 Acf粘贴方法以及acf粘贴装置
JP6393903B2 (ja) * 2015-03-06 2018-09-26 パナソニックＩｐマネジメント株式会社 Ａｃｆ貼着方法及びａｃｆ貼着装置
JP6393904B2 (ja) * 2015-03-06 2018-09-26 パナソニックＩｐマネジメント株式会社 Ａｃｆ貼着方法及びａｃｆ貼着装置
CN107390407A (zh) * 2017-08-24 2017-11-24 重庆市福显电子科技有限公司 一种液晶显示器和fpc的邦定方法
WO2019175934A1 (ja) * 2018-03-12 2019-09-19 堺ディスプレイプロダクト株式会社 熱圧着装置
JP7182036B2 (ja) * 2018-06-28 2022-12-02 パナソニックＩｐマネジメント株式会社 部品圧着装置、シート設置ユニットおよびシート設置ユニットの取付け方法
KR102072813B1 (ko) * 2018-10-18 2020-02-03 박호석 디스플레이 장치용 글라스의 테이프 부착장치
CN113054075B (zh) * 2021-03-09 2022-06-10 深圳市华星光电半导体显示技术有限公司 一种acf的贴合方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6501525B2 (en) * 2000-12-08 2002-12-31 Industrial Technology Research Institute Method for interconnecting a flat panel display having a non-transparent substrate and devices formed
JP3767474B2 (ja) * 2001-01-15 2006-04-19 セイコーエプソン株式会社 表示装置及びその製造方法
JP2003078238A (ja) 2001-09-03 2003-03-14 Asuriito Fa Kk 異方性導電体貼り付け装置および異方性導電体貼り付け方法
US7076867B2 (en) * 2001-12-28 2006-07-18 Matsushita Electric Industrial Co., Ltd. Pressurizing method
JP4417028B2 (ja) 2003-05-22 2010-02-17 株式会社タカトリ ダイシングフレームへのダイシングテープの貼り付け装置
JP4312648B2 (ja) 2004-04-14 2009-08-12 富士機械製造株式会社 テープ定量送り装置
JP4908051B2 (ja) * 2006-05-12 2012-04-04 東レエンジニアリング株式会社 異方性導電テープ貼付け装置

Also Published As

Publication number Publication date
CN101373284A (zh) 2009-02-25
KR20090019736A (ko) 2009-02-25
JP5096835B2 (ja) 2012-12-12
TW200931550A (en) 2009-07-16
JP2009049238A (ja) 2009-03-05
TWI392037B (zh) 2013-04-01
KR100967688B1 (ko) 2010-07-07

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