CN101341028A - 封装电连接部分 - Google Patents
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Abstract
本发明涉及一种封装电连接部分,该电连接部分是通过将密封剂(160)仅配送到电连接部分的第一侧上,并将密封剂(160)从电连接部分的第一侧引导到第二侧,其中第二侧大致朝向第一侧的背面来封装的。
Description
技术领域
本发明涉及封装电连接部分,通常流体喷射装置,诸如打印头,包括载体和流体喷射基底(或印模),例如使用诸如光刻法等的半导体加工方法、由硅或类似物形成。通常,电路互连是通过使用具有耦联到位于流体喷射基底上的结合垫(或结合焊点)的金属引线的柔性电路制成的。该金属引线和结合垫通常被封装保护。通常,通过将密封剂(或粘合剂)配送到柔性电路的底部、使密封剂固化、翻转柔性电路、将密封剂配送到柔性电路的顶部及结合垫之上、并使密封剂固化,从而完成封装。随后,将流体喷射基底和柔性电路被粘附到载体。然而,这在柔性电路所接附到的流体喷射基底上产生可能损坏流体喷射基底的应力。
附图说明
图1是根据本发明一实施例的流体喷射装置的实施例的剖视图;
图2是根据本发明另一实施例的、图1的流体喷射装置的一部分的顶视图;
图3是根据本发明另一实施例的、流体喷射装置的另一实施例的剖视图;以及
图4是根据本发明另一实施例的、流体喷射装置的一部分的顶视图。
具体实施方式
在本发明的下面的具体说明中,参考形成其一部分的附图,其中附图是通过图示的可以实践的具体实施例来表示的。这些实施例被相当详细地加以说明,以使得本领域技术人员能实践所公开的主题,且应理解到,可能利用其它实施例,并可以在不脱离请求保护的主题的范畴的情况下实施该过程、电气或机械变化。因此,下面的具体说明并不应以限制性的意义理解,且要求保护的主题的范畴仅由所附的权利要求及其等价物限定。
图1是根据一个实施例的、诸如打印头的流体喷射装置100的剖视图。流体喷射装置100包括可以由塑料、陶瓷、硅或类似物制造的载体110。流体喷射基底120(例如打印头模或基底)被粘附到载体110上。对于一个实施例,流体喷射基底120包括孔口(或喷嘴)122和电阻器124。电阻器124被选择性地供电以迅速加热被引导到该处的流体,例如:诸如墨水这样的标记流体,这导致流体以液滴的形式通过孔口122排出。要注意的是,流体喷射装置100相对于其正常操作取向(或方位)被倒置,从而使得孔口122朝上。在下文中,为了讨论图1,诸如“向上”和“向下”、“上”、“下”等术语将被使用并被理解为与图1相关。然而,要注意的是,对于一个实施例,流体喷射装置100在制造期间被定向为如图1所示。
垫片(或隔离件)130,例如聚合物层(或薄膜),也被粘附到载体110的上表面。垫片130大致与流体喷射基底120共面。垫片130的一端的一部分132被定位在距流体喷射基底120的横向距离为S1,例如大约125到250微米,以在流体喷射基底120的一侧和端部132之间形成通道134。对于一个实施例,端部132的厚度可以改变,例如,从大约100变到大约500微米。垫片130的端部的一部分136相对于端部132凹入,从而使得端部136被定位在距流体喷射基底120大于横向距离S1的横向距离S2处,以在端部136和流体喷射基底120的侧面之间形成通道扩展部138。要注意的是,通道134通向通道扩展部138。
如图1所示,一个柔性电路140粘附到垫片130上。对于一个实施例,柔性电路140被构造为浮动头(或飞行头)组件,并包括形成在薄膜144中且从薄膜144的一端延伸的电引线142。特别地,对于一个实施例,薄膜144的下部粘附到垫片130的上表面,例如通过热熔固。对于一个实施例,薄膜144可以是聚合物,诸如:聚酰亚胺、聚酯、聚萘乙烯(PEN)等等。对于另一个实施例,垫片130的厚度被选定为,使得当柔性电路140被粘附到其上时,电引线142的下表面143基本上与流体喷射基底120的上表面148齐平,使得电引线142与垫片120中的触点150对准,而孔口122终止在流体喷射装置120的上表面148处。要注意的是,触点150(或结合垫)电连接到一个或多个电阻器124。
图2是图1的一部分的顶视图,图示出覆盖流体喷射基底120的上表面148的柔性电路140的电引线142。要注意的是,每条电引线142分别对应于触点150。图2还示出了通道134的上部(或入口)部分。
对于一个实施例,在将柔性电路140粘附到垫片130上之后,电引线142的各端部被结合到它们在流体喷射基底120上的相应触点150,以在柔性电路140和流体喷射基底120之间形成电连接部分(或电连接装置)。备选地,在将柔性电路140粘附到垫片130上之前,可将各电引线142的端部结合到它们的相应的触点150上。对于一个实施例,传统的TAB结合器(或TAB焊接器)可以被用来将各电引线142的端部压入触点150中,如本领域中公知的。要注意的是,将各电引线142连接到触点150上是将电阻器124电连接到诸如打印机控制器这样的控制器,用于选择性地启动电阻器124。
在柔性电路140和流体喷射基底120之间形成电连接部分之后,使用密封剂160将电连接部分(或电连接装置)封装起来。例如使用一种针式分配或分配装置(needle dispense)将密封剂160被分配(或分布)到从大致一个方向,即上方,可接近的电连接的各部分上,并通过芯吸作用(或通过毛细管作用来携带)到基本上不能从上方可接近的电连接的各部分上。更具体地,密封剂160(图1和2)被分配到薄膜144的上表面145上、电引线142的上部分上、以及流体喷射基底120的上表面148上。密封剂160向下流经介于连续的相邻电引线142之间的间隙162(图2)、在电引线142周围、并通过通道134(图1)。
对于一个实施例,毛细管作用驱动密封剂160的流动。特别地,介于密封剂160的分子和界定间隙162的引线142的各表面之间的力使得密封剂160润湿这些表面、并产生将密封剂160牵引通过各间隙162的毛细管作用。类似地,介于密封剂160的分子和通道134的分界面(端部132和流体喷射基底120的侧面)之间的力产生将密封剂160牵引过通道134的毛细管作用。然而,当密封剂160到达通道扩展部138时,密封剂160的表面张力起作用,以防止端部132上的密封剂160流过通道扩展部138,因而停止了密封剂160的流动,如图1所示。因此,通道扩展部138起到毛细止动件的作用。
当密封剂160停止流动时,其完全封住介于柔性电路140和流体喷射基底120之间的电连接部分。这意味着,通过将密封剂160分配到从大致上方可接近的电连接的各部分上,并通过将密封剂160芯吸到基本上不能从上方可接近的电连接的各部分上,诸如通过使用通道134,可以完全封装电连接部分。这使得在封装以前而不是之后,流体喷射基底120能粘附到载体110上,正如常规做法。在封装以前而非以后将流体喷射基底120粘附到载体110上起到了减少电连接部分上的转移到流体喷射基底120的应力的作用。这些应力可能导致流体喷射基底120的过早失效,因为应力起到了撕开形成流体喷射基底120的各层的作用。
对于另一实施例,薄膜170,例如诸如聚酯薄膜(比如MYLAR LBT)的聚合物薄膜,可以在密封剂160固化之前被定位到密封剂160顶上(图1和2)。薄膜170帮助将一些密封剂160保持在电引线142的顶部上。对于一个实施例,密封剂160是糊剂,诸如环氧树脂。对于另一个实施例,是触变胶,诸如气相二氧化硅微粒(例如,大约0.1到大约1.0微米的微粒)、氧化铝微粒(例如,大约1.0到大约50微米的微粒)等,它们被添加到糊剂中以增强芯吸作用。对于另一实施例,密封剂160在大约20℃到大约25℃是糊剂,且当其被加热到大约65℃至大约145℃时,密封剂160被芯吸到各所需的位置。对于某些实施例,硅烷耦合剂被添加到密封剂160以增强芯吸作用。
对于另一实施例,密封剂160是干燥的并设置在诸如薄膜170的薄膜上,且该薄膜如图1中对薄膜170那样进行定位。如上所述,薄膜被加热到大约165℃,导致其液化并流动(或芯吸作用)到薄膜144的上表面145之上、各电引线142的上部以及流体喷射基底120的上表面148上,并芯吸作用经过间隙162(图2)并经过通道134。
对于某些实施例,图1中密封剂160所接触的各表面,即:薄膜144的上表面、电引线142、流体喷射基底120的上表面148和通道134的分界面,在将密封剂160分配到其上之前被加热,以改进润湿和粘附。对于一个实施例,处理是一种等离子体处理(或等离子蚀刻)或化学蚀刻,这些处理用来极化和粗糙化各表面。对于另一个实施例,激光被用来通过在表面上切割出沟槽以视表面粗糙化。
对于其它实施例,密封剂160到电引线142的下侧的流动,即通过间隙162和通道134,可能涉及到利用真空来将密封剂160牵引到电引线142的下侧、或利用压缩空气将密封剂160推动到电引线142的下侧。对于一个实施例,图1的组件可以受到离心作用,用以迫使密封剂160到达电引线142的下侧。对于某些实施例,使用一种针式分配器迫使密封剂160从顶部到达电引线142的下侧。对于某些实施例,使用一种注射器迫使密封剂160通过针。
图3和图4分别是根据另一实施例的、流体喷射装置300的剖面图和顶视图。在图3和4中的部件类似于图1和2中的部件,且如上所述使用与图1和2中相同的附图标记。在图3和4中,柔性电路240被粘附到垫片130的上表面上,例如通过诸如环氧树脂这样的粘接剂。柔性电路240包括暴露在薄膜246的上表面244处的触点(或结合垫)242,如图3和4所示。对于一个实施例,薄膜244可以是聚合物,诸如:聚酰亚胺、聚酯、聚萘乙烯(PEN)等等。导电迹线(或导线)248被设置在薄膜246中,且分别电连接到触点242。如本领域中公知的,触点242分别使用线结合250电连接到流体喷射基底120的触点150,以在柔性电路240和流体喷射基底120之间形成电连接部分。
在柔性电路240和流体喷射基底120之间的电连接部分的封装,例如线结合250、触点242和触点150使用密封剂160的封装,总体上正如上面结合图1和2所说明的。这就是,密封剂160从上方分配,并芯吸作用向下通过介于连续相邻的结合线线250(图4)之间的间隙262、在结合线250周围、并穿过通道134(图3)。当密封剂160遇到通道扩展部138时,芯吸作用停止。对于一个实施例,薄膜170将一些密封剂160保持在结合线250的顶部上。对于另外的实施例,如上所述,对图3中的密封剂所接触的表面在将密封剂160分配到其上之前进行处理,以改进润湿和粘附。
结论
尽管在本文中已经图示并说明了具体实施例,显然其本意是所要求保护的主题的范畴仅由下列权利要求及其等价物限制。
Claims (10)
1、一种封装电连接部分的方法,它包括:
仅将密封剂(160)分配到电连接部分的第一侧上;和
将所述密封剂(160)从所述电连接部分的所述第一侧引导到第二侧,其中所述第二侧大致面向所述第一侧的背面。
2、如权利要求1所述的方法,其特征在于,将所述密封剂(160)引导到所述电连接部分的所述第二侧包括芯吸所述密封剂(160)。
3、如权利要求1或2所述的方法,其特征在于,将所述密封剂(160)引导到所述电连接部分的所述第二侧包括引导所述密封剂(160)在所述电连接部分的引线(142)或线结合(250)之间通过间隙(162、262)。
4、如权利要求3所述的方法,其特征在于,将所述密封剂(160)引导到所述电连接部分的所述第二侧还包括引导所述密封剂(160)穿过由所述引线(142)或所述线结合(250)跨越的通道(134)。
5、如权利要求1-4中任一项所述的方法,其特征在于,其还包括使用毛细作用止动件(138)使所述密封剂(160)停止。
6、如权利要求1-5中任一项所述的方法,其特征在于,其还包括在分配所述密封剂(160)之前,处理要由所述密封剂(160)接触的表面。
7、如权利要求1-6中任一项所述的方法,其特征在于,其还包括将薄膜(170)设置到一部分所述密封剂(160)上,以将一些所述密封剂(160)保持在所述电连接部分的所述第一侧上。
8、如权利要求1-7中任一项所述的方法,其特征在于,将所述密封剂(160)分配到所述电连接部分的所述第一侧上包括加热所述密封剂(160)。
9、如权利要求1-8中任一项所述的方法,其特征在于,将所述密封剂(160)分配到所述电连接部分的所述第一侧上包括加热设置在薄膜(170)上的干燥密封剂(160)以液化所述密封剂(160)。
10、如权利要求1所述的方法,其特征在于,将所述密封剂(160)引导到所述电连接部分的所述第二侧包括利用真空将所述密封剂(160)牵引到所述第二侧,对所述第一侧上的所述密封剂(160)加压以推动所述密封剂(160)到所述第二侧,或将所述密封剂(160)从所述第一侧离心分离到所述第二侧上。
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105269970A (zh) * | 2014-06-20 | 2016-01-27 | 意法半导体公司 | 具有在刚性衬底上的裸片的微流体递送系统 |
TWI567835B (zh) * | 2013-10-28 | 2017-01-21 | 惠普發展公司有限責任合夥企業 | 以低輪廓包覆體包覆接合線之技術 |
US9561657B2 (en) | 2014-06-20 | 2017-02-07 | Stmicroelectronics S.R.L. | Microfluidic delivery member with filter and method of forming same |
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Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7749887B2 (en) * | 2007-12-18 | 2010-07-06 | Micron Technology, Inc. | Methods of fluxless micro-piercing of solder balls, and resulting devices |
KR101834023B1 (ko) | 2010-05-20 | 2018-03-02 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 가요성 회로 커버필름 부착성 향상 |
CN103625116B (zh) * | 2012-08-27 | 2016-09-07 | 研能科技股份有限公司 | 喷墨头结构 |
WO2020068081A1 (en) * | 2018-09-27 | 2020-04-02 | Hewlett-Packard Development Company, L.P. | Carriers including fluid ejection dies |
JP2023004128A (ja) * | 2021-06-25 | 2023-01-17 | キヤノン株式会社 | 液体吐出ヘッド |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8911607D0 (en) | 1989-05-19 | 1989-07-05 | Emi Plc Thorn | A method of encapsulation for electronic devices and devices so encapsulated |
US5258331A (en) * | 1989-10-20 | 1993-11-02 | Texas Instruments Incorporated | Method of manufacturing resin-encapsulated semiconductor device package using photoresist or pre-peg lead frame dam bars |
US5736998A (en) | 1995-03-06 | 1998-04-07 | Hewlett-Packard Company | Inkjet cartridge design for facilitating the adhesive sealing of a printhead to an ink reservoir |
US6074895A (en) * | 1997-09-23 | 2000-06-13 | International Business Machines Corporation | Method of forming a flip chip assembly |
US6318843B1 (en) * | 1997-10-23 | 2001-11-20 | Hewlett-Packard Company | Control of adhesive flow in an inkjet printer printhead |
US6495083B2 (en) * | 1997-10-29 | 2002-12-17 | Hestia Technologies, Inc. | Method of underfilling an integrated circuit chip |
JPH11214450A (ja) | 1997-11-18 | 1999-08-06 | Matsushita Electric Ind Co Ltd | 電子部品実装体とそれを用いた電子機器と電子部品実装体の製造方法 |
US6248614B1 (en) * | 1999-03-19 | 2001-06-19 | International Business Machines Corporation | Flip-chip package with optimized encapsulant adhesion and method |
US6364475B2 (en) | 1999-04-30 | 2002-04-02 | Hewlett-Packard Company | Inkjet print cartridge design to decrease ink shorts due to ink penetration of the printhead |
US6402299B1 (en) | 1999-10-22 | 2002-06-11 | Lexmark International, Inc. | Tape automated bonding circuit for use with an ink jet cartridge assembly in an ink jet printer |
US6322200B1 (en) | 1999-10-29 | 2001-11-27 | Hewlett-Packard Company | Decoupled nozzle plate and electrical flexible circuit for an inkjet print cartridge |
DE10109327A1 (de) | 2001-02-27 | 2002-09-12 | Infineon Technologies Ag | Halbleiterchip und Herstellungsverfahren für ein Gehäuse |
US6554399B2 (en) | 2001-02-27 | 2003-04-29 | Hewlett-Packard Development Company, L.P. | Interconnected printhead die and carrier substrate system |
US6641254B1 (en) * | 2002-04-12 | 2003-11-04 | Hewlett-Packard Development Company, L.P. | Electronic devices having an inorganic film |
US6834937B2 (en) | 2002-08-13 | 2004-12-28 | Lexmark International, Inc. | Printhead corrosion protection |
US6764165B2 (en) | 2002-09-30 | 2004-07-20 | Hewlett-Packard Development Company, L.P. | Fluid ejection device and method of manufacturing a fluid ejection device |
US6913343B2 (en) | 2003-04-30 | 2005-07-05 | Hewlett-Packard Development Company, L.P. | Methods for forming and protecting electrical interconnects and resultant assemblies |
US7121647B2 (en) | 2003-10-03 | 2006-10-17 | Lexmark International, Inc. | Method of applying an encapsulant material to an ink jet printhead |
JP2005132102A (ja) | 2003-10-09 | 2005-05-26 | Canon Inc | インクジェットヘッドおよび該ヘッドを備えるインクジェットプリント装置 |
US7229152B2 (en) | 2003-10-31 | 2007-06-12 | Hewlett-Packard Development Company, L.P. | Fluid ejection device with insulating feature |
JP4290154B2 (ja) | 2004-12-08 | 2009-07-01 | キヤノン株式会社 | 液体吐出記録ヘッドおよびインクジェット記録装置 |
-
2005
- 2005-10-24 US US11/257,273 patent/US7691675B2/en not_active Expired - Fee Related
-
2006
- 2006-07-27 WO PCT/US2006/029215 patent/WO2007050166A1/en active Application Filing
- 2006-07-27 EP EP06788668A patent/EP1940625B1/en not_active Expired - Fee Related
- 2006-07-27 CN CN2006800479556A patent/CN101341028B/zh not_active Expired - Fee Related
- 2006-07-27 DE DE602006006331T patent/DE602006006331D1/de active Active
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109892702A (zh) * | 2011-12-08 | 2019-06-18 | 菲利普莫里斯生产公司 | 具有内加热器的气雾生成装置 |
US11638793B2 (en) | 2011-12-08 | 2023-05-02 | Philip Morris Products S.A. | Aerosol generating device having an internal heater |
TWI567835B (zh) * | 2013-10-28 | 2017-01-21 | 惠普發展公司有限責任合夥企業 | 以低輪廓包覆體包覆接合線之技術 |
US10946658B2 (en) | 2013-10-28 | 2021-03-16 | Hewlett-Packard Development Company, L.P. | Encapsulating a bonded wire with low profile encapsulation |
CN105269970A (zh) * | 2014-06-20 | 2016-01-27 | 意法半导体公司 | 具有在刚性衬底上的裸片的微流体递送系统 |
US9561657B2 (en) | 2014-06-20 | 2017-02-07 | Stmicroelectronics S.R.L. | Microfluidic delivery member with filter and method of forming same |
US10264667B2 (en) | 2014-06-20 | 2019-04-16 | Stmicroelectronics, Inc. | Microfluidic delivery system with a die on a rigid substrate |
US11523500B2 (en) | 2014-06-20 | 2022-12-06 | Stmicroelectronics International N.V. | Microfluidic delivery system with a die on a rigid substrate |
Also Published As
Publication number | Publication date |
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EP1940625A1 (en) | 2008-07-09 |
US20070093001A1 (en) | 2007-04-26 |
DE602006006331D1 (de) | 2009-05-28 |
CN101341028B (zh) | 2010-06-09 |
US7691675B2 (en) | 2010-04-06 |
WO2007050166A1 (en) | 2007-05-03 |
EP1940625B1 (en) | 2009-04-15 |
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