DE602006006331D1 - Verkapselnde elektrische verbindungen - Google Patents

Verkapselnde elektrische verbindungen

Info

Publication number
DE602006006331D1
DE602006006331D1 DE602006006331T DE602006006331T DE602006006331D1 DE 602006006331 D1 DE602006006331 D1 DE 602006006331D1 DE 602006006331 T DE602006006331 T DE 602006006331T DE 602006006331 T DE602006006331 T DE 602006006331T DE 602006006331 D1 DE602006006331 D1 DE 602006006331D1
Authority
DE
Germany
Prior art keywords
electrical connections
capacitive electrical
capacitive
connections
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006006331T
Other languages
English (en)
Inventor
Carlos Garcia
Jeffery M Igelman
Paul Schweitzer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Development Co LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co LP filed Critical Hewlett Packard Development Co LP
Publication of DE602006006331D1 publication Critical patent/DE602006006331D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
DE602006006331T 2005-10-24 2006-07-27 Verkapselnde elektrische verbindungen Active DE602006006331D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/257,273 US7691675B2 (en) 2005-10-24 2005-10-24 Encapsulating electrical connections
PCT/US2006/029215 WO2007050166A1 (en) 2005-10-24 2006-07-27 Encapsulating electrical connections

Publications (1)

Publication Number Publication Date
DE602006006331D1 true DE602006006331D1 (de) 2009-05-28

Family

ID=37135924

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006006331T Active DE602006006331D1 (de) 2005-10-24 2006-07-27 Verkapselnde elektrische verbindungen

Country Status (5)

Country Link
US (1) US7691675B2 (de)
EP (1) EP1940625B1 (de)
CN (1) CN101341028B (de)
DE (1) DE602006006331D1 (de)
WO (1) WO2007050166A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7749887B2 (en) * 2007-12-18 2010-07-06 Micron Technology, Inc. Methods of fluxless micro-piercing of solder balls, and resulting devices
US20110284268A1 (en) * 2010-05-20 2011-11-24 3M Innovative Properties Company Flexible circuit coverfilm adhesion enhancement
UA113744C2 (xx) * 2011-12-08 2017-03-10 Пристрій для утворення аерозолю з внутрішнім нагрівачем
CN103625116B (zh) * 2012-08-27 2016-09-07 研能科技股份有限公司 喷墨头结构
CN108583018B (zh) 2013-10-28 2019-11-15 惠普发展公司有限责任合伙企业 以低轮廓封装体封装键合线的方法
US10264667B2 (en) 2014-06-20 2019-04-16 Stmicroelectronics, Inc. Microfluidic delivery system with a die on a rigid substrate
US9259754B2 (en) 2014-06-20 2016-02-16 Stmicroelectronics Asia Pacific Pte Ltd Microfluidic delivery member with filter and method of forming same
US11358390B2 (en) 2018-09-27 2022-06-14 Hewlett-Packard Development Company, L.P. Carriers including fluid ejection dies
JP2023004128A (ja) * 2021-06-25 2023-01-17 キヤノン株式会社 液体吐出ヘッド

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8911607D0 (en) * 1989-05-19 1989-07-05 Emi Plc Thorn A method of encapsulation for electronic devices and devices so encapsulated
US5258331A (en) * 1989-10-20 1993-11-02 Texas Instruments Incorporated Method of manufacturing resin-encapsulated semiconductor device package using photoresist or pre-peg lead frame dam bars
US5736998A (en) * 1995-03-06 1998-04-07 Hewlett-Packard Company Inkjet cartridge design for facilitating the adhesive sealing of a printhead to an ink reservoir
US6074895A (en) * 1997-09-23 2000-06-13 International Business Machines Corporation Method of forming a flip chip assembly
US20010043252A1 (en) * 1997-10-23 2001-11-22 Hewlett-Packard Company Control of adhesive flow in an inkjet printer printhead
US6495083B2 (en) * 1997-10-29 2002-12-17 Hestia Technologies, Inc. Method of underfilling an integrated circuit chip
JPH11214450A (ja) 1997-11-18 1999-08-06 Matsushita Electric Ind Co Ltd 電子部品実装体とそれを用いた電子機器と電子部品実装体の製造方法
US6248614B1 (en) * 1999-03-19 2001-06-19 International Business Machines Corporation Flip-chip package with optimized encapsulant adhesion and method
US6364475B2 (en) * 1999-04-30 2002-04-02 Hewlett-Packard Company Inkjet print cartridge design to decrease ink shorts due to ink penetration of the printhead
US6402299B1 (en) * 1999-10-22 2002-06-11 Lexmark International, Inc. Tape automated bonding circuit for use with an ink jet cartridge assembly in an ink jet printer
US6322200B1 (en) * 1999-10-29 2001-11-27 Hewlett-Packard Company Decoupled nozzle plate and electrical flexible circuit for an inkjet print cartridge
US6554399B2 (en) * 2001-02-27 2003-04-29 Hewlett-Packard Development Company, L.P. Interconnected printhead die and carrier substrate system
DE10109327A1 (de) * 2001-02-27 2002-09-12 Infineon Technologies Ag Halbleiterchip und Herstellungsverfahren für ein Gehäuse
US6641254B1 (en) * 2002-04-12 2003-11-04 Hewlett-Packard Development Company, L.P. Electronic devices having an inorganic film
US6834937B2 (en) * 2002-08-13 2004-12-28 Lexmark International, Inc. Printhead corrosion protection
US6764165B2 (en) * 2002-09-30 2004-07-20 Hewlett-Packard Development Company, L.P. Fluid ejection device and method of manufacturing a fluid ejection device
US6913343B2 (en) * 2003-04-30 2005-07-05 Hewlett-Packard Development Company, L.P. Methods for forming and protecting electrical interconnects and resultant assemblies
US7121647B2 (en) * 2003-10-03 2006-10-17 Lexmark International, Inc. Method of applying an encapsulant material to an ink jet printhead
JP2005132102A (ja) * 2003-10-09 2005-05-26 Canon Inc インクジェットヘッドおよび該ヘッドを備えるインクジェットプリント装置
US7229152B2 (en) * 2003-10-31 2007-06-12 Hewlett-Packard Development Company, L.P. Fluid ejection device with insulating feature
JP4290154B2 (ja) 2004-12-08 2009-07-01 キヤノン株式会社 液体吐出記録ヘッドおよびインクジェット記録装置

Also Published As

Publication number Publication date
EP1940625B1 (de) 2009-04-15
US7691675B2 (en) 2010-04-06
EP1940625A1 (de) 2008-07-09
CN101341028B (zh) 2010-06-09
CN101341028A (zh) 2009-01-07
US20070093001A1 (en) 2007-04-26
WO2007050166A1 (en) 2007-05-03

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Legal Events

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