CN101291973A - 热固性树脂组合物和光半导体密封材料 - Google Patents
热固性树脂组合物和光半导体密封材料 Download PDFInfo
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- CN101291973A CN101291973A CNA2006800387056A CN200680038705A CN101291973A CN 101291973 A CN101291973 A CN 101291973A CN A2006800387056 A CNA2006800387056 A CN A2006800387056A CN 200680038705 A CN200680038705 A CN 200680038705A CN 101291973 A CN101291973 A CN 101291973A
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Abstract
Description
实施例1 | 实施例2 | 实施例3 | 实施例4 | 实施例5 | 实施例6 | 比较例1 | 比较例2 | 比较例3 | |
成分(A)(份) | 样品1100 | 样品1100 | 样品2100 | 样品3100 | 样品4100 | 样品5100 | DE4100 | DE4100 | EE100 |
成分(B)(份) | MeHHPA50 | MeHHPA50 | MeHHPA44 | MeHHPA50 | MeHHPA39 | MeHHPA64 | MeHHPA87 | MeHHPA87 | MeHHPA81 |
成分(C)(份) | DMBnA0.4 | DMBnA0.4 | DMBnA0.4 | DMBnA0.4 | DMBnA0.4 | DMBnA0.4 | DMBnA0.4 | DMBnA0.4 | DMBnA0.4 |
成分(E)(份) | 无 | EG5 | EG5 | EG5 | EG5 | EG5 | 无 | EG5 | EG5 |
实施例1 | 实施例2 | 实施例3 | 实施例4 | 实施例5 | 实施例6 | 比较例1 | 比较例2 | 比较例3 | |
Tg | 190℃ | 170℃ | 165℃ | 158℃ | 170℃ | 170℃ | 220℃ | 165℃ | 160℃ |
热冲击性 | 55次 | >200次 | 150次 | 90次 | >200次 | >300次 | 25次 | 160次 | 40次 |
密合性 | 40次 | >200次 | 100次 | 85次 | >200次 | >300次 | 20次 | 180次 | 25次 |
耐光性 | ○88% | ○87% | ○85% | ○89% | ◎93% | ◎90% | ×48% | ×50% | △62% |
焊锡耐热性 | 100% | 98% | 96% | 97% | 98% | 97% | 100% | 80% | 75% |
LED耐久性 | ○90% | ○88% | ○86% | ○90% | ◎91% | ◎90% | ×58% | ×39% | ×42% |
保存稳定性 | 1.1 | 1.2 | 1.2 | 1.5 | 1.8 | 1.9 | 1.2 | 1.2 | 2.3 |
Claims (16)
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JP2005303292 | 2005-10-18 | ||
JP303292/2005 | 2005-10-18 | ||
PCT/JP2006/320711 WO2007046399A1 (ja) | 2005-10-18 | 2006-10-18 | 熱硬化性樹脂組成物及び光半導体封止材 |
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CN101291973A true CN101291973A (zh) | 2008-10-22 |
CN101291973B CN101291973B (zh) | 2012-10-17 |
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US (1) | US7932319B2 (zh) |
EP (2) | EP1947128B1 (zh) |
JP (1) | JP4322949B2 (zh) |
KR (1) | KR101011421B1 (zh) |
CN (1) | CN101291973B (zh) |
MY (1) | MY145608A (zh) |
TW (1) | TW200722456A (zh) |
WO (1) | WO2007046399A1 (zh) |
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- 2006-10-18 TW TW095138447A patent/TW200722456A/zh not_active IP Right Cessation
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Cited By (8)
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CN101684198A (zh) * | 2008-09-22 | 2010-03-31 | 日东电工株式会社 | 热固化性组合物 |
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CN103165764A (zh) * | 2011-12-16 | 2013-06-19 | 展晶科技(深圳)有限公司 | 发光二极管封装方法 |
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CN113614193A (zh) * | 2019-04-02 | 2021-11-05 | 信越化学工业株式会社 | 加成固化型有机硅粘接剂组合物 |
CN113614193B (zh) * | 2019-04-02 | 2024-04-05 | 信越化学工业株式会社 | 加成固化型有机硅粘接剂组合物 |
CN113462333A (zh) * | 2020-03-31 | 2021-10-01 | 京瓷株式会社 | 各向异性导电性树脂组合物和微型led显示装置 |
Also Published As
Publication number | Publication date |
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EP2508545A1 (en) | 2012-10-10 |
MY145608A (en) | 2012-03-15 |
CN101291973B (zh) | 2012-10-17 |
US20090258992A1 (en) | 2009-10-15 |
KR101011421B1 (ko) | 2011-01-28 |
KR20080056305A (ko) | 2008-06-20 |
EP1947128A4 (en) | 2012-01-04 |
WO2007046399A1 (ja) | 2007-04-26 |
EP1947128A1 (en) | 2008-07-23 |
EP1947128B1 (en) | 2013-10-09 |
EP2508545B1 (en) | 2014-06-18 |
JPWO2007046399A1 (ja) | 2009-04-23 |
TW200722456A (en) | 2007-06-16 |
TWI373485B (zh) | 2012-10-01 |
JP4322949B2 (ja) | 2009-09-02 |
US7932319B2 (en) | 2011-04-26 |
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