CN101275062A - 粘合剂组合物、粘合片以及半导体装置的制造方法 - Google Patents

粘合剂组合物、粘合片以及半导体装置的制造方法 Download PDF

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Publication number
CN101275062A
CN101275062A CNA2008100883362A CN200810088336A CN101275062A CN 101275062 A CN101275062 A CN 101275062A CN A2008100883362 A CNA2008100883362 A CN A2008100883362A CN 200810088336 A CN200810088336 A CN 200810088336A CN 101275062 A CN101275062 A CN 101275062A
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China
Prior art keywords
adhesive
weight
adhesive composition
chip
adhesive layer
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Chinese (zh)
Inventor
市川功
佐伯尚哉
贱机弘宪
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Lintec Corp
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Lintec Corp
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Publication of CN101275062A publication Critical patent/CN101275062A/zh
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    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer

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  • Adhesive Tapes (AREA)
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TWI397568B (zh) * 2008-11-28 2013-06-01 琳得科股份有限公司 半導體晶片層合體及半導體晶片層合用接著劑組成物
CN103140558A (zh) * 2010-09-30 2013-06-05 株式会社Kcc 用于制备半导体封装的粘合剂组合物及粘合片材
CN103262172A (zh) * 2010-11-03 2013-08-21 弗赖斯金属有限公司 烧结材料及使用该材料的附着方法
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CN109825223A (zh) * 2017-11-23 2019-05-31 Ｋｃｃ公司 粘合剂组合物以及利用其的粘合膜
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