JP2008247936A - 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法 - Google Patents

粘接着剤組成物、粘接着シートおよび半導体装置の製造方法 Download PDF

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Publication number
JP2008247936A
JP2008247936A JP2007087217A JP2007087217A JP2008247936A JP 2008247936 A JP2008247936 A JP 2008247936A JP 2007087217 A JP2007087217 A JP 2007087217A JP 2007087217 A JP2007087217 A JP 2007087217A JP 2008247936 A JP2008247936 A JP 2008247936A
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Japan
Prior art keywords
adhesive
adhesive layer
adhesive composition
chip
epoxy resin
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JP2007087217A
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English (en)
Japanese (ja)
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JP2008247936A5 (enExample
Inventor
Isao Ichikawa
功 市川
Naoya Saeki
尚哉 佐伯
Hironori Shizuhata
弘憲 賤機
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Lintec Corp
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Lintec Corp
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Priority to JP2007087217A priority Critical patent/JP2008247936A/ja
Priority to US12/055,427 priority patent/US20080242058A1/en
Priority to TW097111228A priority patent/TW200904924A/zh
Priority to CNA2008100883362A priority patent/CN101275062A/zh
Priority to KR1020080028784A priority patent/KR20080088487A/ko
Publication of JP2008247936A publication Critical patent/JP2008247936A/ja
Publication of JP2008247936A5 publication Critical patent/JP2008247936A5/ja
Pending legal-status Critical Current

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    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
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    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2007087217A 2007-03-29 2007-03-29 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法 Pending JP2008247936A (ja)

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US12/055,427 US20080242058A1 (en) 2007-03-29 2008-03-26 Adhesive Composition, Adhesive Sheet and Production Process for Semiconductor Device
TW097111228A TW200904924A (en) 2007-03-29 2008-03-28 Adhesive composition, adhesive sheet and production process for semiconductor device
CNA2008100883362A CN101275062A (zh) 2007-03-29 2008-03-28 粘合剂组合物、粘合片以及半导体装置的制造方法
KR1020080028784A KR20080088487A (ko) 2007-03-29 2008-03-28 점접착제 조성물, 점접착 시트 및 반도체장치의 제조방법

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010222390A (ja) * 2009-03-19 2010-10-07 Lintec Corp 接着剤組成物、接着シートおよび半導体装置の製造方法
WO2013157567A1 (ja) * 2012-04-17 2013-10-24 リンテック株式会社 接着剤組成物、接着シートおよび半導体装置の製造方法
JP2014088567A (ja) * 2013-12-13 2014-05-15 Jnc Corp 光硬化性インクジェット用インク
JP2019506503A (ja) * 2016-10-05 2019-03-07 エルジー・ケム・リミテッド 半導体接着用樹脂組成物、半導体用接着フィルムおよびダイシングダイボンディングフィルム

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4697243B2 (ja) * 2008-02-22 2011-06-08 セイコーエプソン株式会社 接合体および接合方法
JP5089560B2 (ja) * 2008-11-28 2012-12-05 リンテック株式会社 半導体チップ積層体および半導体チップ積層用接着剤組成物
KR101035873B1 (ko) * 2008-12-24 2011-05-19 제일모직주식회사 고온 속경화형 접착필름 조성물 및 이를 이용한 접착필름
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KR102713298B1 (ko) * 2010-11-03 2024-10-04 알파 어셈블리 솔루션스 인크. 소결 재료 및 이를 이용한 부착 방법
WO2013042203A1 (ja) * 2011-09-20 2013-03-28 日立化成株式会社 接着剤組成物、フィルム状接着剤、接着シート、回路接続体及び回路部材の接続方法
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KR20190059648A (ko) * 2017-11-23 2019-05-31 주식회사 케이씨씨 접착제 조성물 및 이를 사용한 접착필름
CN113710762B (zh) * 2019-02-26 2023-08-04 艾利丹尼森公司 具有高剪切和剥离性质的psa组合物
CN112940658A (zh) * 2021-02-01 2021-06-11 南宁珀源能源材料有限公司 一种粘棒胶及其制备方法和应用

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH108001A (ja) * 1996-06-25 1998-01-13 Lintec Corp 粘接着テープおよびその使用方法
JP2001345349A (ja) * 2000-06-01 2001-12-14 Sony Chem Corp 接続材料及び接続構造体
JP2003147299A (ja) * 2001-11-09 2003-05-21 Hitachi Chem Co Ltd 接着シートならびに半導体装置およびその製造方法
JP2004156036A (ja) * 2002-10-18 2004-06-03 Hitachi Chem Co Ltd 硬化性樹脂の硬化促進剤、硬化性樹脂組成物、電子部品装置、及びホスフィン誘導体の製造方法
JP2004356412A (ja) * 2003-05-29 2004-12-16 Nitto Denko Corp ダイシング・ダイボンドフィルム
JP2005340746A (ja) * 2004-04-30 2005-12-08 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置、ならびに半導体装置の製法
JP2006073982A (ja) * 2004-09-02 2006-03-16 Sumitomo Bakelite Co Ltd 半導体用接着フィルム及びこれを用いた半導体装置
JP2006269887A (ja) * 2005-03-25 2006-10-05 Sumitomo Bakelite Co Ltd 半導体用接着フィルム及びこれを用いた半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0715087B2 (ja) * 1988-07-21 1995-02-22 リンテック株式会社 粘接着テープおよびその使用方法
JP4275221B2 (ja) * 1998-07-06 2009-06-10 リンテック株式会社 粘接着剤組成物および粘接着シート
EP1586615B1 (en) * 1999-06-18 2007-08-15 Hitachi Chemical Company, Ltd. Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same
KR100889101B1 (ko) * 2000-02-15 2009-03-17 히다치 가세고교 가부시끼가이샤 접착제 조성물, 그 제조 방법, 이것을 이용한 접착 필름,반도체 탑재용 기판 및 반도체 장치
US20050267286A1 (en) * 2003-10-20 2005-12-01 Shinya Nakamura Curing accelerator for curing resin, curing resin composition, electronic component device and method for producing phosphine derivative

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH108001A (ja) * 1996-06-25 1998-01-13 Lintec Corp 粘接着テープおよびその使用方法
JP2001345349A (ja) * 2000-06-01 2001-12-14 Sony Chem Corp 接続材料及び接続構造体
JP2003147299A (ja) * 2001-11-09 2003-05-21 Hitachi Chem Co Ltd 接着シートならびに半導体装置およびその製造方法
JP2004156036A (ja) * 2002-10-18 2004-06-03 Hitachi Chem Co Ltd 硬化性樹脂の硬化促進剤、硬化性樹脂組成物、電子部品装置、及びホスフィン誘導体の製造方法
JP2004356412A (ja) * 2003-05-29 2004-12-16 Nitto Denko Corp ダイシング・ダイボンドフィルム
JP2005340746A (ja) * 2004-04-30 2005-12-08 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置、ならびに半導体装置の製法
JP2006073982A (ja) * 2004-09-02 2006-03-16 Sumitomo Bakelite Co Ltd 半導体用接着フィルム及びこれを用いた半導体装置
JP2006269887A (ja) * 2005-03-25 2006-10-05 Sumitomo Bakelite Co Ltd 半導体用接着フィルム及びこれを用いた半導体装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010222390A (ja) * 2009-03-19 2010-10-07 Lintec Corp 接着剤組成物、接着シートおよび半導体装置の製造方法
WO2013157567A1 (ja) * 2012-04-17 2013-10-24 リンテック株式会社 接着剤組成物、接着シートおよび半導体装置の製造方法
JPWO2013157567A1 (ja) * 2012-04-17 2015-12-21 リンテック株式会社 接着剤組成物、接着シートおよび半導体装置の製造方法
JP2014088567A (ja) * 2013-12-13 2014-05-15 Jnc Corp 光硬化性インクジェット用インク
JP2019506503A (ja) * 2016-10-05 2019-03-07 エルジー・ケム・リミテッド 半導体接着用樹脂組成物、半導体用接着フィルムおよびダイシングダイボンディングフィルム

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