CN101238595A - 发光二极管用基板以及发光二极管 - Google Patents
发光二极管用基板以及发光二极管 Download PDFInfo
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- CN101238595A CN101238595A CNA200680028839XA CN200680028839A CN101238595A CN 101238595 A CN101238595 A CN 101238595A CN A200680028839X A CNA200680028839X A CN A200680028839XA CN 200680028839 A CN200680028839 A CN 200680028839A CN 101238595 A CN101238595 A CN 101238595A
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- Recrystallisation Techniques (AREA)
Abstract
本发明提供发光二极管用基板,所述发光二极管用基板不使用荧光体粉末,可形成良好的发光二极管元件,劣化少,能透过发光二极管元件的光,以及利用一部分透光的光而发光,而且可混合透过的光和新发光的光而放出。本发明的发光二极管用基板为对可形成发光二极管元件的单晶层和光转换用陶瓷复合体层进行层合的发光二极管用基板,所述光转换用陶瓷复合体层由选自单一金属氧化物以及复合金属氧化物的至少2种以上的氧化物相连续地而且三维地相互缠绕而形成的凝固体构成,其特征在于,该凝固体中的氧化物相中的至少一种含有发荧光的金属元素氧化物。
Description
技术领域
本发明涉及可在显示器、照明、背照光光源等中利用的发光二极管用的基板、以及使用了该发光二极管用基板的发光二极管。
背景技术
近年来,以使用了氮化物类化合物半导体的蓝色发光元件作为发光源的白色发光二极管的开发研究正在盛行。白色发光二极管因为重量轻,不使用水银,寿命长,因此可预测今后需要会迅速扩大。作为将蓝色发光元件的蓝色光转换为白色光的方法而最通常进行的方法是例如特开2000-208815号公报所记载的那样,通过在蓝色发光元件的前面,设置含有吸收一部分蓝色光而发出黄色光的荧光体的涂层和用于对光源的蓝色光和来自涂层的黄色光进行混色的模层(moldlayer),将存在补色关系的蓝色和黄色进行混色而模拟地得到白色。因此,作为涂层,可采用用铈赋活了的钇铝石榴石(garnet)(YAG:Ce)粉末和环氧树脂的混合物。但是有人指出,在该方法中涂布涂层时,容易发生所含有的荧光体粉末分布不均、各发光二极管的荧光体粉末的量不整齐等,由此引起发光二极管的颜色不均。
为了避免该问题,提出了使形成蓝色发光元件的基板自身具有发光功能、不利用粉末的方法。例如在特开2003-204080号公报中,公提案了以下方法,即在以YAG:Ce荧光体单晶的(111)面为主面的基板上形成由InxAlyGa1-x-yN(0≤x≤1、0≤y≤1、0≤x+y≤1)构成的氮化物半导体层,从发光层发出的蓝色光直接入射到基板上,从基板自身发出均匀的黄色荧光,由此不使用含有荧光体粉末的涂层而只使用发光片就得到不存在颜色不均的均匀的白色的方法。
另外,作为不使用YAG荧光体粉末的其他方法,在特开2000-082845号公报中公开了得到采用ZnSe单晶的白色发光二极管的方法。该方法为使ZnSe基板具有自激活(SA)发光的功能,在该基板上形成ZnSe系的蓝色发光二极管,得到从该元件发出蓝色的光同时进行黄色发光的白色的方法。
但是,在上述特开2003-204080号公报中记载的形成YAG(111)面基板的白色发光二极管的实际效果几乎未知。由于YAG(111)基板的晶格间距和在其上形成的构成氮化物半导体缓冲层的InxGa1-xN的晶格间距的差大,可认为这是由于难以形成质量良好的氮化物半导体层。
另外,上述特开2000-082845号公报中记载的利用ZnSe单晶的白色发光二极管,元件的劣化成为问题,要求改善提高ZnSe基板的质量。特别是在寿命延长中需要降低位错密度,现在正在进行元件化工艺的最优化、材料的变更等的改进。该内容记载于例如白色LED照明システム技術の応用と将来展望、監修 田口常正シ一エムシ一出版、2003年、170页。
现在,作为InGaN类的蓝色发光二极管用的基板而广泛采用的是Al2O3单晶(蓝宝石(Sapphire))的(0001)面,具有长期的实际效果。而且,在使用该Al2O3单晶而制作的元件中,伴随着Al2O3劣化的发光元件的劣化问题还没有报道过。因此,在使用基板自身的发光制作白色发光二极管的情况下,最希望采用在Al2O3基板上构成蓝色发光元件的方法来达到。因此,虽然如上所述需要基板自身的发光,但是向Al2O3单晶入射蓝色的光、得到黄色的发光这样的方法还没有报道过。
本发明的目的是提供不使用荧光体粉末、可形成良好的发光二极管元件,劣化少,可透过发光二极管元件的光,以及利用一部分透过光进行发光,而且可混合透过光和新发出的光而放出的发光二极管用基板以及使用了该发光二极管用基板的发光二极管。
发明内容
本发明人等进行了深入研究,结果发现,通过接合特定材料的层而层压,可解决上述问题,从而完成了本发明。
即,本发明涉及发光二极管用基板以及使用了该发光二极管用基板的发光二极管,所述发光二极管用基板为层合了可形成发光二极管元件的单晶层和光转换用陶瓷复合体层的发光二极管用基板,所述光转换用陶瓷复合体层由选自单一金属氧化物以及复合金属氧化物的至少2种以上的氧化物相连续地而且三维地相互缠绕而形成的凝固体构成,其特征在于,该凝固体中的氧化物相中的至少一种含有发荧光的金属元素氧化物。
在本发明的发光二极管用基板的一个实施方式中,优选上述单晶层由选自Al2O3、SiC、ZnO、以及GaN的材料构成。
另外,本发明的发光二极管用基板的一个实施方式特征为,在上述单晶层和光转换用陶瓷复合体层之间,具有由可粘合两材料的物质构成的接合层。另外,优选在上述接合层中存在荧光物质。
另外,发光二极管用基板的一个实施方式的特征为,上述凝固体由Al2O3和用铈赋活了的Y3Al5O12构成。
通过使用本发明的发光二极管用基板,可提供不使用荧光体粉末,可以以基板作为发光面使用,容易形成发光二极管元件(半导体层),劣化少,光的混合性好,颜色不均少的发光二极管。
另外,如果使用本发明的基板,在InGaN类的蓝色发光元件的制作中可使用最具有实际效果的Al2O3等的单晶基板制作InGaN类的蓝色发光元件,将从InGaN类的蓝色发光元件放出的光和ZnSe基板同样,直接导入到基板上,虽然使蓝色光透过,但同时吸收一部分蓝色光,发出黄色光,进而同时通过多个结晶相的三维缠绕,有效地将激发光和荧光混色,可得到均匀光的白色发光二极管。而且,通过在该基板上只制作蓝色发光元件,可得到白色发光二极管,可大幅度简化发光二极管的制作工序。而且,通过在单晶基板和陶瓷复合体接合时在接合面上使其他的萤光体存在,具有能提供能控制色调的基板的特征,也具有非常容易地控制发光二极管的色调的特征。由于通过该色调控制,陶瓷复合体的发光波长的自由度变大,结果增大了陶瓷复合材料的组成设计的自由度。
本发明的发光二极管,特征在于,在上述的发光二极管用基板的单晶层上形成发光二极管元件,从发光二极管用基板侧取出光。
附图说明
图1A为表示本发明的发光二极管用基板的一个实施方式的模式断面图。图1B为表示本发明的发光二极管用基板的其他实施方式的模式断面图。
图2为表示使用了本发明的基板的发光二极管的一个实施方式的模式图。
图3为实施例1得到的本发明的光转换用陶瓷复合体的组织断面图。
图4为表示实施例1得到的本发明的基板的接合的样子的断面图。
图5为实施例1得到的发光二极管的发光光谱图。
图6为表示实施例2得到本发明的基板的接合层的断面图。
图7为实施例3得到的发光二极管的发光光谱图。
具体实施方式
以下,使用附图详细说明本发明。
本发明的基板,例如为图1A所示,通过接合单晶层和光转换用陶瓷复合体层进行了层压的结构。在图1中,发光二极管用基板1由单晶层2、陶瓷复合体3、任选的接合层4构成。本发明的单晶层,是由在其之上可形成发光二极管元件等的半导体的现有的单晶构成的层。可例举例如氧化铝(Al2O3)、碳化硅(SiC)、氧化锌(ZnO)、氮化镓(GaN)。
本发明的光转换用陶瓷复合体层,由含荧光体的陶瓷复合材料形成,由金属氧化物相互之间连续地而且三维地相互缠绕而形成的凝固体构成。作为金属氧化物,为单一金属氧化物、或者复合氧化物。上述单一金属氧化物或者上述复合金属氧化物含有实现例如荧光的功能的元素等。这样的凝固体,是熔解原料金属氧化物后进行凝固而制作的复合材料。所谓的单一金属氧化物,是1种金属的氧化物,复合金属氧化物是2种以上的金属的氧化物。各氧化物形成三维地相互缠绕的结构。另外,有时在这些相互缠绕的氧化物相之间还存在其他的氧化物相。
作为这样的单一金属氧化物,除了氧化铝(Al2O3)、氧化锆(ZrO2)、氧化镁(MgO)、氧化硅(SiO2)、氧化钛(TiO2)、氧化钡(BaO)、氧化铍(BeO)、氧化钙(CaO)、氧化铬(Cr2O3)等外,还可例举稀土类元素氧化物(La2O3、Y2O3、CeO2、Pr6O11、Nd2O3、Sm2O3、Gd2O3、Eu2O3、Tb4O7、Dy2O3、Ho2O3、Er2O3、Tm2O3、Yb2O3、Lu2O3)。另外作为复合金属氧化物,可例举LaAlO3、CeAlO3、PrAlO3、NdAlO3、SmAlO3、EuAlO3、GdAlO3、DyAlO3、ErAlO3、Yb4Al2O9、Y3Al5O12、Er3Al5O12、Tb3Al5O12、11Al2O3·La2O3、11Al2O3·Nd2O3、3Dy2O3·5Al2O3、2Dy2O3·Al2O3、11Al2O3·Pr2O3、EuAl11O18、2Gd2O3·Al2O3、11Al2O3·Sm2O3、Yb3Al5O12、CeAl11O18、Er4Al2O9等。
作为对形成单晶层的板和形成光转换用陶瓷复合体层的板进行接合的方法,可使用例如在高温直接接合的方法。该方法是最简单的方法,在界面上没有异相,从这方面考虑是最理想的方法。作为形成单晶层的板使用氧化铝基板的情况下,接合的温度、时间需要在1700~1800℃、1小时~50小时左右。如果在其以上的温度,单晶的板和陶瓷复合体的板发生变形。另外,如果在低温下,接合几乎不进行。但是,需要长时间将Al2O3单晶层和陶瓷复合体层暴露于高温下,在成本上是不利的。
作为解决该问题的方法,有在单晶层和陶瓷复合体层的接合面上,以非常少量的低熔点材料(例如二氧化硅)作为接合层而使其夹隔的方法。通过该方法,可在更低的温度下进行接合,由于温度降低和时间缩短,在成本上有利。在夹隔玻璃等的低熔点化合物的情况下,必须考虑到InGaN类发光二极管的工艺上的温度、环境气氛而决定其组成。在代表性的パィレックス(注册商标)玻璃的情况下,需要900℃~1300℃、1小时~10小时左右。接合压力不一定是必要的,但加压更具有密合性,因此优选使用热压装置等施加0.01~100MPa的压力。
而且,在本发明的发光二极管用基板的一个实施方式中,在上述单晶层和光转换用陶瓷复合体层之间,具有由可粘合两层的物质构成的接合层。为了在更低的温度下使其接合,可以将树脂作为接合层使用,进而可以在低温下进行接合(粘合)。此时,可在该接合层中使所有的荧光体物质存在。通过该荧光体可控制发光二极管的色调。在接合部分中存在的荧光体物质可例举各种荧光材料,但在考虑到适用于白色发光二极管的情况下,优选发红色的荧光的用铕赋活了的Ca2Si5N8、用铕赋活了的CaAlSiN3这样的材料。作为粘合材料,可使用环氧树脂、硅树脂等。
如果使用Al2O3单晶作为单晶层,在其之上形成InGaN系的蓝色发光元件,则从蓝色发光元件放出的光,进入Al2O3单晶层,进而入射到光转换用陶瓷复合体层中。一部分蓝色光直接透过,一部分蓝色光被光转换用陶瓷复合体层吸收,新放出例如黄色的光。光转换用陶瓷复合体层的多个结晶相三维地相互缠绕,因此在该相互缠绕中,可有效地混合蓝色光和黄色光而放出。
另外,也可以如图1B所示夹隔接合层。接合层使单晶层和光转换用陶瓷复合体层接合的温度低温化,除了实现工艺简易化外,可赋予新的功能。可例举例如,通过加入新的荧光体而控制色调这样的功能。除了上述的蓝色和黄色的光的混色外,可加入新的光(例如红色),可控制色调。
作为蓝色发光元件的单晶层,除了Al2O3外,还已知使用SiC、ZnO、GaN的方法。此时,通过接合SiC、ZnO、GaN板和本光转换用陶瓷复合体的板,可实现同样的功能。
以下对于发光二极管元件用的基板材料进行描述,但是考虑到本基板通过构成单晶层和陶瓷复合体层的材料的元素的组合,可进行各种应用,因此并不仅仅限于本实施例。
在本发明中使用的形成Al2O3单晶层的板,可通过CZ法、EFG法由熔融液制作,由于它们在市场上广泛销售,因此可利用市售品。
为了制作InGaN系的蓝色发光元件,希望对形成Al2O3单晶层的板和形成光转换用陶瓷复合体层的板进行接合。因此优选在光转换用陶瓷复合体层中也含有Al2O3结晶。如果使用含有Al2O3的光转换用陶瓷复合体,在和Al2O3单晶层的接合面中折射率的差变得非常小,变得可高效地透过光。特别是在以Al2O3(0001)为基板面时,更优选使光转换材料的Al2O3在(0001)面接合,这是因为通过这样,Al2O3层的接合部分上由结晶方位产生的折射率的差变得不存在,可最有效地进行光的透过。
作为和光转换用陶瓷复合体层的Al2O3结晶共存的结晶相,优选至少用铈赋活了的复合金属氧化物A3X5O12型结晶。特别优选结构式A中含有选自Y、Tb、Sm、Gd、La、Er的1种以上的元素的情况,同样特别优选结构式X中含有选自Al、Ga的1种以上的元素的情况。这是因为由该特别优选的组合构成的光转换用陶瓷复合体,虽然透过从紫色到蓝色的光,但吸收其一部分,发出黄色的荧光。其中,由于用铈赋活了的Y3Al5O12和Al2O3结晶的组合发出强的荧光,因此是优选的。
光转换用陶瓷复合体中非常重要的特征是各结晶相不独立,各相形成不可分割的关系而一体化。在上述的Al2O3结晶和Y3Al5O12:Ce构成的光转换用陶瓷复合体的情况下,不仅仅存在2种结晶,由具有既不是Al2O3也不是Y3Al5O12的组成的一种熔液同时对Al2O3结晶和Y3Al5O12:Ce结晶进行结晶化,其结果存在2种结晶,和独立存在2种结晶的情况不同。在该含义中,2种结晶不可分。这样的凝固体和仅仅混合了Al2O3结晶和YAG:Ce结晶的状态在本质上不同。因此,该陶瓷复合体显示出特异的荧光行为。
构成光转换用陶瓷复合体层的凝固体,通过将原料金属氧化物熔解后,使其凝固而制作。例如可通过对加入到保持在预定温度的坩锅中的熔融物一边控制冷却温度、一边使其冷却凝结的简单方法而得到凝固体,但是最优选的是通过单向凝固法制作。这是因为,通过进行单向凝固,含有的结晶相以单晶状态或者与其类似的状态连续地成长,各相形成单一的结晶方位。
在本发明中使用的光转换用陶瓷复合体,除了至少一种相含有发荧光的金属元素氧化物外,可以是与本申请的申请人以前在特开平7-149597号公报、特开平7-187893号公报、特开平8-81257号公报、特开平8-253389号公报、特开平8-253390号公报以及特开平9-67194号公报以及其对应的美国专利申请(美国专利第5569547号、美国专利第5484752号、美国专利第5902963号等)等中公开的陶瓷复合材料同样的陶瓷复合体,可采用这些公报公开的制造方法进行制造。
作为在本发明的基板上形成的半导体层的一个例子的氮化物半导体层,由多个氮化物类化合物半导体的层形成。多个氮化物类化合物半导体的层,优选分别由通式InxAlyGa1-x-yN(0≤x≤1、0≤y≤1、0≤x+y≤1)表示的氮化物类化合物构成。而且,氮化物半导体层,至少具有发出可见光的发光层。为了形成良好的发光层,优选将各层中调整为最适合于各功能的组成的多个氮化物类化合物半导体的层进行层合。
多个氮化物类化合物半导体的层以及这些层的形成方法,是例如Jpn.J.Appl.Phys.Vol.34(1995),L798等中公开所示的公知的技术。具体而言,在基板上,通过MOCVD等的方法对GaN的缓冲层、形成n电极的n型-GaN:Si接触层、n型-Al0.5Ga0.9N:Si层、n型-In0.05Ga0.95N:Si层、形成单一量子阱结构型发光层的InGaN层、p型-Al0.1Ga0.9N:Mg障壁层、形成p电极的p型-GaN:Mg层依次进行层合而得到。发光层的结构,另外也可以是多重量子阱结构、同质结构、异质结构或者双异质结构。将这样制作的发光二极管元件放入到图2所示的包装中,通过只和电极连接,可作为白色发光二极管使用。
在图2中,参照数字1是发光二极管用基板,2是单晶层,3是陶瓷复合体,5是发光元件(二极管元件),6、7是电极,8是包装。
实施例
以下例举实施例对更详细地说明本发明。
(实施例1)
加入α-Al2O3粉末(纯度99.99%)和Y2O3粉末(纯度99.999%)以使它们达到摩尔比为82∶12,另外加入CeO2粉末(纯度99.99%),进行称量以使得相对于由氧化物的反应而生成的1摩尔的Y3Al5O12达到0.03摩尔。通过球磨机将这些粉末在乙醇中湿式混合16小时后,使用蒸发仪脱乙醇溶剂,得到原料粉末。在真空炉中预先熔解原料粉末,形成单向凝固的原料。
然后,将该原料直接加入到钼坩埚中,设置在单向凝固装置上,在1.33×10-3Pa(10-5Torr)的压力下熔解原料。然后在同一环境下以5mm/小时的速度降低坩埚,得到由石榴石型结晶的Y3Al5O12:Ce和α型氧化铝型结晶的Al2O3形成的凝固体。得到的凝固体呈现黄色。
凝固体的平行于凝固方向的断面组织示于图3。白的部分为Y3Al5O12:Ce结晶,黑的部分为Al2O3结晶。可知具有这两种结晶相互缠绕的组织。
用金刚石切割刀从陶瓷复合材料切出10mm×10mm、厚为1mm的基板,进而用研磨机加工至0.6mm厚,进而研磨一个表面,形成镜面。测定其的平均表面粗糙度,结果为0.014微米。另一方面,Al2O3单晶使用市售品的(0001)面的基板。尺寸为10mm×10mm,厚度为0.5mm,表面粗糙度为1nm。
然后,将光转换用陶瓷复合体的板配置在下侧,在其上面载有Al2O3单晶的板,设置在电炉中。此时,进行配置以使得Al2O3单晶的板和光转换用陶瓷复合体的板的镜面之间相互相对。将该试样在大气中在1700℃下保持20小时,通过接合,进行层合。图4为表示接合后的接合的样子的断面图。上侧为Al2O3单晶基板,下侧为陶瓷复合体基板。可知两者密合。特别是Al2O3的部分为相同的结晶相,因此可非常良好地接合。
在通过接合而作成的基板的Al2O3单晶层(0001)面上使TMG(三甲基镓)气体、TMA(三甲基铝)气体、氮气以及搀杂气体和载体气体一起流过,用MOCVD法将氮化物类化合物半导体制膜,得到蓝色发光层。作为搀杂气体通过切换SiH4和Cp2Mg而形成n型氮化物类化合物半导体和p型氮化物类化合物半导体,形成pn接合。具体而言,在Al2O3单晶层上夹隔GaN的缓冲层,形成:形成n电极的n型-GaN:Si接触层、n型-Al0.5Ga0.9N:Si层、n型-In0.05Ga0.95N:Si层、形成单一量子阱结构型发光层的InGaN层、P型-Al0.1Ga0.9N:Mg障壁层、形成p电极的p型-GaN:Mg层。通过溅射法形成pn各电极,在基板上划线,通过施加外力而分割,得到发光二极管。
得到的发光二极管的发光光谱示于图5。可观测到来自氮化物半导体层的蓝色光,和由其激发的来自陶瓷复合体层的黄色荧光。从该基板放出的光,进一步在本基板内均匀地混合,得到良好的白色光。
(实施例2)
使用旋涂机将含有30%的直径为10~20nm的球形非晶型二氧化硅的溶液涂布在实施例1制作的光转换用陶瓷复合体的10mm×10mm的板上。涂布后,将该基板加热到60℃,除去溶剂成分。然后,在该光转换用陶瓷复合体的板的非晶型二氧化硅涂布面上载置和实施例1同样的Al2O3单晶板,设置在热压装置上,一边用0.03MPa加压,一边加热到1300℃,保持2小时,慢慢冷却。得到的基板示于图6。上侧为Al2O3单晶板,下侧为光转换用陶瓷复合体的板。界面存在作为粘合相的二氧化硅相。
使用如此制作的发光二极管用基板和实施例1同样制作的发光二极管,和实施例1得到的基板同样,可观测到来自氮化物半导体层的蓝色光,和由其激发的来自陶瓷复合体层的黄色荧光。从该基板放出的光,进一步在本基板内均匀地混合,得到良好的白色光。
(实施例3)
作为环氧树脂和红色荧光体以重量比为1∶1称量CaAlSiN3粉末,用paint-shake混合30分钟,得到混合浆料。将其加入到真空干燥器中脱泡。将该浆料涂布在实施例1制作的光转换用陶瓷复合体的板上。进而,将用和实施例1同样的方法制作的蓝色发光元件制作的蓝宝石基板和光转换用陶瓷复合体粘贴在一起。将该材料加入到150℃的恒温槽中使树脂固化。在得到的基板上划线,通过施加外力而分割,得到发光二极管元件。
得到的元件的发光光谱示于图7。蓝色的发光和来自基板的黄色荧光的发光和来自红色荧光体的红色的发光付加在一起,可得到650nm的发光得到突出了的发光光谱。该光为暖色系的白色。由此可确认能控制色调。
根据本发明,可提供发光二极管用基板以及使用了该基板的发光二极管,所述发光二极管用基板不使用荧光体粉末,可形成良好的发光二极管元件,劣化少,能透过发光二极管元件的光,以及利用一部分透过的光而发光,而且可混合透过光和新发光的光而放出。因此可用于产业上。
Claims (12)
1.发光二极管用基板,其为对可形成发光二极管元件的单晶层和光转换用陶瓷复合体层进行层合的发光二极管用基板,所述光转换用陶瓷复合体层由选自单一金属氧化物以及复合金属氧化物的至少2种以上的氧化物相连续地而且三维地相互缠绕而形成的凝固体构成,其特征在于,该凝固体中的氧化物相中的至少一种含有发荧光的金属元素氧化物。
2.权利要求1所述的发光二极管用基板,其特征在于,上述单晶层由选自Al2O3、SiC、ZnO、以及GaN的材料构成。
3.权利要求1或者2所述的发光二极管用基板,其特征在于,对上述单晶层和上述光转换用陶瓷复合体层直接接合。
4.权利要求1或者2所述的发光二极管用基板,其特征在于,在上述单晶层和上述光转换用陶瓷复合体层之间具有可接合上述两层的物质构成的接合层。
5.权利要求4所述的发光二极管用基板,其特征在于,上述接合层为树脂。
6.权利要求4所述的发光二极管用基板,其特征在于,上述接合层为二氧化硅。
7.权利要求4~6的任一项所述的发光二极管用基板,其特征在于,上述接合层中存在荧光物质。
8.权利要求1~7的任一项所述的发光二极管用基板,其特征在于,上述单晶层为Al2O3,上述光转换用陶瓷复合体层为含有Al2O3结晶和用铈赋活了的A3X5O12型结晶(式中,A为选自Y、Tb、Sm、Gd、La、Er的1种以上的元素,X为选自Al、Ga的1种以上的元素)陶瓷复合体。
9.权利要求8所述的发光二极管,其特征在于,上述用铈赋活了的A3X5O12型结晶为Y3Al5O12:Ce。
10.发光二极管,其特征在于,是在权利要求1~9的任一项所述的发光二极管用基板的上述单晶层上形成发光二极管元件而成,从上述发光二极管用基板侧取出光。
11.权利要求10所述的发光二极管,其特征在于,上述发光二极管元件为InGaN类发光二极管元件。
12.权利要求10所述的发光二极管,其特征在于,上述发光二极管元件由通式InxAlyGa1-x-yN(0≤x≤1、0≤y≤1、0≤x+y≤1)表示的氮化物类化合物的多层构成。
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CN108224366B (zh) * | 2016-12-15 | 2021-01-05 | 松下知识产权经营株式会社 | 发光元件以及发光元件的制造方法 |
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KR101036530B1 (ko) | 2011-05-24 |
EP1914810B1 (en) | 2017-10-04 |
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