CN101224552B - 圆盘状基板的磨削方法、磨削装置 - Google Patents
圆盘状基板的磨削方法、磨削装置 Download PDFInfo
- Publication number
- CN101224552B CN101224552B CN2008100030548A CN200810003054A CN101224552B CN 101224552 B CN101224552 B CN 101224552B CN 2008100030548 A CN2008100030548 A CN 2008100030548A CN 200810003054 A CN200810003054 A CN 200810003054A CN 101224552 B CN101224552 B CN 101224552B
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- grinding
- periphery
- disc wafer
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- Prior art date
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- 238000000227 grinding Methods 0.000 title claims abstract description 468
- 238000000034 method Methods 0.000 title claims abstract description 35
- 239000000758 substrate Substances 0.000 title abstract description 34
- 239000004575 stone Substances 0.000 claims description 212
- 230000007246 mechanism Effects 0.000 claims description 61
- 238000012423 maintenance Methods 0.000 claims description 16
- 238000006073 displacement reaction Methods 0.000 claims description 10
- 230000009471 action Effects 0.000 claims description 9
- 230000035611 feeding Effects 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 131
- 230000002093 peripheral effect Effects 0.000 description 18
- 238000005520 cutting process Methods 0.000 description 17
- 238000012545 processing Methods 0.000 description 17
- 239000011521 glass Substances 0.000 description 12
- 230000008569 process Effects 0.000 description 10
- 230000005540 biological transmission Effects 0.000 description 8
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 6
- 229910001573 adamantine Inorganic materials 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000012809 cooling fluid Substances 0.000 description 2
- 238000000280 densification Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910001315 Tool steel Inorganic materials 0.000 description 1
- 150000001398 aluminium Chemical class 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000013138 pruning Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims (15)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-008860 | 2007-01-18 | ||
JP2007008860 | 2007-01-18 | ||
JP2007008860A JP4252093B2 (ja) | 2007-01-18 | 2007-01-18 | 円盤状基板の研削方法、研削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101224552A CN101224552A (zh) | 2008-07-23 |
CN101224552B true CN101224552B (zh) | 2011-02-02 |
Family
ID=39641718
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008100030548A Active CN101224552B (zh) | 2007-01-18 | 2008-01-18 | 圆盘状基板的磨削方法、磨削装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8033893B2 (zh) |
JP (1) | JP4252093B2 (zh) |
CN (1) | CN101224552B (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008041493A1 (fr) * | 2006-09-29 | 2008-04-10 | Hoya Corporation | Procédé de fabrication d'un substrat en verre pour disque magnétique, procédé de fabrication d'un disque magnétique, et appareil de polissage d'un substrat en verre pour disque magnétique |
JP2012064295A (ja) * | 2009-11-10 | 2012-03-29 | Showa Denko Kk | 磁気記録媒体用ガラス基板の製造方法 |
JP5752351B2 (ja) * | 2009-12-02 | 2015-07-22 | Ntn株式会社 | 加工方法および軸受 |
CN102101257B (zh) * | 2009-12-18 | 2014-09-24 | 中村留精密工业株式会社 | 基板的端面研磨装置 |
JP5356606B2 (ja) * | 2010-09-30 | 2013-12-04 | Hoya株式会社 | 磁気ディスク用ガラス基板の製造方法 |
JP2012169024A (ja) * | 2011-02-16 | 2012-09-06 | Showa Denko Kk | 磁気記録媒体用ガラス基板の製造方法 |
JP5759005B2 (ja) * | 2011-08-24 | 2015-08-05 | 新日鉄住金マテリアルズ株式会社 | ベベリング砥石 |
CN103962907B (zh) * | 2014-05-06 | 2016-06-29 | 腾辉电子(苏州)有限公司 | 半自动磨边机及利用该半自动磨边机对基板磨削的方法 |
CN107004431B (zh) * | 2014-12-31 | 2019-09-13 | Hoya株式会社 | 磁盘用基板的制造方法和磨削用磨石 |
CN108890490B (zh) * | 2018-08-29 | 2020-08-21 | 邳州市耐磨材料有限公司 | 一种轴承套圈全方位打磨设备 |
JP7288373B2 (ja) * | 2019-09-09 | 2023-06-07 | キオクシア株式会社 | 研削装置、研削砥石、および研削方法 |
CN114260785A (zh) * | 2021-12-27 | 2022-04-01 | 浙江中晶科技股份有限公司 | 一种全自动硅片倒角设备 |
CN114850984B (zh) * | 2022-06-01 | 2024-03-08 | 浙江鑫豪机械有限公司 | 一种研磨抛光装置及其使用方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0264700B1 (de) * | 1986-10-22 | 1991-05-08 | BBC Brown Boveri AG | Verfahren zum Anbringen einer umlaufenden Hohlkehle am Rand einer Halbleiterscheibe eines Leistungshalbleiter-Bauelements |
JPH0546845Y2 (zh) | 1987-06-11 | 1993-12-08 | ||
JPH0236058A (ja) | 1988-07-25 | 1990-02-06 | Ntn Corp | 内外径同時研削盤 |
JP3099216B2 (ja) | 1994-08-22 | 2000-10-16 | 旭栄研磨加工株式会社 | ドーナツ状基板の研削工具 |
JPH11349354A (ja) | 1998-06-08 | 1999-12-21 | Nikon Corp | 情報記録媒体用基板及びその製造方法 |
JP4227700B2 (ja) | 1999-05-17 | 2009-02-18 | 不二越機械工業株式会社 | ディスク鏡面面取り装置システム |
JP2001006166A (ja) | 1999-06-21 | 2001-01-12 | Shigiya Machinery Works Ltd | ハードディスク用ガラス板の研削方法と、その装置 |
JP4144725B2 (ja) | 1999-09-30 | 2008-09-03 | 独立行政法人理化学研究所 | ガラス基板のチャンファリング方法及び装置 |
US6860795B2 (en) * | 2001-09-17 | 2005-03-01 | Hitachi Global Storage Technologies Netherlands B.V. | Edge finishing process for glass or ceramic disks used in disk drive data storage devices |
JP2003231044A (ja) | 2002-02-13 | 2003-08-19 | Nippon Sheet Glass Co Ltd | 情報記録媒体用ガラス基板の面取加工方法及び面取加工装置 |
JP2005014176A (ja) | 2003-06-27 | 2005-01-20 | Tateno Kikai Seisakusho:Kk | ガラス円盤の内外周面研削加工システム |
JP2005103652A (ja) | 2003-09-26 | 2005-04-21 | Asahi Glass Co Ltd | ガラス製リングの製造方法及びその装置 |
JP2006068832A (ja) | 2004-08-31 | 2006-03-16 | Htt Hauser Tripet Tschudin Ag | 円形研磨加工を行う方法及び装置 |
JP2006294099A (ja) * | 2005-04-07 | 2006-10-26 | Asahi Glass Co Ltd | 磁気記録媒体用ガラス基板の周面研磨装置及び製造方法 |
-
2007
- 2007-01-18 JP JP2007008860A patent/JP4252093B2/ja active Active
-
2008
- 2008-01-15 US US12/014,392 patent/US8033893B2/en active Active
- 2008-01-18 CN CN2008100030548A patent/CN101224552B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
JP4252093B2 (ja) | 2009-04-08 |
US8033893B2 (en) | 2011-10-11 |
US20080176488A1 (en) | 2008-07-24 |
CN101224552A (zh) | 2008-07-23 |
JP2008173715A (ja) | 2008-07-31 |
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C14 | Grant of patent or utility model | ||
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Free format text: FORMER OWNER: CITIZEN SEIMITSU CO., LTD. Effective date: 20120628 |
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Effective date of registration: 20120628 Address after: Tokyo, Japan Patentee after: SHOWA DENKO Kabushiki Kaisha Address before: Tokyo, Japan Co-patentee before: CITIZEN SEIMITSU Co.,Ltd. Patentee before: SHOWA DENKO Kabushiki Kaisha |
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CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan Patentee after: Lishennoco Co.,Ltd. Address before: Tokyo, Japan Patentee before: Showa electrical materials Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230620 Address after: Tokyo, Japan Patentee after: Showa electrical materials Co.,Ltd. Address before: Tokyo Patentee before: SHOWA DENKO Kabushiki Kaisha |