CN101218862A - 电子元件安装方法 - Google Patents

电子元件安装方法 Download PDF

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CN101218862A
CN101218862A CNA2006800251963A CN200680025196A CN101218862A CN 101218862 A CN101218862 A CN 101218862A CN A2006800251963 A CNA2006800251963 A CN A2006800251963A CN 200680025196 A CN200680025196 A CN 200680025196A CN 101218862 A CN101218862 A CN 101218862A
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electronic component
protruding
weldering
plate
solder
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山本佑介
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Abstract

一种电子元件安装方法，用于将下表面形成有焊凸(16)的电子元件(11)安装到板(3)上。焊膏(19)印刷在板(3)的电极(3a)上，并通过转移设置到焊凸(16)上。此后，通过焊膏(19)将焊凸(16)放置在电极(3a)上。由此，即使焊凸(16)和电极(3a)之间存在间隙，焊膏(19)的焊料成分也可以使焊料的熔合部分的量增加，其中保证焊料的熔合部分可润湿地扩展。当通过焊接安装薄半导体封装件时，这可以防止接合不良。

Description

电子元件安装方法
技术领域
本发明涉及一种通过焊接而将形成有焊凸(solder bump)的电子元件安装到板上的电子元件安装方法。
背景技术
随着近来在电子设备的尺寸减小和功能提高方面的研发，对于包括将要安装在电子设备中的半导体封装件的电子元件来说，已经实现了尺寸和厚度减小。另外，还追求进一步提高安装密度。作为应对这种密集安装的安装形式，趋势是朝着采用堆叠有板模块的结构发展，其中板模块的电子元件安装在板上(例如，见专利文件1)。在该专利文件中，通过在板上安装多个形成有焊凸的半导体封装件，使元件安装板具有一定密度，而不增大板尺寸。
[专利文件1]：JP-A-2005-26648
发明内容
与此同时，用于堆叠结构的半导体封装件较薄并因此刚性较低，从而具有焊接回流加热时容易出现翘曲的性质。为此，在回流焊时，这种翘曲可能致使焊凸漂移，使得焊凸不能与板的连接电极正常焊合。这容易导致导电不良或者接合不良，例如焊接强度不足。在通过焊接来安装薄半导体封装件的场合，这种问题普遍存在，而不限于堆叠有多个半导体封装件的结构。
因此，本发明的目的是提供一种能够在通过焊接安装薄半导体封装件时防止接合不良的电子元件安装方法。
本发明的电子元件安装方法是一种将电子元件安装到板上的方法，其中电子元件的下表面上形成有焊凸，该方法包括：焊料转移步骤，通过转移而将焊膏设置到焊凸上；安装步骤，将电子元件安放到板上，并通过焊膏将焊凸放置于板的连接电极上；和回流步骤，将板连同电子元件一起加热，并使焊膏和焊凸的焊料成分熔合，从而将电子元件焊接在板上。
根据本发明，电子元件在处于焊膏通过转移而设置于焊凸上的状态下安装在板上，使得焊凸通过焊膏置于连接电极上。由此，即使焊凸和连接电极之间存在间隙，焊膏的焊料成分也可以使焊料的熔合部分的量增加，其中保证焊料的熔合部分可润湿地扩展。当通过焊接安装薄半导体封装件时，这可以防止接合不良。
附图说明
图1是本发明一个实施例中的元件安装板生产线的配置图。
图2是本发明一个实施例中的电子元件安放装置的平面图。
图3是本发明一个实施例中的待安装到板上的电子元件的结构解释图。
图4是本发明一个实施例中的待安装到板上的电子元件的结构解释图。
图5(a)至5(e)是本发明一个实施例中的板制造方法的过程解释图。
图6(a)至6(c)是本发明一个实施例中的板制造方法的过程解释图。
图7(a)至7(c)是本发明一个实施例中的电子元件安装方法的焊接过程解释图。
具体实施方式
参照附图解释本发明的实施例。
首先参照图1，解释元件安装板生产线。在图1中，元件安装板生产线构造成具有串联布置的丝网印刷机M1、电子元件安放装置M2和回流装置M3。丝网印刷机M1用来印刷焊膏，用于将电子元件连接到板上。电子元件安放装置M2用来将电子元件安装到印刷有焊膏的板上。回流装置M3用于加热安装有电子元件的板并使焊膏的焊料成分熔合，从而将电子元件固定在板上。
现在参照图2，解释电子元件安放装置M2的构造。在图2中，运输路径2沿着X方向居中布置在基台1中。运输路径2用于运输其上将要安装电子元件的板3，并用于将板3安放在要安装电子元件的地方。在运输路径2的前方，第一和第二元件供应部4A和4B相对于X方向平行布置。第一和第二元件供应部4A和4B具有容纳第一和第二电子元件11、12的相应的托盘。第三元件供应部4C布置在运输路径2的后面。该第三元件供应部4C布置有带式馈送器5，该带式馈送器5用于将载有第三电子元件13(见图5)的带间歇地馈送到安装头的拾取位置，这在下面解释。
Y轴工作台6A和Y轴导轨6B相对于X方向布置在基台1的相应端。X轴工作台悬于Y轴工作台6A和Y轴导轨6B之间。X轴工作台7上布置有安装头8。安装头8是具有多个单体头8a的群组(gang)型的，其与板识别照相机9一致地移动。
通过驱动X轴工作台7和Y轴工作台6，安装头8沿着X轴方向移动。单体头8a具有允许将第一电子元件11从第一元件供应部4A取出、将第二电子元件12从第二元件供应部4B取出、以及将第三电子元件13从第三元件供应部4C取出、然后将它们安装到放置于运输路径2上的板3上的相应的吸入喷嘴。
在运输路径2和第一、第二元件供应部4A、4B之间，布置有直线照相机10、喷嘴储料器14和焊膏转移台15。在运输路径2和第三元件供应部4C之间，布置有直线照相机10、喷嘴储料器14和焊膏转移台15。从元件供应部拾取到电子元件的安装头8在运动到板3的过程中在直线照相机10的上方经过。正因为如此，电子元件在由安装头8保持的状态下被识别。
喷嘴储料器14容纳多种类型的适于将要安装到板3上的电子元件的喷嘴。通过使安装头8接近喷嘴储料器14，可以根据要安装的电子元件来选择性地附接吸入喷嘴。焊膏转移台15用来向工作台上供应薄膜状态的、因在焊剂中混合焊料成份而有粘性的焊膏。通过使保持有电子元件的安装头相对于焊膏转移台15上升和下降，将焊膏设置在形成于电子元件下侧的焊凸上。
现在参照图3和4，解释第一和第二电子元件11、12。第一电子元件11(电子元件)是用树脂封装半导体元件而形成的薄封装件。如图3所示，焊凸16形成在下表面11a上，以连接到板3。同时，电极17(第二连接电极)形成在上表面11b上，以连接到堆叠在第一电子元件11上的待安装电子元件。第二电子元件12也是用树脂封装半导体元件而形成的薄封装件。如图4所示，焊凸18以与第一电子元件12的电极17相同的布置形成在下表面12a上，以连接到第一电子元件11。在通过焊凸进行连接时，这些刚性较低的薄封装件在回流加热期间具有容易翘曲的特性。
现在解释将第一和第二电子元件11、12安装到板3上的电子元件安装方法。通过该电子元件安装方法，下表面形成有焊凸的第一和第二电子元件11、12可以以多个堆叠的方式安装在板3上，从而形成密集安装板。
在图5(a)中，电极3a、3b(连接电极)形成在板3的上表面上。电极3a形成为与第一电子元件11的凸起16的布置相同，电极3b形成为与第三电子元件13的引线13a的布置相同。先将板3运输到图1所示的丝网印刷机M1，在那里将焊膏19设置到板3的电极3a、3b上，如图5(b)所示(焊膏印刷步骤)。然后，将带有焊料的板3运输到电子元件安放装置M2，在这里，其被安放在运输路径2上的安装位置。安装头8移动到板3的上方，板识别照相机9在此摄取板3的图像，从而识别板3的位置(第一识别步骤)。
此后，焊膏转移到第一电子元件11上。即，由安装头8从第一元件供应部4A取出的第一电子元件11在由吸入喷嘴20保持的状态下移动到焊膏转移台。通过使第一电子元件11相对于焊膏19的覆膜上升和下降，如图5(c)所示，焊膏19通过转移而在下表面供应到焊凸16(焊膏转移步骤)。
然后，转移有焊膏的电子元件通过安装头8安装到印有焊料的板3b上，如图5(d)所示。首先，根据第一识别步骤的识别结果使第一电子元件11(第一层的电子元件)与板3的电极3a对准，然后将焊凸16放置在电极3a上，从而进行安装(安装步骤)。在该安装步骤中，还通过将引线13a与电极3b对准而进行第三电子元件13的安装。
此后，在第二层安装电子元件。首先，通过板识别照相机9进行第一电子元件11的位置识别。这里，通过识别形成于第一电子元件11的上表面11b上的电极15中的作为电子元件的特征点的形成在最外边的对角位置的电极16来进行位置识别(第二识别步骤)。
然后，将第二电子元件12从第二元件供应部4B取出的安装头8移动到焊膏转移台15。这里，第二电子元件12相对于焊膏19的覆膜上升和下降，如图6(a)所示。这样，通过转移将焊膏19设置到焊凸18的下表面(第二焊料转移步骤)。然后，根据第二识别步骤的识别结果，使第二电子元件12与第一电子元件11对准，并通过将第二电子元件12的焊凸18放置在形成于第一电子元件12上表面上的电极17上，将第二电子元件12安装到第一电子元件11上(第二安装步骤)。
此后，将板3运输到回流装置M3中。在这种情况下，安装有第一至第三电子元件11至13的板3与这些电子元件一起加热到高于焊料熔点的回流温度。这导致第一电子元件11的焊凸16与板3的电极3a焊合，第三电子元件13的引线13a与电极3b焊合，以及第二电子元件12的焊凸18与电子元件11的电极17焊合(回流步骤)。通过使焊膏19和焊凸16、18的焊料成分熔合来完成焊接。这样就完成了堆叠有通过用树脂封装半导体元件而形成的第一和第二电子元件11、12等的封装件的密集安装板。
同时参照图7来解释回流步骤中的焊接行为。以第一电子元件11的焊凸16焊接到板3的电极3a为例子来解释本实施例。然而，对于第二电子元件12的焊凸18焊接到第一电子元件11的电极17的情况，也是同样的道理。如前所述，由于第一电子元件11是薄半导体封装件，所以焊凸16因封装件主体向上翘曲而在将第一电子元件11安装到板3上时以及在实施回流期间可能发生漂移。这可能导致间隙d存在于焊凸16和电极3a之间，如图7(a)所示。
即使焊凸16和电极3a之间以这种方式存在间隙，本实施例也能在元件安装前额外地向焊凸16转移焊膏19。而且，焊膏19还设置在电极3a上。为此，用于连接的电极3a和焊凸16处于在上下表面周围被足量的焊膏19覆盖的状态。
这样，在这种状态下进行回流。即，在加热熔化焊料的过程中，焊膏19具有足量的一部分熔合的焊料19a，作为其熔合焊料成分。其在焊凸16的下端和电极3a之间连接的状态下在粘性液体树脂19b中可润湿地扩展，如图7(b)所示。此时，焊料19a的熔合部分的表面张力导致一力，该力作用为朝电极3a拉拽焊凸16，并使初始存在的间隙d变窄。
此后，通过进一步继续加热，焊凸16与焊料19a的熔合部分熔合成一体。如图7(c)所示，焊接接头16a形成为连接在第一电子元件11和电极3a之间。焊接接头16a随后冷却并凝固，从而完成了第一电子元件11到板3的焊接。焊接接头16a的量为焊凸16的熔合焊料加上焊膏19的焊料。因此，第一电子元件11和板3由足量的焊料连接在一起，从而保证了足够的焊接强度和导电性。
顺便提及，本实施例示出了第一和第二电子元件11、12堆叠安装在板3上的结构。此外，本发明还适用于除所提供的堆叠结构之外的普通电子元件安装结构，其中堆叠结构的安装形式是封装件较薄并容易翘曲，以及间隙会形成在焊凸和连接电极之间。同时，本实施例示出了这样的示例：通过印刷事先向板3的连接电极3A提供焊料。但是，如果因封装件翘曲程度相对较小而额外提供给焊凸的焊料量令人满意地较小，则可以省去向连接电极提供焊料。
本申请基于2005年8月25日提交的日本专利申请No.2005-243866并要求其优先权，其全部内容在此引作参考。
[工业实用性]
本发明的电子元件安装方法具有可防止焊接安装薄半导体封装件时出现不良连接的效果，这对于通过焊接将形成有焊凸的薄电子元件安装到板上的领域是有用的。

Claims (6)

1.一种将电子元件安装到板上的电子元件安装方法，电子元件的下表面上形成有焊凸，该方法包括：
焊料转移步骤，通过转移而将焊膏设置到焊凸上；
安装步骤，将电子元件安放到板上，并通过焊膏将焊凸放置于板的连接电极上；和
回流步骤，将板连同电子元件一起加热，并使焊膏和焊凸的焊料成分熔合，从而将电子元件焊接在板上。
2.如权利要求1所述的电子元件安装方法，进一步包括事先将焊膏印刷在连接电极上的焊料印刷步骤。
3.如权利要求1所述的电子元件安装方法，其中，安装在板上的电子元件具有上表面，第二连接电极形成为将第二电子元件安装在该上表面上，第二电子元件的下表面上形成有第二焊凸，
该方法还包括：通过转移将焊膏设置到第二焊凸上的第二焊料转移步骤；和第二安装步骤，将第二电子元件安放于所述电子元件上，并通过焊膏将第二焊凸放置于所述电子元件的第二连接电极上，
在回流步骤中，板连同所述电子元件和所述第二电子元件一起被加热，并使焊膏和第二焊凸的焊料成分熔合，从而将所述第二电子元件焊接在所述电子元件上。
4.如权利要求3所述的电子元件安装方法，其中，在将第二电子元件安装在所述电子元件上之前，对所述电子元件进行位置识别。
5.如权利要求4所述的电子元件安装方法，其中，对形成在所述电子元件的上表面上的作为特征点的电极进行所述电子元件的位置识别。
6.如权利要求5所述的电子元件安装方法，其中，所述特征点是形成在所述电子元件的上表面上的电极中的形成在最外边的对角位置的电极。
CNA2006800251963A 2005-08-25 2006-08-16 电子元件安装方法 Pending CN101218862A (zh)

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