CN1032944C - 在焊区配置上形成预先定位的焊料凸点的方法和装置 - Google Patents

在焊区配置上形成预先定位的焊料凸点的方法和装置 Download PDF

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CN1032944C
CN1032944C CN94105237A CN94105237A CN1032944C CN 1032944 C CN1032944 C CN 1032944C CN 94105237 A CN94105237 A CN 94105237A CN 94105237 A CN94105237 A CN 94105237A CN 1032944 C CN1032944 C CN 1032944C
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福兰克·詹斯克
坎纳斯·M·沃斯科
道格拉斯·W·汉瑞科
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H05K2203/03—Metal processing
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    • H05K2203/04—Soldering or other types of metallurgic bonding
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    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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Abstract

一种用于在基板101的焊区配置100上形成预先定位的焊料坯104的方法和装置，包括将焊料坯304的预定图形306安放在与传送带402上的可熔性的粘性熔剂302相接触的位置上，随后加热熔剂302使之熔化。再将熔剂302冷却使之重新固化而将焊料坏304固定在传送带402上。将传送带402对准定位在焊区配置100上，并通过加热焊料坯304将其转移到焊区配置100上以预定的图形306形成焊料凸点104。

Description

本发明一般来说涉及集成电路芯片与基板的安装用焊区配置的直接芯片固定技术。特别涉及为采用直接芯片固定技术而在基板的安装用焊区配置上形成预先定位的焊料凸点(solder bumps)的方法和装置。
直接芯片固定(DCA)技术，也称为“倒装芯片”技术，对在集成电路安装技术方面工作的人员来说是熟知的。在DCA技术中，集成电路芯片在其有源面上有多个与基板上相应的安装用焊区配置互连的端点。在典型情况下，上述互连是通过在基板与芯片间的焊料的凸起区域或焊料“凸点”来进行的，这种焊料凸点在回流焊工艺期间或通过激光加热回熔。由于上述互连的间隙是非常紧凑的，例如，0.5mm，因此为了避免短路和其他缺陷的发生对设置焊料凸点的精确度要求很高。
已经应用的一种形成焊料凸起区域的方法是通过层状的、干的电镀保护膜在焊接区配置上电镀一层锡/铅。但这种方法的缺点是要耗费很多时间。另一种方法是通过遮蔽和回流在焊区配置上形成一层焊料糊剂。该方法的缺点是会产生高的缺陷率从而导致低的成品率。此外还有一种方法是在芯片本身上形成焊料凸点，但此方法在一般情况下是由芯片制造者来进行的，因此除了那些特别昂贵的芯片外，此方法是不实际和不适用的。以上所述的这些形成焊料凸点的方法总的来说会导致电路板或芯片成本有较大的增加。
因此，需要一种为使用DCA技术而形成焊料凸点的方法和装置。这种方法和装置应该是廉价的和快速的，而且能产生高质量的互连。在理想情况下，这种方法和装置应该与工厂化生产和现场修复的应用方面的要求相适应。
本发明的一个方案是一种用于在基板的焊区配置上形成预先定位的焊料凸点的、将预定的焊料坯的图形固定在传送带上的方法。该方法包括将预定的焊料坯的图形与传送带上的可熔性的粘性熔剂相接触，并且在预定的焊料坯图形与熔剂相接触期间加热该熔剂使之熔化的工序。该方法还包括将熔剂冷却使之固化，从而把预定的焊料坯图形固定在传送带上的工序。
本发明的另一个方案是一种在基板的焊区配置上形成预先定位的焊料凸点的方法。该方法包括将通过可熔性的粘性熔剂固定在传送带上的预定的焊料坯图形与基板上的焊区配置进行接触对准，然后通过加热预定的焊料坯图形将预定的焊料坯图形转移到基板的焊区配置上去的工序。
本发明的再一个方案是一种用于在基板的焊区配置上形成预先定位的焊料凸点的加工带。该加工带包括一个传送带以及涂复在传送带上用于在其上固定预定的焊料坯图形的可熔性的粘性熔剂。该加工带还包括在将熔剂放置在与预定的焊料坯图形相接触的位置时通过加热和其后的冷却熔剂的工艺固定到该可熔性的粘性熔剂上的预定的焊料坯图形。
图1是本发明的优选实施例中的焊区配置结构的顶视图。
图2是本发明的优选实施例中的焊区配置和直接芯片固定元件的沿图1中2-2线的截面图。
图3是本发明的优选实施例中的具有预定的焊料坯图形的一部分加工带的顶视图。
图4是本发明优选实施例中的一部分加工带沿图3的4-4线的截面图。
图5是描述本发明的优选实施例中多个预定的焊料坯图形的加工带的一个较长部分的顶视图。
图6是制造和应用根据本发明的优选实施例加工带的工艺框图。
参照图1，本发明的优选实施例中的焊区配置100的顶视图包括基板101、为了固定和互连直接芯片固定(DCA)元件202(图2)的安装用焊区102以及互连引线106。尽管焊区配置100在图1中为4×4的焊点阵列，但应了解对焊区配置100来说，其它的焊接区图形，如仅有周边的焊区、双排焊区、焊区的环状图形等等也可以采用。焊区配置100还包括在第一个回流工序期间回流到安装用焊接区102的焊料凸点104，该焊料凸点104用于在第二个(即其后的)回流过程中将DCA元件固定在基板101上。基板101最好是常规的印刷布线板材料，如环氧树脂玻璃编织成的复合材料。应了解还可以用其它的基板材料，如陶瓷、氰酸脂和降酰亚胺复合材料。安装用焊区102及互连引线106是通常的、以层状方式覆盖在基板101上的铜，它们通过腐蚀形成焊区配置100，之后安装用焊区102及互连引线106上最好再镀一层额外的铜以连接基板中的任何通孔。焊料凸点104材料的锡含量最好是55-75％，其余为铅。应了解，对安装用焊区102及互连引线106来说，也可以用其它的类似材料，如锡、银、金、钯-银或铂-银等。
参照图2，沿图1中2-2线的截面图描述了本发明的优选实施例中的焊区配置100与常规的DCA元件202。该截面图显示了焊料凸点104以电的和机械的方式将DCA元件202的接触焊区204与焊区配置100的相应的安装用焊区102连接在一起。常规的DCA元件的一个例子是由伊利诺斯州、Schaumberg的摩托罗拉公司制造的MC68HCO5L88微控制器。
参照图3和图4，顶视图和沿4-4线的侧截面图描述了本发明的优选实施例中的具有预定图形306的焊料坯304的一部分加工带300。预定图形306的尺寸要按焊区配置100的尺寸来确定，正如下面要描述的那样，加工带300将用于为焊区配置100形成焊料凸点104。每个焊料坯304的外形最好做成直径约为0.125mm的、大致的球状。也可以采用其它的可与焊区配置100的几何尺寸和形状相符合的直径。
焊料坯304由一层与焊料相兼容的粘性熔剂材料302固定到传送带402上，该熔剂材料302已被熔化，其后重新固化从而将焊料坯304固定到传送带402中的预定图形306上。最好在传送带402及熔剂材料302中打上扣齿孔308。这样做是为了输送传送带并使之与工件夹具对准，从而可以预定的图形306涂敷焊料坯304。该扣齿孔还被用于在安置预定图形306的焊料坯304以形成焊料凸点期间，输送加工带并使之与焊区配置对准。应了解，为了对准传送带402，也可以使用其它的输送和对准装置，如摩擦滚轴输送和光对准标记。
虽然传送带402可以用其它的类似材料，如用厚度约在0.025至0.125mm范围内的聚醚酰亚胺(pelyetherimide)来制造，但最好还是用厚度为0.05mm的聚酰亚胺材料来制造。与焊料相兼容的粘性熔剂材料302最好是厚0.05mm的松香基松香酸的涂层。应了解，己二酸及其它类似的中等分子量的有机多元酸化合物也可用作与焊料相容的粘性熔剂材料302，而且其涂层的厚度可按照焊料坯304的大小和焊区配置100的尺寸而有所变动。优选的材料可有助于使价格变得低廉以及如下文所述有助于制造DCA元件的印刷布线板的、经济上合算的大批量生产技术。
参照图5，加工带300的一个较长部分的顶视图描述了本发明的优选实施例中的多个焊料坯304的预定图形306。在图5中示出的加工带300的较长部分通过实例说明了加工带可以容纳用于重复性的制造工艺的多次重复的焊料坯304的预定图形306。
参照图6，本发明的优选实施例中制造和应用加工带的工艺框图包括用于在传送带402上涂敷与焊料相兼容的粘性熔剂材料302的传送带涂敷台602。上述焊剂材料302的涂敷是通过将与焊料相兼容的粘性熔剂材料302加热到它的熔点以上，然后将熔化的熔剂材料302涂敷在传送带402上(最好采用幕状涂敷(curtain coating)工艺)。另一方面，也可应用滚轴涂敷和遮蔽工艺来涂敷熔化的熔剂材料302。然后将传送带402移至带对准台604，将涂敷有一层熔剂材料的传送带402打上扣齿孔，用来输送传送带402并使其与生产工件夹具对准。接着，把涂敷后的传送带402移至焊料坯安装台606，把涂敷后的传送带402与装有按预定图形306排列的焊料坯304的工件夹具对准定位。例如，该工件夹具通过真空等方法将焊料坯304牢固地吸在应有的位置上，然后使焊料坯304与传送带402上和焊料相兼容的粘性熔剂材料302的涂层接触。当焊料坯304与熔剂材料302接触时，最好通过使加热棒与传送带402接触的方式熔化熔剂材料302。然后通过例如除去真空的方式将焊料坯304从工件夹具释放出来，这样当工件夹具撤回时，焊料坯304就会粘在熔化的熔剂材料302上。
其次，传送带402和粘附在其上的焊料坯304的预定图形306移至带冷却台608，熔剂材料302在此被冷却和重新固化以使焊料坯304固定在其上从而形成加工带300。上述冷却可通过，例如，将热沉棒与传送带402接触的方法来完成。最后，把加工带300移至绕带台610，将加工带300卷绕在卷轴上直到所需要的程度。
当需要在焊区配置100上形成焊料凸点104时，将绕有加工带300的卷轴移至焊料凸点处理台612并装在未经卷绕的区域614之上。由此将加工带300传送到对准工具616内，这是为了从加工带300分别地打印(punching)一个焊料坯304的预定图形306，然后将该单独的焊料坯304的预定图形306与待进行焊料凸点处理的、相应的焊区配置100对准。在对准后将焊料坯304的预定图形306与焊区配置100相接触，然后通过回流熔焊工艺在回流熔焊区域618内进行加热从而在相应的各安装用焊接区102上形成焊料凸点104。其后在一个附加的回流焊工艺中重新加热该焊料凸点104，从而来固定DCA元件202。
应了解在不对本发明中的工艺过程作实质性变动的前提下，本领域的普通技术人员可对应用于上文所述的工艺过程的操作顺序和方法作某些变动。
因此，本发明提供了一种将焊料坯的预定图形固定在传送带上的方法和装置，这是为了应用于在DCA元件的安装中在基板的焊区配置上形成预先定位的焊料凸点。本发明在提供一种廉价、快速的和高质量的DCA安装方法的同时，有助于消除对成本高、费时的焊区配置的焊料电镀的操作的需要。此外，因为加工带可以输运和在任何地方均可应用，故本发明不仅与工厂化生产方面的应用而具与现场修复方面的应用的要求相适应。

Claims (8)

1.一种用于在基板(10)的焊区配置(100)上形成预先定位的焊料凸点(104)而将焊料坯(304)的预定图形(306)固定在传送带(402)上的方法，该方法包括以下步骤：
将焊料坯(304)的预定图形(306)安放在与传送带(402)上的可熔性的粘性熔剂(302)相接触的位置上；
当焊料坯(304)的预定图形(306)与熔剂(302)相接触时，加热熔剂(302)使之熔化；以及
其后将熔剂(302)冷却使之固化后，将焊料坯(304)的预定图形(306)固定在传送带(402)上。
2.如权利要求1的方法，还包括反复进行安放定位、加热和冷却的步骤将多个焊料坯(304)的预定图形(306)固定在传送带(402)上的步骤。
3.如权利要求1的方法，还包括在上述安放定位步骤前将可熔性粘性熔剂(302)涂敷在传送带(402)上的步骤。
4.如权利要求1的方法，其中，安放定位步骤包括将焊料坯(304)装在工件夹具上，从而将焊料坯(304)预先定位在预定图形(306)中的步骤。
5.如权利要求1的方法，其中，安放定位步骤还包括将传送带(402)安放在与工件夹具中的焊料坯(304)的预定图形(306)相接触的位置，从而让传送带(402)的对准定位装置(308)与工件夹具中的对准装置进行对准定位的步骤。
6.如权利要求5的方法，其中，加热步骤包括将焊料坯(304)从工件夹具释放出来，由此让焊料坯(304)的预定图形(306)粘附到熔化的熔剂(302)上的步骤。
7.一种用于在基板(101)的焊区配置(100)上形成预先定位的焊料凸点(104)的加工带(300)，该加工带(300)包括：
一个传送带(402)；
一种涂敷在传送带(402)上用于将焊料坯(304)的预定图形(306)固定在其上的可熔性的粘性熔剂(302)；以及
通过在熔剂(302)处于与焊料坯(304)的预定图形(306)相接触的位置时加热、并随后冷却熔剂(302)的工艺固定到可熔性的粘性熔剂(302)上的焊料坯(304)的预定图形(306)。
8.如权利要求7的加工带(300)，还包括用于将传送带(402)与工件夹具进行对准定位的对准定位装置(308)。
CN94105237A 1993-05-03 1994-04-28 在焊区配置上形成预先定位的焊料凸点的方法和装置 Expired - Fee Related CN1032944C (zh)

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