CN1032944C - 在焊区配置上形成预先定位的焊料凸点的方法和装置 - Google Patents

在焊区配置上形成预先定位的焊料凸点的方法和装置 Download PDF

Info

Publication number
CN1032944C
CN1032944C CN94105237A CN94105237A CN1032944C CN 1032944 C CN1032944 C CN 1032944C CN 94105237 A CN94105237 A CN 94105237A CN 94105237 A CN94105237 A CN 94105237A CN 1032944 C CN1032944 C CN 1032944C
Authority
CN
China
Prior art keywords
scolder
predetermined pattern
conveyer belt
flux
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN94105237A
Other languages
English (en)
Other versions
CN1098225A (zh
Inventor
福兰克·詹斯克
坎纳斯·M·沃斯科
道格拉斯·W·汉瑞科
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of CN1098225A publication Critical patent/CN1098225A/zh
Application granted granted Critical
Publication of CN1032944C publication Critical patent/CN1032944C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203—Fluxing, i.e. applying flux onto surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

一种用于在基板101的焊区配置100上形成预先定位的焊料坯104的方法和装置，包括将焊料坯304的预定图形306安放在与传送带402上的可熔性的粘性熔剂302相接触的位置上，随后加热熔剂302使之熔化。再将熔剂302冷却使之重新固化而将焊料坏304固定在传送带402上。将传送带402对准定位在焊区配置100上，并通过加热焊料坯304将其转移到焊区配置100上以预定的图形306形成焊料凸点104。

Description

本发明一般来说涉及集成电路芯片与基板的安装用焊区配置的直接芯片固定技术。特别涉及为采用直接芯片固定技术而在基板的安装用焊区配置上形成预先定位的焊料凸点(solder bumps)的方法和装置。
直接芯片固定(DCA)技术，也称为“倒装芯片”技术，对在集成电路安装技术方面工作的人员来说是熟知的。在DCA技术中，集成电路芯片在其有源面上有多个与基板上相应的安装用焊区配置互连的端点。在典型情况下，上述互连是通过在基板与芯片间的焊料的凸起区域或焊料“凸点”来进行的，这种焊料凸点在回流焊工艺期间或通过激光加热回熔。由于上述互连的间隙是非常紧凑的，例如，0.5mm，因此为了避免短路和其他缺陷的发生对设置焊料凸点的精确度要求很高。
已经应用的一种形成焊料凸起区域的方法是通过层状的、干的电镀保护膜在焊接区配置上电镀一层锡/铅。但这种方法的缺点是要耗费很多时间。另一种方法是通过遮蔽和回流在焊区配置上形成一层焊料糊剂。该方法的缺点是会产生高的缺陷率从而导致低的成品率。此外还有一种方法是在芯片本身上形成焊料凸点，但此方法在一般情况下是由芯片制造者来进行的，因此除了那些特别昂贵的芯片外，此方法是不实际和不适用的。以上所述的这些形成焊料凸点的方法总的来说会导致电路板或芯片成本有较大的增加。
因此，需要一种为使用DCA技术而形成焊料凸点的方法和装置。这种方法和装置应该是廉价的和快速的，而且能产生高质量的互连。在理想情况下，这种方法和装置应该与工厂化生产和现场修复的应用方面的要求相适应。
本发明的一个方案是一种用于在基板的焊区配置上形成预先定位的焊料凸点的、将预定的焊料坯的图形固定在传送带上的方法。该方法包括将预定的焊料坯的图形与传送带上的可熔性的粘性熔剂相接触，并且在预定的焊料坯图形与熔剂相接触期间加热该熔剂使之熔化的工序。该方法还包括将熔剂冷却使之固化，从而把预定的焊料坯图形固定在传送带上的工序。
本发明的另一个方案是一种在基板的焊区配置上形成预先定位的焊料凸点的方法。该方法包括将通过可熔性的粘性熔剂固定在传送带上的预定的焊料坯图形与基板上的焊区配置进行接触对准，然后通过加热预定的焊料坯图形将预定的焊料坯图形转移到基板的焊区配置上去的工序。
本发明的再一个方案是一种用于在基板的焊区配置上形成预先定位的焊料凸点的加工带。该加工带包括一个传送带以及涂复在传送带上用于在其上固定预定的焊料坯图形的可熔性的粘性熔剂。该加工带还包括在将熔剂放置在与预定的焊料坯图形相接触的位置时通过加热和其后的冷却熔剂的工艺固定到该可熔性的粘性熔剂上的预定的焊料坯图形。
图1是本发明的优选实施例中的焊区配置结构的顶视图。
图2是本发明的优选实施例中的焊区配置和直接芯片固定元件的沿图1中2-2线的截面图。
图3是本发明的优选实施例中的具有预定的焊料坯图形的一部分加工带的顶视图。
图4是本发明优选实施例中的一部分加工带沿图3的4-4线的截面图。
图5是描述本发明的优选实施例中多个预定的焊料坯图形的加工带的一个较长部分的顶视图。
图6是制造和应用根据本发明的优选实施例加工带的工艺框图。
参照图1，本发明的优选实施例中的焊区配置100的顶视图包括基板101、为了固定和互连直接芯片固定(DCA)元件202(图2)的安装用焊区102以及互连引线106。尽管焊区配置100在图1中为4×4的焊点阵列，但应了解对焊区配置100来说，其它的焊接区图形，如仅有周边的焊区、双排焊区、焊区的环状图形等等也可以采用。焊区配置100还包括在第一个回流工序期间回流到安装用焊接区102的焊料凸点104，该焊料凸点104用于在第二个(即其后的)回流过程中将DCA元件固定在基板101上。基板101最好是常规的印刷布线板材料，如环氧树脂玻璃编织成的复合材料。应了解还可以用其它的基板材料，如陶瓷、氰酸脂和降酰亚胺复合材料。安装用焊区102及互连引线106是通常的、以层状方式覆盖在基板101上的铜，它们通过腐蚀形成焊区配置100，之后安装用焊区102及互连引线106上最好再镀一层额外的铜以连接基板中的任何通孔。焊料凸点104材料的锡含量最好是55-75％，其余为铅。应了解，对安装用焊区102及互连引线106来说，也可以用其它的类似材料，如锡、银、金、钯-银或铂-银等。
参照图2，沿图1中2-2线的截面图描述了本发明的优选实施例中的焊区配置100与常规的DCA元件202。该截面图显示了焊料凸点104以电的和机械的方式将DCA元件202的接触焊区204与焊区配置100的相应的安装用焊区102连接在一起。常规的DCA元件的一个例子是由伊利诺斯州、Schaumberg的摩托罗拉公司制造的MC68HCO5L88微控制器。
参照图3和图4，顶视图和沿4-4线的侧截面图描述了本发明的优选实施例中的具有预定图形306的焊料坯304的一部分加工带300。预定图形306的尺寸要按焊区配置100的尺寸来确定，正如下面要描述的那样，加工带300将用于为焊区配置100形成焊料凸点104。每个焊料坯304的外形最好做成直径约为0.125mm的、大致的球状。也可以采用其它的可与焊区配置100的几何尺寸和形状相符合的直径。
焊料坯304由一层与焊料相兼容的粘性熔剂材料302固定到传送带402上，该熔剂材料302已被熔化，其后重新固化从而将焊料坯304固定到传送带402中的预定图形306上。最好在传送带402及熔剂材料302中打上扣齿孔308。这样做是为了输送传送带并使之与工件夹具对准，从而可以预定的图形306涂敷焊料坯304。该扣齿孔还被用于在安置预定图形306的焊料坯304以形成焊料凸点期间，输送加工带并使之与焊区配置对准。应了解，为了对准传送带402，也可以使用其它的输送和对准装置，如摩擦滚轴输送和光对准标记。
虽然传送带402可以用其它的类似材料，如用厚度约在0.025至0.125mm范围内的聚醚酰亚胺(pelyetherimide)来制造，但最好还是用厚度为0.05mm的聚酰亚胺材料来制造。与焊料相兼容的粘性熔剂材料302最好是厚0.05mm的松香基松香酸的涂层。应了解，己二酸及其它类似的中等分子量的有机多元酸化合物也可用作与焊料相容的粘性熔剂材料302，而且其涂层的厚度可按照焊料坯304的大小和焊区配置100的尺寸而有所变动。优选的材料可有助于使价格变得低廉以及如下文所述有助于制造DCA元件的印刷布线板的、经济上合算的大批量生产技术。
参照图5，加工带300的一个较长部分的顶视图描述了本发明的优选实施例中的多个焊料坯304的预定图形306。在图5中示出的加工带300的较长部分通过实例说明了加工带可以容纳用于重复性的制造工艺的多次重复的焊料坯304的预定图形306。
参照图6，本发明的优选实施例中制造和应用加工带的工艺框图包括用于在传送带402上涂敷与焊料相兼容的粘性熔剂材料302的传送带涂敷台602。上述焊剂材料302的涂敷是通过将与焊料相兼容的粘性熔剂材料302加热到它的熔点以上，然后将熔化的熔剂材料302涂敷在传送带402上(最好采用幕状涂敷(curtain coating)工艺)。另一方面，也可应用滚轴涂敷和遮蔽工艺来涂敷熔化的熔剂材料302。然后将传送带402移至带对准台604，将涂敷有一层熔剂材料的传送带402打上扣齿孔，用来输送传送带402并使其与生产工件夹具对准。接着，把涂敷后的传送带402移至焊料坯安装台606，把涂敷后的传送带402与装有按预定图形306排列的焊料坯304的工件夹具对准定位。例如，该工件夹具通过真空等方法将焊料坯304牢固地吸在应有的位置上，然后使焊料坯304与传送带402上和焊料相兼容的粘性熔剂材料302的涂层接触。当焊料坯304与熔剂材料302接触时，最好通过使加热棒与传送带402接触的方式熔化熔剂材料302。然后通过例如除去真空的方式将焊料坯304从工件夹具释放出来，这样当工件夹具撤回时，焊料坯304就会粘在熔化的熔剂材料302上。
其次，传送带402和粘附在其上的焊料坯304的预定图形306移至带冷却台608，熔剂材料302在此被冷却和重新固化以使焊料坯304固定在其上从而形成加工带300。上述冷却可通过，例如，将热沉棒与传送带402接触的方法来完成。最后，把加工带300移至绕带台610，将加工带300卷绕在卷轴上直到所需要的程度。
当需要在焊区配置100上形成焊料凸点104时，将绕有加工带300的卷轴移至焊料凸点处理台612并装在未经卷绕的区域614之上。由此将加工带300传送到对准工具616内，这是为了从加工带300分别地打印(punching)一个焊料坯304的预定图形306，然后将该单独的焊料坯304的预定图形306与待进行焊料凸点处理的、相应的焊区配置100对准。在对准后将焊料坯304的预定图形306与焊区配置100相接触，然后通过回流熔焊工艺在回流熔焊区域618内进行加热从而在相应的各安装用焊接区102上形成焊料凸点104。其后在一个附加的回流焊工艺中重新加热该焊料凸点104，从而来固定DCA元件202。
应了解在不对本发明中的工艺过程作实质性变动的前提下，本领域的普通技术人员可对应用于上文所述的工艺过程的操作顺序和方法作某些变动。
因此，本发明提供了一种将焊料坯的预定图形固定在传送带上的方法和装置，这是为了应用于在DCA元件的安装中在基板的焊区配置上形成预先定位的焊料凸点。本发明在提供一种廉价、快速的和高质量的DCA安装方法的同时，有助于消除对成本高、费时的焊区配置的焊料电镀的操作的需要。此外，因为加工带可以输运和在任何地方均可应用，故本发明不仅与工厂化生产方面的应用而具与现场修复方面的应用的要求相适应。

Claims (8)

1.一种用于在基板(10)的焊区配置(100)上形成预先定位的焊料凸点(104)而将焊料坯(304)的预定图形(306)固定在传送带(402)上的方法，该方法包括以下步骤：
将焊料坯(304)的预定图形(306)安放在与传送带(402)上的可熔性的粘性熔剂(302)相接触的位置上；
当焊料坯(304)的预定图形(306)与熔剂(302)相接触时，加热熔剂(302)使之熔化；以及
其后将熔剂(302)冷却使之固化后，将焊料坯(304)的预定图形(306)固定在传送带(402)上。
2.如权利要求1的方法，还包括反复进行安放定位、加热和冷却的步骤将多个焊料坯(304)的预定图形(306)固定在传送带(402)上的步骤。
3.如权利要求1的方法，还包括在上述安放定位步骤前将可熔性粘性熔剂(302)涂敷在传送带(402)上的步骤。
4.如权利要求1的方法，其中，安放定位步骤包括将焊料坯(304)装在工件夹具上，从而将焊料坯(304)预先定位在预定图形(306)中的步骤。
5.如权利要求1的方法，其中，安放定位步骤还包括将传送带(402)安放在与工件夹具中的焊料坯(304)的预定图形(306)相接触的位置，从而让传送带(402)的对准定位装置(308)与工件夹具中的对准装置进行对准定位的步骤。
6.如权利要求5的方法，其中，加热步骤包括将焊料坯(304)从工件夹具释放出来，由此让焊料坯(304)的预定图形(306)粘附到熔化的熔剂(302)上的步骤。
7.一种用于在基板(101)的焊区配置(100)上形成预先定位的焊料凸点(104)的加工带(300)，该加工带(300)包括：
一个传送带(402)；
一种涂敷在传送带(402)上用于将焊料坯(304)的预定图形(306)固定在其上的可熔性的粘性熔剂(302)；以及
通过在熔剂(302)处于与焊料坯(304)的预定图形(306)相接触的位置时加热、并随后冷却熔剂(302)的工艺固定到可熔性的粘性熔剂(302)上的焊料坯(304)的预定图形(306)。
8.如权利要求7的加工带(300)，还包括用于将传送带(402)与工件夹具进行对准定位的对准定位装置(308)。
CN94105237A 1993-05-03 1994-04-28 在焊区配置上形成预先定位的焊料凸点的方法和装置 Expired - Fee Related CN1032944C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/055,589 US5323947A (en) 1993-05-03 1993-05-03 Method and apparatus for use in forming pre-positioned solder bumps on a pad arrangement
US055,589 1993-05-03

Publications (2)

Publication Number Publication Date
CN1098225A CN1098225A (zh) 1995-02-01
CN1032944C true CN1032944C (zh) 1996-10-02

Family

ID=21998862

Family Applications (1)

Application Number Title Priority Date Filing Date
CN94105237A Expired - Fee Related CN1032944C (zh) 1993-05-03 1994-04-28 在焊区配置上形成预先定位的焊料凸点的方法和装置

Country Status (5)

Country Link
US (1) US5323947A (zh)
CN (1) CN1032944C (zh)
GB (1) GB2277703B (zh)
IE (1) IE78445B1 (zh)
MY (1) MY110743A (zh)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5616206A (en) * 1993-06-15 1997-04-01 Ricoh Company, Ltd. Method for arranging conductive particles on electrodes of substrate
US5457880A (en) * 1994-02-08 1995-10-17 Digital Equipment Corporation Embedded features for monitoring electronics assembly manufacturing processes
US5482200A (en) * 1994-02-22 1996-01-09 Delco Electronics Corporation Method for applying solder to a fine pitch flip chip pattern
US5591037A (en) * 1994-05-31 1997-01-07 Lucent Technologies Inc. Method for interconnecting an electronic device using a removable solder carrying medium
TW250620B (en) * 1994-05-31 1995-07-01 At & T Corp Method for interconnecting an electronic device using a transferable soldercarrying medium
US5447264A (en) * 1994-07-01 1995-09-05 Mcnc Recessed via apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereon
US5539153A (en) * 1994-08-08 1996-07-23 Hewlett-Packard Company Method of bumping substrates by contained paste deposition
US5497938A (en) * 1994-09-01 1996-03-12 Intel Corporation Tape with solder forms and methods for transferring solder to chip assemblies
US5505367A (en) * 1994-11-02 1996-04-09 At&T Corp. Method for bumping silicon devices
US5695109A (en) * 1995-11-22 1997-12-09 Industrial Technology Research Institute Solder paste inter-layer alignment apparatus for area-array on-board rework
US5829124A (en) * 1995-12-29 1998-11-03 International Business Machines Corporation Method for forming metallized patterns on the top surface of a printed circuit board
TW329035B (en) * 1996-02-23 1998-04-01 Siemens Ag Method for producing bumps
US5924622A (en) * 1996-07-17 1999-07-20 International Business Machines Corp. Method and apparatus for soldering ball grid array modules to substrates
WO1998012908A1 (fr) * 1996-09-17 1998-03-26 Matsushita Electric Industrial Co., Ltd. Procede et appareil pour la mise sous boitier des puces a circuit integre, et support en forme de bande conçu pour etre utilise a cet effet
TW379392B (en) * 1996-10-30 2000-01-11 Du Pont Product and method for placing particles on contact pads of electronic devices
US6006981A (en) * 1996-11-19 1999-12-28 Texas Instruments Incorporated Wirefilm bonding for electronic component interconnection
US5931371A (en) * 1997-01-16 1999-08-03 Ford Motor Company Standoff controlled interconnection
US6230963B1 (en) 1997-01-28 2001-05-15 Eric L. Hertz Method and apparatus using colored foils for placing conductive preforms
US6202918B1 (en) 1997-01-28 2001-03-20 Eric Hertz Method and apparatus for placing conductive preforms
US6427903B1 (en) 1997-02-06 2002-08-06 Speedline Technologies, Inc. Solder ball placement apparatus
US6056190A (en) * 1997-02-06 2000-05-02 Speedline Technologies, Inc. Solder ball placement apparatus
US6641030B1 (en) 1997-02-06 2003-11-04 Speedline Technologies, Inc. Method and apparatus for placing solder balls on a substrate
US5873511A (en) * 1997-05-08 1999-02-23 Shapiro; Herbert M. Apparatus and method for forming solder bonding pads
US6000603A (en) * 1997-05-23 1999-12-14 3M Innovative Properties Company Patterned array of metal balls and methods of making
US6324069B1 (en) 1997-10-29 2001-11-27 Hestia Technologies, Inc. Chip package with molded underfill
US6495083B2 (en) 1997-10-29 2002-12-17 Hestia Technologies, Inc. Method of underfilling an integrated circuit chip
US6038136A (en) * 1997-10-29 2000-03-14 Hestia Technologies, Inc. Chip package with molded underfill
US6143374A (en) * 1998-02-04 2000-11-07 E. I. Du Pont De Nemours And Company Method for precise placement of an array of single particles on a surface
US6419148B1 (en) 2001-01-23 2002-07-16 Orbotech Ltd. System for forming bumps on wafers
WO2005067358A1 (en) * 2004-01-07 2005-07-21 Infineon Technologies Ag Method and apparatus for soldering modules to substrates
US20070228112A1 (en) * 2006-03-31 2007-10-04 Wei Shi Method and arrangement for forming a microelectronic package
US7600667B2 (en) * 2006-09-29 2009-10-13 Intel Corporation Method of assembling carbon nanotube reinforced solder caps
TWM403123U (en) * 2010-09-08 2011-05-01 Ant Percision Industry Co Ltd Electrical connector structure with multi-poles
CN102734760A (zh) * 2011-04-13 2012-10-17 苏州世鼎电子有限公司 通过转印锡膏而在金属线路上形成电源接点的方法
CN103187325A (zh) * 2011-12-30 2013-07-03 北京大学深圳研究生院 一种用于凸点制造的激光定位方法
US9362256B2 (en) * 2014-10-08 2016-06-07 Dyi-chung Hu Bonding process for a chip bonding to a thin film substrate
KR102347394B1 (ko) * 2015-02-12 2022-01-06 삼성전자주식회사 회로 기판을 포함하는 전자 장치
US20190267346A1 (en) * 2018-02-28 2019-08-29 Powertech Technology Inc. Flux transfer tool and flux transfer method
USD908648S1 (en) * 2019-12-12 2021-01-26 Topline Corporation Adjustable fixture for aligning column grid array substrates
US11631650B2 (en) 2021-06-15 2023-04-18 International Business Machines Corporation Solder transfer integrated circuit packaging

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB994410A (en) * 1961-05-03 1965-06-10 Kay & Co Eng Ltd Improvements in and relating to solder for use in the jointing of pipes
US3396894A (en) * 1965-05-11 1968-08-13 Raychem Corp Solder device
DE3173078D1 (en) * 1981-12-29 1986-01-09 Ibm Soldering method of pins to eyelets of conductors formed on a ceramic substrate
DE3685647T2 (de) * 1985-07-16 1993-01-07 Nippon Telegraph & Telephone Verbindungskontakte zwischen substraten und verfahren zur herstellung derselben.
US4720324A (en) * 1985-10-03 1988-01-19 Hayward John S Process for manufacturing printed circuit boards
US4680199A (en) * 1986-03-21 1987-07-14 United Technologies Corporation Method for depositing a layer of abrasive material on a substrate
US4832255A (en) * 1988-07-25 1989-05-23 International Business Machines Corporation Precision solder transfer method and means
US5088639A (en) * 1991-01-25 1992-02-18 Motorola, Inc. Soldering process
US5118027A (en) * 1991-04-24 1992-06-02 International Business Machines Corporation Method of aligning and mounting solder balls to a substrate
US5205896A (en) * 1992-02-03 1993-04-27 Hughes Aircraft Company Component and solder preform placement device and method of placement

Also Published As

Publication number Publication date
IE940370A1 (en) 1994-11-16
CN1098225A (zh) 1995-02-01
GB9408628D0 (en) 1994-06-22
MY110743A (en) 1999-02-27
GB2277703A (en) 1994-11-09
IE78445B1 (en) 1998-02-11
US5323947A (en) 1994-06-28
GB2277703B (en) 1995-12-13

Similar Documents

Publication Publication Date Title
CN1032944C (zh) 在焊区配置上形成预先定位的焊料凸点的方法和装置
US6855623B2 (en) Recessed tape and method for forming a BGA assembly
KR100257420B1 (ko) 결합 재료 범프에 의해 상호접속되는 시스템
JP4809761B2 (ja) エリアアレイデバイスを電気基板に取り付ける方法及びパターン付きアンダーフィル膜
AU661867B2 (en) Plated compliant lead
US20130335931A1 (en) Surface mount interconnection system for modular circuit board and method
JP2862524B2 (ja) ３次元積層型パッケージ素子の自動積層及びソルダリング装置並びにその製造方法
WO2004086845A2 (en) Flip-chip assembley with thin underfill and thick solder mask
KR20010086313A (ko) 범프를 가진 전자 부품 제조 방법 및 전자 부품 제조 방법
EP0845807B1 (en) Method and tool for making an electronic circuit having uniform solder residues after solder paste transfer
US6686222B2 (en) Stacked semiconductor device manufacturing method
JP2631665B2 (ja) 積層半導体装置の製造方法
EP3621417B1 (en) Method for applying electronic components
EP0469848A2 (en) Attaching integrated circuits to circuit boards
JP3362370B2 (ja) 導電性ボール配列シートおよび導電性ボール配列シート製造装置
JPH1079400A (ja) 半導体装置の実装方法及び半導体装置の構造
US6168971B1 (en) Method of assembling thin film jumper connectors to a substrate
JPH0957432A (ja) 半田供給用キャリア
JP2001036224A (ja) 樹脂製配線基板及びその製造方法
KR20000040510A (ko) 캐리어 프레임에 테이프 비지에이 기판을 자동접착하는 방법
KR100499336B1 (ko) 플립칩 패키지소자와 제조방법
JP3336999B2 (ja) バンプシートとこれを用いたバンプ形成装置及びバンプ形成方法
JP3214009B2 (ja) 半導体素子の実装基板および方法
JPH05259632A (ja) プリント配線板およびその製造方法
CN116844982A (zh) 一种光mos继电器的封装方法

Legal Events

Date Code Title Description
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C06 Publication
PB01 Publication
C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee