USD908648S1 - Adjustable fixture for aligning column grid array substrates - Google Patents

Adjustable fixture for aligning column grid array substrates Download PDF

Info

Publication number
USD908648S1
USD908648S1 US29/716,908 US201929716908F USD908648S US D908648 S1 USD908648 S1 US D908648S1 US 201929716908 F US201929716908 F US 201929716908F US D908648 S USD908648 S US D908648S
Authority
US
United States
Prior art keywords
grid array
array substrates
adjustable fixture
column grid
aligning column
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/716,908
Inventor
Martin B. Hart
Robert H. Komrij
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Topline Corp
Original Assignee
Topline Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Topline Corp filed Critical Topline Corp
Priority to US29/716,908 priority Critical patent/USD908648S1/en
Assigned to TOPLINE CORPORATION reassignment TOPLINE CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HART, MARTIN B., KOMRIJ, ROBERT H.
Application granted granted Critical
Publication of USD908648S1 publication Critical patent/USD908648S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a top perspective view of an adjustable fixture for aligning column grid array substrates, showing our new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a top view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is a front view thereof; and,
FIG. 8 is a rear view thereof.
The broken lines in the drawings represent portions of the adjustable fixture for aligning column grid array substrates that form not part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for an adjustable fixture for aligning column grid array substrates, as shown and described.
US29/716,908 2019-12-12 2019-12-12 Adjustable fixture for aligning column grid array substrates Active USD908648S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/716,908 USD908648S1 (en) 2019-12-12 2019-12-12 Adjustable fixture for aligning column grid array substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/716,908 USD908648S1 (en) 2019-12-12 2019-12-12 Adjustable fixture for aligning column grid array substrates

Publications (1)

Publication Number Publication Date
USD908648S1 true USD908648S1 (en) 2021-01-26

Family

ID=74185582

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/716,908 Active USD908648S1 (en) 2019-12-12 2019-12-12 Adjustable fixture for aligning column grid array substrates

Country Status (1)

Country Link
US (1) USD908648S1 (en)

Citations (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3838984A (en) 1973-04-16 1974-10-01 Sperry Rand Corp Flexible carrier and interconnect for uncased ic chips
US4664309A (en) 1983-06-30 1987-05-12 Raychem Corporation Chip mounting device
US4705205A (en) 1983-06-30 1987-11-10 Raychem Corporation Chip carrier mounting device
US4712721A (en) 1986-03-17 1987-12-15 Raychem Corp. Solder delivery systems
US4842184A (en) 1988-06-23 1989-06-27 Ltv Aerospace & Defense Company Method and apparatus for applying solder preforms
US5029748A (en) 1987-07-10 1991-07-09 Amp Incorporated Solder preforms in a cast array
US5040717A (en) 1990-03-27 1991-08-20 Metcal, Inc. Solder delivery system
US5323947A (en) * 1993-05-03 1994-06-28 Motorola, Inc. Method and apparatus for use in forming pre-positioned solder bumps on a pad arrangement
US5497938A (en) 1994-09-01 1996-03-12 Intel Corporation Tape with solder forms and methods for transferring solder to chip assemblies
US5626278A (en) 1994-04-15 1997-05-06 Tang; Ching C. Solder delivery and array apparatus
US5695109A (en) 1995-11-22 1997-12-09 Industrial Technology Research Institute Solder paste inter-layer alignment apparatus for area-array on-board rework
USD402273S (en) 1996-12-26 1998-12-08 Sony Corporation Connector for printed circuit boards
USD402274S (en) 1997-04-01 1998-12-08 Sony Corporation Connector for printed circuit boards
USD407383S (en) 1996-12-11 1999-03-30 Sony Corporation Connector for printed circuit boards
USD421968S (en) 1998-04-21 2000-03-28 Advantest Corporation Contactor for semiconductor IC testers
USD426522S (en) 1998-04-21 2000-06-13 Advantest Corporation Contactor for semiconductor IC testers
US6136128A (en) 1998-06-23 2000-10-24 Amerasia International Technology, Inc. Method of making an adhesive preform lid for electronic devices
US6204678B1 (en) 1997-03-17 2001-03-20 Micron Technology, Inc. Direct connect interconnect for testing semiconductor dice and wafers
US6251767B1 (en) * 1997-01-14 2001-06-26 Texas Instruments Incorporated Ball grid assembly with solder columns
US6276596B1 (en) 2000-08-28 2001-08-21 International Business Machines Corporation Low temperature solder column attach by injection molded solder and structure formed
US6296173B2 (en) 1996-07-17 2001-10-02 International Business Machines Corporation Method and apparatus for soldering ball grid array modules to substrates
US6412685B2 (en) 1997-01-28 2002-07-02 Galahad, Co. Method and apparatus for release and optional inspection for conductive preforms placement apparatus
US20020102767A1 (en) * 2001-01-31 2002-08-01 Sturcken Keith K. Ball grid array (BGA) to column grid array (CGA) conversion process
US20040144834A1 (en) * 2003-01-15 2004-07-29 Shinichi Nomoto Apparatus and method for aligning and attaching solder columns to a substrate
USD503691S1 (en) 2001-03-28 2005-04-05 International Rectifier Corporation Conductive clip for a semiconductor package
US6955285B2 (en) 2002-12-17 2005-10-18 Senju Metal Industry Co., Ltd. Apparatus for aligning and dispensing solder columns in an array
US7569474B2 (en) * 2004-01-07 2009-08-04 Infineon Technologies Ag Method and apparatus for soldering modules to substrates
US20090223710A1 (en) 2008-03-07 2009-09-10 International Business Machines Corporation Method of Forming Solid Vias in a Printed Circuit Board
US20090267227A1 (en) 2008-04-24 2009-10-29 Lockheed Martin Corporation Plastic ball grid array ruggedization
US8277255B2 (en) 2010-12-10 2012-10-02 Tyco Electronics Corporation Interconnect member for an electronic module with embedded components
US8739392B2 (en) * 2009-06-30 2014-06-03 Intel Corporation Cast grid array (CGA) package and socket
US20140262498A1 (en) 2013-03-13 2014-09-18 U.S.A. As Represented By The Administrator Of The National Aeronautics And Space Administration Interconnect Device and Assemblies Made Therewith
US9108262B1 (en) 2014-04-17 2015-08-18 Topline Corporation Disposable apparatus for aligning and dispensing solder columns in an array
US9629259B1 (en) 2016-08-16 2017-04-18 Topline Corporation Refillable apparatus for aligning and depositing solder columns in a column grid array
USD808350S1 (en) 2017-03-06 2018-01-23 Topline Corporation Fixture for delivering interconnect members onto a substrate
USD874413S1 (en) 2018-11-02 2020-02-04 Topline Corporation Fixture for delivering 1752 solder columns onto a substrate

Patent Citations (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3838984A (en) 1973-04-16 1974-10-01 Sperry Rand Corp Flexible carrier and interconnect for uncased ic chips
US4664309A (en) 1983-06-30 1987-05-12 Raychem Corporation Chip mounting device
US4705205A (en) 1983-06-30 1987-11-10 Raychem Corporation Chip carrier mounting device
US4712721A (en) 1986-03-17 1987-12-15 Raychem Corp. Solder delivery systems
US5029748A (en) 1987-07-10 1991-07-09 Amp Incorporated Solder preforms in a cast array
US4842184A (en) 1988-06-23 1989-06-27 Ltv Aerospace & Defense Company Method and apparatus for applying solder preforms
US5040717A (en) 1990-03-27 1991-08-20 Metcal, Inc. Solder delivery system
US5323947A (en) * 1993-05-03 1994-06-28 Motorola, Inc. Method and apparatus for use in forming pre-positioned solder bumps on a pad arrangement
US5626278A (en) 1994-04-15 1997-05-06 Tang; Ching C. Solder delivery and array apparatus
US5497938A (en) 1994-09-01 1996-03-12 Intel Corporation Tape with solder forms and methods for transferring solder to chip assemblies
US5695109A (en) 1995-11-22 1997-12-09 Industrial Technology Research Institute Solder paste inter-layer alignment apparatus for area-array on-board rework
US6296173B2 (en) 1996-07-17 2001-10-02 International Business Machines Corporation Method and apparatus for soldering ball grid array modules to substrates
USD407383S (en) 1996-12-11 1999-03-30 Sony Corporation Connector for printed circuit boards
USD402273S (en) 1996-12-26 1998-12-08 Sony Corporation Connector for printed circuit boards
US6251767B1 (en) * 1997-01-14 2001-06-26 Texas Instruments Incorporated Ball grid assembly with solder columns
US6412685B2 (en) 1997-01-28 2002-07-02 Galahad, Co. Method and apparatus for release and optional inspection for conductive preforms placement apparatus
US6204678B1 (en) 1997-03-17 2001-03-20 Micron Technology, Inc. Direct connect interconnect for testing semiconductor dice and wafers
USD402274S (en) 1997-04-01 1998-12-08 Sony Corporation Connector for printed circuit boards
USD432504S (en) 1998-04-21 2000-10-24 Advantest Corporation Contactor for semiconductor IC testers
USD426522S (en) 1998-04-21 2000-06-13 Advantest Corporation Contactor for semiconductor IC testers
USD421968S (en) 1998-04-21 2000-03-28 Advantest Corporation Contactor for semiconductor IC testers
US6136128A (en) 1998-06-23 2000-10-24 Amerasia International Technology, Inc. Method of making an adhesive preform lid for electronic devices
US6276596B1 (en) 2000-08-28 2001-08-21 International Business Machines Corporation Low temperature solder column attach by injection molded solder and structure formed
US20020102767A1 (en) * 2001-01-31 2002-08-01 Sturcken Keith K. Ball grid array (BGA) to column grid array (CGA) conversion process
USD503691S1 (en) 2001-03-28 2005-04-05 International Rectifier Corporation Conductive clip for a semiconductor package
US6955285B2 (en) 2002-12-17 2005-10-18 Senju Metal Industry Co., Ltd. Apparatus for aligning and dispensing solder columns in an array
US20040144834A1 (en) * 2003-01-15 2004-07-29 Shinichi Nomoto Apparatus and method for aligning and attaching solder columns to a substrate
US7569474B2 (en) * 2004-01-07 2009-08-04 Infineon Technologies Ag Method and apparatus for soldering modules to substrates
US20090223710A1 (en) 2008-03-07 2009-09-10 International Business Machines Corporation Method of Forming Solid Vias in a Printed Circuit Board
US20090267227A1 (en) 2008-04-24 2009-10-29 Lockheed Martin Corporation Plastic ball grid array ruggedization
US8739392B2 (en) * 2009-06-30 2014-06-03 Intel Corporation Cast grid array (CGA) package and socket
US8277255B2 (en) 2010-12-10 2012-10-02 Tyco Electronics Corporation Interconnect member for an electronic module with embedded components
US20140262498A1 (en) 2013-03-13 2014-09-18 U.S.A. As Represented By The Administrator Of The National Aeronautics And Space Administration Interconnect Device and Assemblies Made Therewith
US9108262B1 (en) 2014-04-17 2015-08-18 Topline Corporation Disposable apparatus for aligning and dispensing solder columns in an array
US9629259B1 (en) 2016-08-16 2017-04-18 Topline Corporation Refillable apparatus for aligning and depositing solder columns in a column grid array
USD808350S1 (en) 2017-03-06 2018-01-23 Topline Corporation Fixture for delivering interconnect members onto a substrate
USD874413S1 (en) 2018-11-02 2020-02-04 Topline Corporation Fixture for delivering 1752 solder columns onto a substrate

Similar Documents

Publication Publication Date Title
USD883260S1 (en) Earphone
USD863263S1 (en) Earphone
USD841864S1 (en) Solar lamp
USD883621S1 (en) Shoe
USD882989S1 (en) Console
USD872869S1 (en) Massage gun
USD894641S1 (en) Stand
USD893923S1 (en) Retail fixture
USD804961S1 (en) Tray
USD853403S1 (en) Support for television apparatus
USD867036S1 (en) Retail fixture
USD876392S1 (en) Headphone
USD880425S1 (en) Wall socket
USD816200S1 (en) Humidifier
USD859681S1 (en) Blackhead remover
USD862213S1 (en) Adapter for supporting an electronic device
USD853625S1 (en) Lighting module heatsink
USD877116S1 (en) Headphone
USD844213S1 (en) Solar lamp
USD834844S1 (en) Chair
USD877743S1 (en) TV mount bracket
USD885631S1 (en) Solar lamp
USD881447S1 (en) Solar lamp
USD868924S1 (en) Firearm stock
USD852446S1 (en) Drying rack

Legal Events

Date Code Title Description
FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY

FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO SMALL (ORIGINAL EVENT CODE: SMAL); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY