CN101165882A - 制造薄膜晶体管基板的方法 - Google Patents

制造薄膜晶体管基板的方法 Download PDF

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Publication number
CN101165882A
CN101165882A CNA2007101671041A CN200710167104A CN101165882A CN 101165882 A CN101165882 A CN 101165882A CN A2007101671041 A CNA2007101671041 A CN A2007101671041A CN 200710167104 A CN200710167104 A CN 200710167104A CN 101165882 A CN101165882 A CN 101165882A
Authority
CN
China
Prior art keywords
reaction
byproduct
etching
conductive layer
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007101671041A
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English (en)
Chinese (zh)
Inventor
崔升夏
金湘甲
吴旼锡
崔新逸
金大玉
秦洪基
丁荣镐
丁有光
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of CN101165882A publication Critical patent/CN101165882A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • H10D30/0312—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes
    • H10D30/0316—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes of lateral bottom-gate TFTs comprising only a single gate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01—Manufacture or treatment
    • H10D86/021—Manufacture or treatment of multiple TFTs
    • H10D86/0231—Manufacture or treatment of multiple TFTs using masks, e.g. half-tone masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/27—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers

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  • Thin Film Transistor (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Drying Of Semiconductors (AREA)
CNA2007101671041A 2006-10-18 2007-10-18 制造薄膜晶体管基板的方法 Pending CN101165882A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020060101428A KR20080035150A (ko) 2006-10-18 2006-10-18 박막 트랜지스터 기판의 제조 방법
KR101428/06 2006-10-18

Publications (1)

Publication Number Publication Date
CN101165882A true CN101165882A (zh) 2008-04-23

Family

ID=38941885

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007101671041A Pending CN101165882A (zh) 2006-10-18 2007-10-18 制造薄膜晶体管基板的方法

Country Status (6)

Country Link
US (1) US20080093334A1 (https=)
EP (1) EP1914802A2 (https=)
JP (1) JP2008103658A (https=)
KR (1) KR20080035150A (https=)
CN (1) CN101165882A (https=)
TW (1) TW200820446A (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010026975A1 (ja) 2008-09-02 2010-03-11 独立行政法人産業技術総合研究所 非晶質アルミニウムケイ酸塩の製造方法、及びその方法により得られた非晶質アルミニウムケイ酸塩、並びにそれを用いた吸着剤
KR101682078B1 (ko) 2010-07-30 2016-12-05 삼성디스플레이 주식회사 박막 트랜지스터 표시판의 제조 방법
JP5836846B2 (ja) * 2011-03-11 2015-12-24 株式会社半導体エネルギー研究所 液晶表示装置の作製方法
KR102030797B1 (ko) * 2012-03-30 2019-11-11 삼성디스플레이 주식회사 박막 트랜지스터 표시판 제조 방법
CN107895713B (zh) * 2017-11-30 2020-05-05 深圳市华星光电半导体显示技术有限公司 Tft基板制作方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3191745B2 (ja) * 1997-04-23 2001-07-23 日本電気株式会社 薄膜トランジスタ素子及びその製造方法
US7479205B2 (en) * 2000-09-22 2009-01-20 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus
US8148895B2 (en) * 2004-10-01 2012-04-03 Semiconductor Energy Laboratory Co., Ltd. Display device and manufacturing method of the same
KR100614323B1 (ko) * 2004-12-30 2006-08-21 엘지.필립스 엘시디 주식회사 액정표시장치 및 그 제조방법

Also Published As

Publication number Publication date
EP1914802A2 (en) 2008-04-23
US20080093334A1 (en) 2008-04-24
TW200820446A (en) 2008-05-01
JP2008103658A (ja) 2008-05-01
KR20080035150A (ko) 2008-04-23

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Open date: 20080423