CN101160033B - 传热复合材料、相关装置和方法 - Google Patents

传热复合材料、相关装置和方法 Download PDF

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Publication number
CN101160033B
CN101160033B CN2006101729616A CN200610172961A CN101160033B CN 101160033 B CN101160033 B CN 101160033B CN 2006101729616 A CN2006101729616 A CN 2006101729616A CN 200610172961 A CN200610172961 A CN 200610172961A CN 101160033 B CN101160033 B CN 101160033B
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China
Prior art keywords
heat transfer
pyrolytic graphite
transfer composite
aluminium
matrix
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Expired - Fee Related
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CN2006101729616A
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English (en)
Chinese (zh)
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CN101160033A (zh
Inventor
H·萨伊尔
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Momentive Performance Materials Inc
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Momentive Performance Materials Inc
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN2006101729616A 2006-10-08 2006-11-30 传热复合材料、相关装置和方法 Expired - Fee Related CN101160033B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US82864706P 2006-10-08 2006-10-08
US60/828647 2006-10-08
US11/555,688 US20080085403A1 (en) 2006-10-08 2006-11-02 Heat transfer composite, associated device and method
US11/555688 2006-11-02

Publications (2)

Publication Number Publication Date
CN101160033A CN101160033A (zh) 2008-04-09
CN101160033B true CN101160033B (zh) 2013-03-20

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Family Applications (1)

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CN2006101729616A Expired - Fee Related CN101160033B (zh) 2006-10-08 2006-11-30 传热复合材料、相关装置和方法

Country Status (5)

Country Link
US (1) US20080085403A1 (https=)
JP (1) JP5224682B2 (https=)
KR (1) KR20080032018A (https=)
CN (1) CN101160033B (https=)
DE (1) DE102006056988A1 (https=)

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DE102008010746A1 (de) * 2008-02-20 2009-09-03 I-Sol Ventures Gmbh Wärmespeicher-Verbundmaterial
US20090277608A1 (en) * 2008-05-07 2009-11-12 Kamins Theodore I Thermal Control Via Adjustable Thermal Links
DE102008034257B4 (de) 2008-07-17 2011-12-08 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Gesinterter schall- und schwingungsdämpfender Werkstoff und Verfahren zu dessen Herstellung
JP5335339B2 (ja) * 2008-09-11 2013-11-06 株式会社エー・エム・テクノロジー 黒鉛一金属複合体とアルミニウム押出材の組合せからなる放熱体。
JP5309065B2 (ja) * 2009-03-25 2013-10-09 積水化学工業株式会社 塩素含有炭化水素樹脂組成物及び成形体
US8085531B2 (en) * 2009-07-14 2011-12-27 Specialty Minerals (Michigan) Inc. Anisotropic thermal conduction element and manufacturing method
US8881797B2 (en) 2010-05-05 2014-11-11 Ametek, Inc. Compact plate-fin heat exchanger utilizing an integral heat transfer layer
DE102011079471B4 (de) * 2011-07-20 2024-05-29 Trumpf Laser Gmbh Verfahren zur Bildung eines Kohlenstoff-Metall-Verbundwerkstoffs
DE102012112643A1 (de) * 2012-12-19 2014-06-26 Ald Vacuum Technologies Gmbh Graphitmatrix mit metallischem Bindemittel
US20150096731A1 (en) * 2013-10-04 2015-04-09 Specialty Minerals (Michigan) Inc. Device and System for Dissipating Heat, and Method of Making Same
US20150096719A1 (en) * 2013-10-04 2015-04-09 Specialty Minerals (Michigan) Inc. Apparatus for Dissipating Heat
KR101527388B1 (ko) * 2013-11-19 2015-06-09 실리콘밸리(주) 고밀도 열확산시트의 제조방법 및 제조장치
CN104754913B (zh) * 2013-12-27 2018-06-05 华为技术有限公司 导热复合材料片及其制作方法
US10563290B2 (en) 2014-09-09 2020-02-18 Shirogane Co., Ltd. Al alloy containing Cu and C and its manufacturing method
US9791704B2 (en) * 2015-01-20 2017-10-17 Microsoft Technology Licensing, Llc Bonded multi-layer graphite heat pipe
US10444515B2 (en) 2015-01-20 2019-10-15 Microsoft Technology Licensing, Llc Convective optical mount structure
US10108017B2 (en) 2015-01-20 2018-10-23 Microsoft Technology Licensing, Llc Carbon nanoparticle infused optical mount
US10028418B2 (en) 2015-01-20 2018-07-17 Microsoft Technology Licensing, Llc Metal encased graphite layer heat pipe
DE102015115244A1 (de) * 2015-09-10 2017-03-16 Infineon Technologies Ag Kühlkörper mit graphen-lagen und elektronikbaugruppe
CN106399763B (zh) * 2015-11-03 2018-03-23 鸿宝科技股份有限公司 一种适用于led的铝合金散热材料及其制备方法及用途
CN105722375B (zh) * 2016-01-29 2018-03-06 白德旭 一种石墨烯散热装置及其制备方法
US10462940B2 (en) * 2016-07-08 2019-10-29 CPS Technologies Thermal management device for heat generating power electronics incorporating high thermal conductivity pyrolytic graphite and cooling tubes
US10955433B2 (en) 2018-03-23 2021-03-23 Rosemount Aerospace Inc. Hybrid material aircraft sensors having an encapsulated insert in a probe wall formed from a higher conductive material than the probe wall
EP3781891B1 (en) * 2018-04-16 2024-04-10 Fain, Romy M. Fabrication methods, structures, and uses for passive radiative cooling
US20210242049A1 (en) * 2018-08-01 2021-08-05 Momentive Performance Materials Quartz, Inc. Detachable thermal leveler
CN111235420A (zh) * 2020-01-16 2020-06-05 西北工业大学 一种添加镀铜铝片改善鳞片石墨铝基复合材料层间排布均匀性的方法
US11313631B2 (en) * 2020-07-07 2022-04-26 Hfc Industry Limited Composite heat sink having anisotropic heat transfer metal-graphite composite fins
CN112852389A (zh) * 2021-03-23 2021-05-28 依润特工业智能科技(苏州)有限公司 一种5g通讯用高强度导热材料及其制备方法
LU500101B1 (en) * 2021-04-29 2022-10-31 Variowell Dev Gmbh Multilayer Plate
JP2023006510A (ja) * 2021-06-30 2023-01-18 日亜化学工業株式会社 発光モジュール、車両用灯具、及び、放熱部材

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US6075701A (en) * 1999-05-14 2000-06-13 Hughes Electronics Corporation Electronic structure having an embedded pyrolytic graphite heat sink material
US6131651A (en) * 1998-09-16 2000-10-17 Advanced Ceramics Corporation Flexible heat transfer device and method
US6407922B1 (en) * 2000-09-29 2002-06-18 Intel Corporation Heat spreader, electronic package including the heat spreader, and methods of manufacturing the heat spreader

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US5296310A (en) * 1992-02-14 1994-03-22 Materials Science Corporation High conductivity hydrid material for thermal management
US5863467A (en) * 1996-05-03 1999-01-26 Advanced Ceramics Corporation High thermal conductivity composite and method
JPH1157996A (ja) * 1997-08-21 1999-03-02 Matsushita Electric Ind Co Ltd こて先部材および半田ごて
US5958572A (en) * 1997-09-30 1999-09-28 Motorola, Inc. Hybrid substrate for cooling an electronic component
US5998733A (en) * 1997-10-06 1999-12-07 Northrop Grumman Corporation Graphite aluminum metal matrix composite microelectronic package
JP2001339022A (ja) * 1999-12-24 2001-12-07 Ngk Insulators Ltd ヒートシンク材及びその製造方法
JP2002097533A (ja) * 2000-09-26 2002-04-02 Sumitomo Electric Ind Ltd 金属基複合材料の製造方法
US6758263B2 (en) * 2001-12-13 2004-07-06 Advanced Energy Technology Inc. Heat dissipating component using high conducting inserts
US20050189647A1 (en) * 2002-10-11 2005-09-01 Chien-Min Sung Carbonaceous composite heat spreader and associated methods
JP4711165B2 (ja) * 2004-06-21 2011-06-29 日立金属株式会社 高熱伝導・低熱膨脹複合体およびその製造方法
JP5082845B2 (ja) * 2005-03-29 2012-11-28 日立金属株式会社 高熱伝導性黒鉛粒子分散型複合体及びその製造方法

Patent Citations (3)

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US6131651A (en) * 1998-09-16 2000-10-17 Advanced Ceramics Corporation Flexible heat transfer device and method
US6075701A (en) * 1999-05-14 2000-06-13 Hughes Electronics Corporation Electronic structure having an embedded pyrolytic graphite heat sink material
US6407922B1 (en) * 2000-09-29 2002-06-18 Intel Corporation Heat spreader, electronic package including the heat spreader, and methods of manufacturing the heat spreader

Also Published As

Publication number Publication date
US20080085403A1 (en) 2008-04-10
JP5224682B2 (ja) 2013-07-03
CN101160033A (zh) 2008-04-09
DE102006056988A1 (de) 2008-04-10
JP2008095171A (ja) 2008-04-24
KR20080032018A (ko) 2008-04-14

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