CN101098936B - 导热硅氧烷弹性体、导热硅氧烷弹性体组合物和导热介质 - Google Patents

导热硅氧烷弹性体、导热硅氧烷弹性体组合物和导热介质 Download PDF

Info

Publication number
CN101098936B
CN101098936B CN200580029110XA CN200580029110A CN101098936B CN 101098936 B CN101098936 B CN 101098936B CN 200580029110X A CN200580029110X A CN 200580029110XA CN 200580029110 A CN200580029110 A CN 200580029110A CN 101098936 B CN101098936 B CN 101098936B
Authority
CN
China
Prior art keywords
methyl
component
polysiloxane
vinyl
conductive silicone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN200580029110XA
Other languages
English (en)
Chinese (zh)
Other versions
CN101098936A (zh
Inventor
关场一广
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Publication of CN101098936A publication Critical patent/CN101098936A/zh
Application granted granted Critical
Publication of CN101098936B publication Critical patent/CN101098936B/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00—Compositions for adhesives
    • C08G2170/40—Compositions for pressure-sensitive adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2330/00—Thermal insulation material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN200580029110XA 2004-08-30 2005-08-29 导热硅氧烷弹性体、导热硅氧烷弹性体组合物和导热介质 Expired - Lifetime CN101098936B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP251098/2004 2004-08-30
JP2004251098 2004-08-30
JP2005238279A JP5015436B2 (ja) 2004-08-30 2005-08-19 熱伝導性シリコーンエラストマー、熱伝導媒体および熱伝導性シリコーンエラストマー組成物
JP238279/2005 2005-08-19
PCT/JP2005/016170 WO2006025552A1 (en) 2004-08-30 2005-08-29 Thermoconductive silicone elastomer, thermoconductive silicone elastomer composition and thermoconductive medium

Publications (2)

Publication Number Publication Date
CN101098936A CN101098936A (zh) 2008-01-02
CN101098936B true CN101098936B (zh) 2011-01-12

Family

ID=35285469

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200580029110XA Expired - Lifetime CN101098936B (zh) 2004-08-30 2005-08-29 导热硅氧烷弹性体、导热硅氧烷弹性体组合物和导热介质

Country Status (9)

Country Link
US (1) US7956121B2 (https=)
EP (1) EP1791911B9 (https=)
JP (1) JP5015436B2 (https=)
KR (1) KR101261250B1 (https=)
CN (1) CN101098936B (https=)
AT (1) ATE444337T1 (https=)
DE (1) DE602005016948D1 (https=)
TW (1) TWI397555B (https=)
WO (1) WO2006025552A1 (https=)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5015436B2 (ja) * 2004-08-30 2012-08-29 東レ・ダウコーニング株式会社 熱伝導性シリコーンエラストマー、熱伝導媒体および熱伝導性シリコーンエラストマー組成物
US8907026B2 (en) 2004-12-23 2014-12-09 Dow Corning Corporation Crosslinkable saccharide-siloxane compositions, and networks, coatings and articles formed therefrom
JP5122444B2 (ja) 2005-05-23 2013-01-16 ダウ・コーニング・コーポレイション サッカリド−シロキサンコポリマーを含むパーソナルケア組成物
KR101224371B1 (ko) 2005-09-29 2013-01-21 다우 코닝 도레이 캄파니 리미티드 열전도성 실리콘 탄성중합체, 열전도성 실리콘 탄성중합체조성물 및 열전도성 매체
WO2007114363A1 (ja) 2006-03-31 2007-10-11 Nikon Corporation 画像処理方法
CN101478973B (zh) 2006-05-23 2013-08-28 陶氏康宁公司 用于递送活性成分的新型硅氧烷成膜剂
JP2008016727A (ja) 2006-07-07 2008-01-24 Tokyo Electron Ltd 伝熱構造体及び基板処理装置
US20100048743A1 (en) * 2007-02-09 2010-02-25 Lawrence Joseph Rapson Method of Recycling Plastic
WO2008103219A1 (en) 2007-02-20 2008-08-28 Dow Corning Coration Filler treating agents based on hydrogen bonding polyorganosiloxanes
JP2008239719A (ja) * 2007-03-26 2008-10-09 Dow Corning Toray Co Ltd シリコーンエラストマー組成物およびシリコーンエラストマー
CN101835830B (zh) * 2007-08-31 2013-02-20 卡伯特公司 热界面材料
EP2188836A2 (en) * 2007-09-11 2010-05-26 Dow Corning Corporation Thermal interface material, electronic device containing the thermal interface material, and methods for their preparation and use
CN101803009B (zh) * 2007-09-11 2012-07-04 陶氏康宁公司 组合物，包括这种组合物的热界面材料,及其制备方法和用途
JP5367656B2 (ja) * 2010-07-29 2013-12-11 日東電工株式会社 フリップチップ型半導体裏面用フィルム及びその用途
WO2012027073A1 (en) 2010-08-23 2012-03-01 Dow Corning Corporation Saccharide siloxanes stable in aqueous environments and methods for the preparation and use of such saccharide siloxanes
WO2013131330A1 (en) * 2012-06-05 2013-09-12 Dow Corning Corporation Soft tacky gel for use in power converters
KR20150023710A (ko) 2012-06-15 2015-03-05 가부시키가이샤 가네카 방열 구조체
TWI639165B (zh) 2013-06-14 2018-10-21 美商道康寧公司 用於電源轉換器之軟黏凝膠
CN103740110A (zh) * 2013-12-23 2014-04-23 华为技术有限公司 一种定向柔性导热材料及其成型工艺和应用
CN104017537A (zh) * 2014-06-26 2014-09-03 轻工业部南京电光源材料科学研究所 一种用于led灯具封装的导热胶及其制备方法
DE102015222657A1 (de) 2015-11-17 2016-05-04 Schaeffler Technologies AG & Co. KG Wärmeleitfähige Elastomermischung mit guten Gleiteigenschaften und Dichtung aus einer derartigen Elastomermischung
WO2017143508A1 (en) * 2016-02-23 2017-08-31 Dow Corning Corporation Curable high hardness silicone composition and composite articles made thereof
KR101872199B1 (ko) * 2016-12-13 2018-06-28 비엔비머티리얼 주식회사 천연흑연, 알루미나 및 질화알루미늄을 포함하는 실리콘 복합조성물 및 이를 사용한 열전도 구리스 제조방법
TWI798326B (zh) * 2018-01-12 2023-04-11 美商陶氏有機矽公司 添加劑有機聚矽氧烷組成物、可固化組成物、及膜
US20220089855A1 (en) 2019-01-15 2022-03-24 Cosmo Oil Lubricants Co., Ltd. Curable Composition and Cured Material
CN114989610A (zh) * 2022-06-01 2022-09-02 深圳市华天启科技有限公司 一种可塑阻燃导热材料及其制备方法
WO2024077435A1 (en) * 2022-10-10 2024-04-18 Dow Silicones Corporation Thermally conductive silicone composition
JP7824869B2 (ja) * 2022-12-13 2026-03-05 信越化学工業株式会社 熱伝導性複合シリコーンゴムシート
CN121128321A (zh) * 2023-05-18 2025-12-12 汉高股份有限及两合公司 用于高弹性导热间隙垫的组合物
WO2025105432A1 (ja) * 2023-11-15 2025-05-22 大阪有機化学工業株式会社 硬化性樹脂組成物、硬化物、及び、ギャップフィラー

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4444944A (en) * 1982-06-14 1984-04-24 Toray Silicone Company, Ltd. Thermally conductive silicone rubber composition
CN1043583A (zh) * 1990-01-24 1990-07-04 阎宝连 导热绝缘硅板及其制法
US5008307A (en) * 1987-04-06 1991-04-16 Shin-Etsu Chemical Co., Ltd. Liquid silicone rubber composition capable of yielding a thermal conductive vulcanized product
CN1432619A (zh) * 2001-12-11 2003-07-30 信越化学工业株式会社 导热性硅氧烷组合物，以及使用该组合物的散热结构
CN1495245A (zh) * 2002-09-02 2004-05-12 ��Խ��ѧ��ҵ��ʽ���� 导热复合片材及其制备方法
CN1497035A (zh) * 2002-10-04 2004-05-19 ��Խ��ѧ��ҵ��ʽ���� 导热硅橡胶复合片材

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS562349A (en) * 1979-06-21 1981-01-12 Toshiba Silicone Co Ltd Molded rubber article for heat dissipation
US4604424A (en) * 1986-01-29 1986-08-05 Dow Corning Corporation Thermally conductive polyorganosiloxane elastomer composition
JP2691823B2 (ja) * 1991-01-24 1997-12-17 信越化学工業株式会社 硬化性シリコーン組成物およびその硬化物
US5365267A (en) * 1992-06-19 1994-11-15 Linvatec Corporation White balance target
US5801332A (en) * 1995-08-31 1998-09-01 Minnesota Mining And Manufacturing Company Elastically recoverable silicone splice cover
JP3597277B2 (ja) * 1995-10-17 2004-12-02 東レ・ダウコーニング・シリコーン株式会社 熱伝導性シリコーンゴムおよびその組成物
JP2001011402A (ja) 1999-04-27 2001-01-16 Tokai Rubber Ind Ltd プラズマディスプレイ
JP4162955B2 (ja) * 2002-09-13 2008-10-08 信越化学工業株式会社 放熱部材用粘着性シリコーン組成物
US7013965B2 (en) * 2003-04-29 2006-03-21 General Electric Company Organic matrices containing nanomaterials to enhance bulk thermal conductivity
US20050049350A1 (en) * 2003-08-25 2005-03-03 Sandeep Tonapi Thin bond-line silicone adhesive composition and method for preparing the same
JP5015436B2 (ja) * 2004-08-30 2012-08-29 東レ・ダウコーニング株式会社 熱伝導性シリコーンエラストマー、熱伝導媒体および熱伝導性シリコーンエラストマー組成物

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4444944A (en) * 1982-06-14 1984-04-24 Toray Silicone Company, Ltd. Thermally conductive silicone rubber composition
US5008307A (en) * 1987-04-06 1991-04-16 Shin-Etsu Chemical Co., Ltd. Liquid silicone rubber composition capable of yielding a thermal conductive vulcanized product
CN1043583A (zh) * 1990-01-24 1990-07-04 阎宝连 导热绝缘硅板及其制法
CN1432619A (zh) * 2001-12-11 2003-07-30 信越化学工业株式会社 导热性硅氧烷组合物，以及使用该组合物的散热结构
CN1495245A (zh) * 2002-09-02 2004-05-12 ��Խ��ѧ��ҵ��ʽ���� 导热复合片材及其制备方法
CN1497035A (zh) * 2002-10-04 2004-05-19 ��Խ��ѧ��ҵ��ʽ���� 导热硅橡胶复合片材

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
JP昭56-2349A 1981.01.12
李胜方.导热硅橡胶的性能与应用.化工新型材料第30卷 第12期.2002,第30卷(第12期),11-13.
李胜方.导热硅橡胶的性能与应用.化工新型材料第30卷 第12期.2002,第30卷(第12期),11-13. *

Also Published As

Publication number Publication date
WO2006025552A1 (en) 2006-03-09
US20090275688A1 (en) 2009-11-05
JP5015436B2 (ja) 2012-08-29
CN101098936A (zh) 2008-01-02
EP1791911B1 (en) 2009-09-30
TW200621892A (en) 2006-07-01
DE602005016948D1 (de) 2009-11-12
TWI397555B (zh) 2013-06-01
KR20070051929A (ko) 2007-05-18
EP1791911B9 (en) 2010-05-19
ATE444337T1 (de) 2009-10-15
KR101261250B1 (ko) 2013-05-07
US7956121B2 (en) 2011-06-07
JP2006096986A (ja) 2006-04-13
EP1791911A1 (en) 2007-06-06

Similar Documents

Publication Publication Date Title
CN101098936B (zh) 导热硅氧烷弹性体、导热硅氧烷弹性体组合物和导热介质
TWI839459B (zh) 具有熱傳導性黏著層的熱傳導性聚矽氧橡膠片及其製造方法
JP3444199B2 (ja) 熱伝導性シリコーンゴム組成物及びその製造方法
TWI787350B (zh) 包含填料之聚矽氧組成物
JP2010511738A (ja) シリコーン接着剤組成物およびそれを調製する方法
JP6797075B2 (ja) 熱伝導性シリコーンゴム複合シート
CN101273106B (zh) 导热有机硅弹性体、导热有机硅弹性体组合物和导热介质
JP5131648B2 (ja) 熱伝導性シリコーン組成物およびそれを用いた熱伝導性シリコーン成形物
JP7750635B2 (ja) 硬化性オルガノポリシロキサン組成物、熱伝導性部材および放熱構造体
JP2006089675A (ja) 熱伝導性シリコーンエラストマーおよび熱伝導性シリコーンエラストマー組成物
JP2001139818A (ja) 熱伝導性シリコーンゴム組成物
CN117693552A (zh) 导热有机硅组合物
JP7478704B2 (ja) 熱伝導性複合シート及び発熱性電子部品の実装方法
JP2004099842A (ja) 放熱部材用粘着性シリコーン組成物
JP2022078110A (ja) 熱伝導性粘着層を有する熱伝導性シリコーンゴムシート
HK1139968A (en) Silicone adhesive composition and method for preparing the same

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term

Granted publication date: 20110112

CX01 Expiry of patent term