KR101261250B1 - 열전도성 실리콘 엘라스토머, 열전도성 실리콘 엘라스토머조성물 및 열전도성 매체 - Google Patents

열전도성 실리콘 엘라스토머, 열전도성 실리콘 엘라스토머조성물 및 열전도성 매체 Download PDF

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Publication number
KR101261250B1
KR101261250B1 KR1020077007295A KR20077007295A KR101261250B1 KR 101261250 B1 KR101261250 B1 KR 101261250B1 KR 1020077007295 A KR1020077007295 A KR 1020077007295A KR 20077007295 A KR20077007295 A KR 20077007295A KR 101261250 B1 KR101261250 B1 KR 101261250B1
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South Korea
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molecule
groups
thermally conductive
silicone elastomer
group
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Korean (ko)
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KR20070051929A (ko
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가즈히로 세키바
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다우 코닝 도레이 캄파니 리미티드
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Assigned to 다우 도레이 캄파니 리미티드 reassignment 다우 도레이 캄파니 리미티드 권리의 전부이전등록 Assignors: 다우 코닝 도레이 캄파니 리미티드
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00—Compositions for adhesives
    • C08G2170/40—Compositions for pressure-sensitive adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2330/00—Thermal insulation material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1020077007295A 2004-08-30 2005-08-29 열전도성 실리콘 엘라스토머, 열전도성 실리콘 엘라스토머조성물 및 열전도성 매체 Expired - Lifetime KR101261250B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2004-00251098 2004-08-30
JP2004251098 2004-08-30
JP2005238279A JP5015436B2 (ja) 2004-08-30 2005-08-19 熱伝導性シリコーンエラストマー、熱伝導媒体および熱伝導性シリコーンエラストマー組成物
JPJP-P-2005-00238279 2005-08-19

Publications (2)

Publication Number Publication Date
KR20070051929A KR20070051929A (ko) 2007-05-18
KR101261250B1 true KR101261250B1 (ko) 2013-05-07

Family

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KR1020077007295A Expired - Lifetime KR101261250B1 (ko) 2004-08-30 2005-08-29 열전도성 실리콘 엘라스토머, 열전도성 실리콘 엘라스토머조성물 및 열전도성 매체

Country Status (9)

Country Link
US (1) US7956121B2 (https=)
EP (1) EP1791911B9 (https=)
JP (1) JP5015436B2 (https=)
KR (1) KR101261250B1 (https=)
CN (1) CN101098936B (https=)
AT (1) ATE444337T1 (https=)
DE (1) DE602005016948D1 (https=)
TW (1) TWI397555B (https=)
WO (1) WO2006025552A1 (https=)

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JP5015436B2 (ja) * 2004-08-30 2012-08-29 東レ・ダウコーニング株式会社 熱伝導性シリコーンエラストマー、熱伝導媒体および熱伝導性シリコーンエラストマー組成物
EP1833918B1 (en) 2004-12-23 2011-09-28 Dow Corning Corporation Crosslinkable saccharide-siloxane compositions, and networks, coatings and articles formed therefrom
JP5122444B2 (ja) 2005-05-23 2013-01-16 ダウ・コーニング・コーポレイション サッカリド−シロキサンコポリマーを含むパーソナルケア組成物
WO2007037019A1 (en) 2005-09-29 2007-04-05 Dow Corning Toray Co., Ltd. Thermoconductive silicone elastomer, thermoconductive silicone elastomer composition and thermoconductive medium
EP2003877B1 (en) 2006-03-31 2015-05-06 Nikon Corporation Image processing method
EP2019678A4 (en) 2006-05-23 2012-05-02 Dow Corning NOVEL SILICON FILM FORMERS FOR THE ADMINISTRATION OF ACTIVE SUBSTANCES
JP2008016727A (ja) 2006-07-07 2008-01-24 Tokyo Electron Ltd 伝熱構造体及び基板処理装置
EP2121818B1 (en) * 2007-02-09 2012-08-29 Dow Corning Corporation Method of recycling plastic
JP5197631B2 (ja) 2007-02-20 2013-05-15 ダウ コーニング コーポレーション 水素結合性ポリオルガノシロキサンベースの充填材処理剤
JP2008239719A (ja) * 2007-03-26 2008-10-09 Dow Corning Toray Co Ltd シリコーンエラストマー組成物およびシリコーンエラストマー
CN101835830B (zh) * 2007-08-31 2013-02-20 卡伯特公司 热界面材料
JP2010539706A (ja) * 2007-09-11 2010-12-16 ダウ コーニング コーポレーション 放熱材料、該放熱材料を含む電子デバイス、ならびにそれらの調製方法および使用方法
CN101803009B (zh) * 2007-09-11 2012-07-04 陶氏康宁公司 组合物，包括这种组合物的热界面材料,及其制备方法和用途
JP5367656B2 (ja) * 2010-07-29 2013-12-11 日東電工株式会社 フリップチップ型半導体裏面用フィルム及びその用途
US8853372B2 (en) 2010-08-23 2014-10-07 Dow Corning Corporation Saccharide siloxanes stable in aqueous environments and methods for the preparation and use of such saccharide siloxanes
WO2013131330A1 (en) * 2012-06-05 2013-09-12 Dow Corning Corporation Soft tacky gel for use in power converters
CN104350814B (zh) * 2012-06-15 2017-10-13 株式会社钟化 散热结构体、便携式信息终端、电子设备及电子设备的修理方法
TWI639165B (zh) 2013-06-14 2018-10-21 美商道康寧公司 用於電源轉換器之軟黏凝膠
CN103740110A (zh) * 2013-12-23 2014-04-23 华为技术有限公司 一种定向柔性导热材料及其成型工艺和应用
CN104017537A (zh) * 2014-06-26 2014-09-03 轻工业部南京电光源材料科学研究所 一种用于led灯具封装的导热胶及其制备方法
DE102015222657A1 (de) 2015-11-17 2016-05-04 Schaeffler Technologies AG & Co. KG Wärmeleitfähige Elastomermischung mit guten Gleiteigenschaften und Dichtung aus einer derartigen Elastomermischung
WO2017143508A1 (en) 2016-02-23 2017-08-31 Dow Corning Corporation Curable high hardness silicone composition and composite articles made thereof
KR101872199B1 (ko) * 2016-12-13 2018-06-28 비엔비머티리얼 주식회사 천연흑연, 알루미나 및 질화알루미늄을 포함하는 실리콘 복합조성물 및 이를 사용한 열전도 구리스 제조방법
TWI798326B (zh) * 2018-01-12 2023-04-11 美商陶氏有機矽公司 添加劑有機聚矽氧烷組成物、可固化組成物、及膜
EP3913664A4 (en) 2019-01-15 2023-02-01 Cosmo Oil Lubricants Co., Ltd. CURABLE COMPOSITION AND CURED MATERIAL
CN114989610A (zh) * 2022-06-01 2022-09-02 深圳市华天启科技有限公司 一种可塑阻燃导热材料及其制备方法
KR20250086678A (ko) * 2022-10-10 2025-06-13 다우 실리콘즈 코포레이션 열 전도성 실리콘 조성물
JP7824869B2 (ja) * 2022-12-13 2026-03-05 信越化学工業株式会社 熱伝導性複合シリコーンゴムシート
EP4714225A1 (en) * 2023-05-18 2026-03-25 Henkel AG & Co. KGaA Composition for high-resilient thermally conductive gap pad
WO2025105432A1 (ja) * 2023-11-15 2025-05-22 大阪有機化学工業株式会社 硬化性樹脂組成物、硬化物、及び、ギャップフィラー

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Also Published As

Publication number Publication date
JP5015436B2 (ja) 2012-08-29
ATE444337T1 (de) 2009-10-15
CN101098936A (zh) 2008-01-02
TW200621892A (en) 2006-07-01
CN101098936B (zh) 2011-01-12
JP2006096986A (ja) 2006-04-13
DE602005016948D1 (de) 2009-11-12
EP1791911A1 (en) 2007-06-06
EP1791911B1 (en) 2009-09-30
EP1791911B9 (en) 2010-05-19
US7956121B2 (en) 2011-06-07
TWI397555B (zh) 2013-06-01
WO2006025552A1 (en) 2006-03-09
US20090275688A1 (en) 2009-11-05
KR20070051929A (ko) 2007-05-18

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