CN101076572A - 导电性银分散体及其用途 - Google Patents

导电性银分散体及其用途 Download PDF

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Publication number
CN101076572A
CN101076572A CNA2005800424807A CN200580042480A CN101076572A CN 101076572 A CN101076572 A CN 101076572A CN A2005800424807 A CNA2005800424807 A CN A2005800424807A CN 200580042480 A CN200580042480 A CN 200580042480A CN 101076572 A CN101076572 A CN 101076572A
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CN
China
Prior art keywords
silver
conductive
dispersion
grains
silver halide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2005800424807A
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English (en)
Chinese (zh)
Inventor
J·温克尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eastman Kodak Co
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Eastman Kodak Co
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Filing date
Publication date
Application filed by Eastman Kodak Co filed Critical Eastman Kodak Co
Publication of CN101076572A publication Critical patent/CN101076572A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D1/00—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/0023—Digital printing methods characterised by the inks used
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H05K3/106—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam by photographic methods

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Nanotechnology (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Paints Or Removers (AREA)
  • Powder Metallurgy (AREA)
CNA2005800424807A 2004-12-11 2005-11-09 导电性银分散体及其用途 Pending CN101076572A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB0427164.9A GB0427164D0 (en) 2004-12-11 2004-12-11 Conductive silver dispersions and uses thereof
GB0427164.9 2004-12-11

Publications (1)

Publication Number Publication Date
CN101076572A true CN101076572A (zh) 2007-11-21

Family

ID=34073556

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2005800424807A Pending CN101076572A (zh) 2004-12-11 2005-11-09 导电性银分散体及其用途

Country Status (8)

Country Link
US (1) US20090246358A1 (https=)
EP (1) EP1833928A1 (https=)
JP (1) JP2008523246A (https=)
KR (1) KR20070085963A (https=)
CN (1) CN101076572A (https=)
GB (1) GB0427164D0 (https=)
TW (1) TW200634106A (https=)
WO (1) WO2006061557A1 (https=)

Cited By (10)

* Cited by examiner, † Cited by third party
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CN102821552A (zh) * 2012-09-12 2012-12-12 高德（无锡）电子有限公司 一种改善pcb打报废工艺的方法
CN103003012A (zh) * 2010-07-21 2013-03-27 泽农公司 烧结期间杂散光的减少
CN103146259A (zh) * 2013-03-20 2013-06-12 中国人民解放军国防科学技术大学 丝网印刷导电油墨组合物及其制备方法
CN103146260A (zh) * 2013-03-20 2013-06-12 中国人民解放军国防科学技术大学 导电油墨组合物、导电膜层及其制备方法和应用
CN105093805A (zh) * 2014-05-20 2015-11-25 柯达公司 卤化银溶液物理显影液和使用方法
CN106660131A (zh) * 2014-06-16 2017-05-10 国立大学法人大阪大学 银颗粒合成方法、银颗粒、导电浆料制造方法和导电浆料
CN107287681A (zh) * 2016-04-13 2017-10-24 施乐公司 银聚酯‑磺化纳米颗粒复合丝及其制备方法
CN107755711A (zh) * 2017-10-20 2018-03-06 昆明理工大学 一种正方微纳米银粉制备方法
CN108107668A (zh) * 2017-12-27 2018-06-01 郑州拓洋生物工程有限公司 显影剂及其制备方法和显影液
TWI764283B (zh) * 2019-10-16 2022-05-11 南韓商匯維仕股份公司 用於艙室空氣過濾器之包含低熔點聚酯纖維之不織布

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JP2001513697A (ja) 1997-02-24 2001-09-04 スーペリア マイクロパウダーズ リミテッド ライアビリティ カンパニー エアロゾル法及び装置、粒子製品、並びに該粒子製品から製造される電子装置
US8383014B2 (en) 2010-06-15 2013-02-26 Cabot Corporation Metal nanoparticle compositions
US7824466B2 (en) 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
TW200640596A (en) 2005-01-14 2006-12-01 Cabot Corp Production of metal nanoparticles
US20060163744A1 (en) * 2005-01-14 2006-07-27 Cabot Corporation Printable electrical conductors
WO2006076609A2 (en) 2005-01-14 2006-07-20 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
WO2008001518A1 (en) 2006-06-30 2008-01-03 Mitsubishi Materials Corporation Composition for forming electrode in solar cell, method of forming the electrode, and solar cell employing electrode obtained by the formation method
JP5309521B2 (ja) 2006-10-11 2013-10-09 三菱マテリアル株式会社 電極形成用組成物及びその製造方法並びに該組成物を用いた電極の形成方法
JP5169389B2 (ja) 2007-04-19 2013-03-27 三菱マテリアル株式会社 導電性反射膜の製造方法
KR100905399B1 (ko) * 2007-09-07 2009-06-30 연세대학교 산학협력단 우수한 전도성과 유리 및 세라믹 기판과의 접착력 향상을위한 금속 나노입자와 나노 글래스 프릿을 포함하는 전도성잉크 조성물
TWI393503B (zh) * 2008-08-08 2013-04-11 Zhen Ding Technology Co Ltd 製作導電線路之方法
US8310228B2 (en) * 2008-11-12 2012-11-13 Aisan Kogyo Kabushiki Kaisha Resolver
DE102008062314A1 (de) * 2008-12-10 2010-07-29 Color-Textil Veredelung Ein Unternehmensbereich Der Peppermint Holding Gmbh Stoffgemisch, elektrisch leitfähiges textiles Flächengebilde und zugehöriges Verfahren
US20110024159A1 (en) * 2009-05-05 2011-02-03 Cambrios Technologies Corporation Reliable and durable conductive films comprising metal nanostructures
WO2010144790A1 (en) * 2009-06-12 2010-12-16 E. I. Du Pont De Nemours And Company Ink jettable silver/silver chloride compositions
US20140266749A1 (en) * 2013-03-15 2014-09-18 Lockheed Martin Corporation Printed light-emitting diode circuit for item validation
EP3069353B1 (en) * 2013-11-15 2019-10-30 3M Innovative Properties Company An electrically conductive article containing shaped particles and methods of making same
US9458305B2 (en) * 2014-11-03 2016-10-04 Xerox Corporation Metal nanoparticle-sulfonated polyester composites and green methods of making the same
KR102674239B1 (ko) * 2015-08-17 2024-06-12 헨켈 아게 운트 코. 카게아아 향상된 전도성을 갖는 잉크 조성물
WO2017149918A1 (ja) * 2016-02-29 2017-09-08 富士フイルム株式会社 インク組成物及び画像形成方法
EP3425012B1 (en) 2016-02-29 2022-08-03 FUJIFILM Corporation Ink composition, ink set, image formation method, and printed matter
JP2018130845A (ja) * 2017-02-13 2018-08-23 富士フイルム株式会社 画像記録方法及び記録物
JPWO2018147469A1 (ja) * 2017-02-13 2019-07-18 富士フイルム株式会社 インク組成物、インクセット、画像記録方法、及び記録物
CN108912829B (zh) * 2018-08-01 2021-04-16 广东和润新材料股份有限公司 绝缘散热油墨及绝缘散热屏蔽罩的制备方法
CN113492607B (zh) * 2020-04-08 2023-06-16 陈学仕 喷墨印刷封装型量子点制造方法、光转换单元及显示面板
US12079377B2 (en) * 2021-03-02 2024-09-03 International Business Machines Corporation X-ray sensitive materials for data protection
DE102022001868A1 (de) 2022-05-29 2023-11-30 Elke Hildegard Münch Biozid beschichtete, retikulierte Schaumstoffe aus Kunststoff, Verfahren zu ihrer Herstellung und ihre Verwendung
CN114709278B (zh) * 2022-06-06 2022-08-23 一道新能源科技(衢州)有限公司 一种激光熔融制备晶硅太阳能电池电极的方法
DE102023106549A1 (de) 2023-03-15 2024-09-19 Elke Münch Verfahren und Vorrichtung zur Prävention der Verkeimung von eingebauten Luftfiltern sowie keimfreie Luftfilter
DE102024102529B3 (de) 2024-01-30 2025-01-09 Elke Münch Vorrichtung und Verfahren für die reversible Adsorption und Desorption des Kohlendioxids in Verbrennungsabgasen

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Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103003012A (zh) * 2010-07-21 2013-03-27 泽农公司 烧结期间杂散光的减少
CN102821552A (zh) * 2012-09-12 2012-12-12 高德（无锡）电子有限公司 一种改善pcb打报废工艺的方法
CN103146259A (zh) * 2013-03-20 2013-06-12 中国人民解放军国防科学技术大学 丝网印刷导电油墨组合物及其制备方法
CN103146260A (zh) * 2013-03-20 2013-06-12 中国人民解放军国防科学技术大学 导电油墨组合物、导电膜层及其制备方法和应用
CN103146260B (zh) * 2013-03-20 2015-04-29 中国人民解放军国防科学技术大学 导电油墨组合物、导电膜层及其制备方法和应用
CN103146259B (zh) * 2013-03-20 2015-07-15 中国人民解放军国防科学技术大学 丝网印刷导电油墨组合物及其制备方法
CN105093805A (zh) * 2014-05-20 2015-11-25 柯达公司 卤化银溶液物理显影液和使用方法
CN106660131A (zh) * 2014-06-16 2017-05-10 国立大学法人大阪大学 银颗粒合成方法、银颗粒、导电浆料制造方法和导电浆料
CN106660131B (zh) * 2014-06-16 2019-03-19 国立大学法人大阪大学 银颗粒合成方法、银颗粒、导电浆料制造方法和导电浆料
CN107287681A (zh) * 2016-04-13 2017-10-24 施乐公司 银聚酯‑磺化纳米颗粒复合丝及其制备方法
CN107287681B (zh) * 2016-04-13 2020-02-28 施乐公司 银聚酯-磺化纳米颗粒复合丝及其制备方法
CN107755711A (zh) * 2017-10-20 2018-03-06 昆明理工大学 一种正方微纳米银粉制备方法
CN107755711B (zh) * 2017-10-20 2019-07-05 昆明理工大学 一种正方微纳米银粉制备方法
CN108107668A (zh) * 2017-12-27 2018-06-01 郑州拓洋生物工程有限公司 显影剂及其制备方法和显影液
TWI764283B (zh) * 2019-10-16 2022-05-11 南韓商匯維仕股份公司 用於艙室空氣過濾器之包含低熔點聚酯纖維之不織布

Also Published As

Publication number Publication date
WO2006061557A1 (en) 2006-06-15
JP2008523246A (ja) 2008-07-03
GB0427164D0 (en) 2005-01-12
EP1833928A1 (en) 2007-09-19
TW200634106A (en) 2006-10-01
KR20070085963A (ko) 2007-08-27
US20090246358A1 (en) 2009-10-01

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Open date: 20071121