KR20070085963A - 전도성 은 분산액 및 이들의 용도 - Google Patents

전도성 은 분산액 및 이들의 용도 Download PDF

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Publication number
KR20070085963A
KR20070085963A KR1020077013021A KR20077013021A KR20070085963A KR 20070085963 A KR20070085963 A KR 20070085963A KR 1020077013021 A KR1020077013021 A KR 1020077013021A KR 20077013021 A KR20077013021 A KR 20077013021A KR 20070085963 A KR20070085963 A KR 20070085963A
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KR
South Korea
Prior art keywords
silver
particles
dispersion
conductive
silver halide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020077013021A
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English (en)
Korean (ko)
Inventor
쥬르젠 윈켈
Original Assignee
이스트맨 코닥 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이스트맨 코닥 캄파니 filed Critical 이스트맨 코닥 캄파니
Publication of KR20070085963A publication Critical patent/KR20070085963A/ko
Withdrawn legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D1/00—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/0023—Digital printing methods characterised by the inks used
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H05K3/106—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam by photographic methods

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Nanotechnology (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Paints Or Removers (AREA)
  • Powder Metallurgy (AREA)
KR1020077013021A 2004-12-11 2005-11-09 전도성 은 분산액 및 이들의 용도 Withdrawn KR20070085963A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB0427164.9A GB0427164D0 (en) 2004-12-11 2004-12-11 Conductive silver dispersions and uses thereof
GB0427164.9 2004-12-11

Publications (1)

Publication Number Publication Date
KR20070085963A true KR20070085963A (ko) 2007-08-27

Family

ID=34073556

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077013021A Withdrawn KR20070085963A (ko) 2004-12-11 2005-11-09 전도성 은 분산액 및 이들의 용도

Country Status (8)

Country Link
US (1) US20090246358A1 (https=)
EP (1) EP1833928A1 (https=)
JP (1) JP2008523246A (https=)
KR (1) KR20070085963A (https=)
CN (1) CN101076572A (https=)
GB (1) GB0427164D0 (https=)
TW (1) TW200634106A (https=)
WO (1) WO2006061557A1 (https=)

Cited By (2)

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WO2009031849A3 (en) * 2007-09-07 2009-07-02 Ind Academic Coop Conductive ink compositions incorporating nano glass frit and nano metal for enhanced adhesion with glass and ceramic substrates used in displays
KR20180041675A (ko) * 2015-08-17 2018-04-24 헨켈 아이피 앤드 홀딩 게엠베하 향상된 전도성을 갖는 잉크 조성물

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JP2001513697A (ja) 1997-02-24 2001-09-04 スーペリア マイクロパウダーズ リミテッド ライアビリティ カンパニー エアロゾル法及び装置、粒子製品、並びに該粒子製品から製造される電子装置
US8383014B2 (en) 2010-06-15 2013-02-26 Cabot Corporation Metal nanoparticle compositions
US7824466B2 (en) 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
TW200640596A (en) 2005-01-14 2006-12-01 Cabot Corp Production of metal nanoparticles
US20060163744A1 (en) * 2005-01-14 2006-07-27 Cabot Corporation Printable electrical conductors
WO2006076609A2 (en) 2005-01-14 2006-07-20 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
WO2008001518A1 (en) 2006-06-30 2008-01-03 Mitsubishi Materials Corporation Composition for forming electrode in solar cell, method of forming the electrode, and solar cell employing electrode obtained by the formation method
JP5309521B2 (ja) 2006-10-11 2013-10-09 三菱マテリアル株式会社 電極形成用組成物及びその製造方法並びに該組成物を用いた電極の形成方法
JP5169389B2 (ja) 2007-04-19 2013-03-27 三菱マテリアル株式会社 導電性反射膜の製造方法
TWI393503B (zh) * 2008-08-08 2013-04-11 Zhen Ding Technology Co Ltd 製作導電線路之方法
US8310228B2 (en) * 2008-11-12 2012-11-13 Aisan Kogyo Kabushiki Kaisha Resolver
DE102008062314A1 (de) * 2008-12-10 2010-07-29 Color-Textil Veredelung Ein Unternehmensbereich Der Peppermint Holding Gmbh Stoffgemisch, elektrisch leitfähiges textiles Flächengebilde und zugehöriges Verfahren
US20110024159A1 (en) * 2009-05-05 2011-02-03 Cambrios Technologies Corporation Reliable and durable conductive films comprising metal nanostructures
WO2010144790A1 (en) * 2009-06-12 2010-12-16 E. I. Du Pont De Nemours And Company Ink jettable silver/silver chloride compositions
US20120017829A1 (en) * 2010-07-21 2012-01-26 Xenon Corporation Reduction of stray light during sinterinig
CN102821552A (zh) * 2012-09-12 2012-12-12 高德（无锡）电子有限公司 一种改善pcb打报废工艺的方法
US20140266749A1 (en) * 2013-03-15 2014-09-18 Lockheed Martin Corporation Printed light-emitting diode circuit for item validation
CN103146260B (zh) * 2013-03-20 2015-04-29 中国人民解放军国防科学技术大学 导电油墨组合物、导电膜层及其制备方法和应用
CN103146259B (zh) * 2013-03-20 2015-07-15 中国人民解放军国防科学技术大学 丝网印刷导电油墨组合物及其制备方法
EP3069353B1 (en) * 2013-11-15 2019-10-30 3M Innovative Properties Company An electrically conductive article containing shaped particles and methods of making same
TW201610609A (zh) * 2014-05-20 2016-03-16 柯達公司 鹵化銀溶液之物理顯像溶液及使用方法
WO2015194536A1 (ja) 2014-06-16 2015-12-23 国立大学法人大阪大学 銀粒子の合成方法、銀粒子、導電性ペーストの製造方法、および導電性ペースト
US9458305B2 (en) * 2014-11-03 2016-10-04 Xerox Corporation Metal nanoparticle-sulfonated polyester composites and green methods of making the same
WO2017149918A1 (ja) * 2016-02-29 2017-09-08 富士フイルム株式会社 インク組成物及び画像形成方法
EP3425012B1 (en) 2016-02-29 2022-08-03 FUJIFILM Corporation Ink composition, ink set, image formation method, and printed matter
US9877485B2 (en) * 2016-04-13 2018-01-30 Xerox Corporation Silver polyester-sulfonated nanoparticle composite filaments and methods of making the same
JP2018130845A (ja) * 2017-02-13 2018-08-23 富士フイルム株式会社 画像記録方法及び記録物
JPWO2018147469A1 (ja) * 2017-02-13 2019-07-18 富士フイルム株式会社 インク組成物、インクセット、画像記録方法、及び記録物
CN107755711B (zh) * 2017-10-20 2019-07-05 昆明理工大学 一种正方微纳米银粉制备方法
CN108107668B (zh) * 2017-12-27 2021-07-20 郑州拓洋生物工程有限公司 显影剂及其制备方法和显影液
CN108912829B (zh) * 2018-08-01 2021-04-16 广东和润新材料股份有限公司 绝缘散热油墨及绝缘散热屏蔽罩的制备方法
KR102354177B1 (ko) * 2019-10-16 2022-01-24 주식회사 휴비스 저융점 폴리에스테르 섬유를 포함하는 캐빈에어필터용 부직포
CN113492607B (zh) * 2020-04-08 2023-06-16 陈学仕 喷墨印刷封装型量子点制造方法、光转换单元及显示面板
US12079377B2 (en) * 2021-03-02 2024-09-03 International Business Machines Corporation X-ray sensitive materials for data protection
DE102022001868A1 (de) 2022-05-29 2023-11-30 Elke Hildegard Münch Biozid beschichtete, retikulierte Schaumstoffe aus Kunststoff, Verfahren zu ihrer Herstellung und ihre Verwendung
CN114709278B (zh) * 2022-06-06 2022-08-23 一道新能源科技(衢州)有限公司 一种激光熔融制备晶硅太阳能电池电极的方法
DE102023106549A1 (de) 2023-03-15 2024-09-19 Elke Münch Verfahren und Vorrichtung zur Prävention der Verkeimung von eingebauten Luftfiltern sowie keimfreie Luftfilter
DE102024102529B3 (de) 2024-01-30 2025-01-09 Elke Münch Vorrichtung und Verfahren für die reversible Adsorption und Desorption des Kohlendioxids in Verbrennungsabgasen

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DE2219531A1 (de) * 1972-04-21 1973-11-08 Heraeus Gmbh W C Verfahren zur herstellung von silberpulver
GB2236116A (en) * 1989-09-20 1991-03-27 Shell Int Research Nodular silver powder and process for preparing silver powder
EP0647682B1 (en) * 1993-10-06 1997-12-03 Dow Corning Toray Silicone Company, Limited Silver-filled electrically conductive organosiloxane compositions
US6379745B1 (en) * 1997-02-20 2002-04-30 Parelec, Inc. Low temperature method and compositions for producing electrical conductors
US6558746B2 (en) * 1998-04-06 2003-05-06 Ferro Gmbh Coating composition for producing electrically conductive coatings
US6322620B1 (en) * 2000-11-16 2001-11-27 National Starch And Chemical Investment Holding Corporation Conductive ink composition
US6517931B1 (en) * 2001-10-15 2003-02-11 Ferro Corporation Silver ink for forming electrodes
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009031849A3 (en) * 2007-09-07 2009-07-02 Ind Academic Coop Conductive ink compositions incorporating nano glass frit and nano metal for enhanced adhesion with glass and ceramic substrates used in displays
KR20180041675A (ko) * 2015-08-17 2018-04-24 헨켈 아이피 앤드 홀딩 게엠베하 향상된 전도성을 갖는 잉크 조성물

Also Published As

Publication number Publication date
WO2006061557A1 (en) 2006-06-15
JP2008523246A (ja) 2008-07-03
GB0427164D0 (en) 2005-01-12
EP1833928A1 (en) 2007-09-19
TW200634106A (en) 2006-10-01
CN101076572A (zh) 2007-11-21
US20090246358A1 (en) 2009-10-01

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20070608

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid