WO2009031849A3 - Conductive ink compositions incorporating nano glass frit and nano metal for enhanced adhesion with glass and ceramic substrates used in displays - Google Patents

Conductive ink compositions incorporating nano glass frit and nano metal for enhanced adhesion with glass and ceramic substrates used in displays Download PDF

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Publication number
WO2009031849A3
WO2009031849A3 PCT/KR2008/005252 KR2008005252W WO2009031849A3 WO 2009031849 A3 WO2009031849 A3 WO 2009031849A3 KR 2008005252 W KR2008005252 W KR 2008005252W WO 2009031849 A3 WO2009031849 A3 WO 2009031849A3
Authority
WO
WIPO (PCT)
Prior art keywords
nano
glass
conductive ink
glass frit
jet printing
Prior art date
Application number
PCT/KR2008/005252
Other languages
French (fr)
Other versions
WO2009031849A4 (en
WO2009031849A2 (en
Inventor
Jooho Moon
Daehwan Jang
Dongjo Kim
Byungyoon Lee
Yoonhyun Kim
Sungsoo Kim
Kyuyong Lee
Original Assignee
Ind Academic Coop
Chang Sung Corp
Jooho Moon
Daehwan Jang
Dongjo Kim
Byungyoon Lee
Yoonhyun Kim
Sungsoo Kim
Kyuyong Lee
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Academic Coop, Chang Sung Corp, Jooho Moon, Daehwan Jang, Dongjo Kim, Byungyoon Lee, Yoonhyun Kim, Sungsoo Kim, Kyuyong Lee filed Critical Ind Academic Coop
Publication of WO2009031849A2 publication Critical patent/WO2009031849A2/en
Publication of WO2009031849A3 publication Critical patent/WO2009031849A3/en
Publication of WO2009031849A4 publication Critical patent/WO2009031849A4/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing

Abstract

The present invention relates to a conductive ink composition for ink jet printing, which can form a conductive pattern by an ink jet printing method using a glass or ceramic substrate such as a flat panel display and a laminated manual component in producing components and elements that require a thermal process at a relatively high temperature of 400-800°C. It relates to a method for synthesizing silver nano sol having a uniform particle size, an excellent dispersion and an excellent sinterability, and to a conductive ink composition to which is added nano glass frit for improving adhesion between a conductive pattern, which is closely relates to a panel having long-term stability and reliability, and a glass substrate, the conductive ink composition being able to form patterns with excellent conductivity. According to the present invention, the conductive ink composition for ink jet printing comprising metal nano particles, a co-solvent and nano glass frit can form a conductive pattern using an ink jet printing method, and also enhance adhesion by fusing the nano glass frit, which is added during drying and heat treatment processes, with the substrate.
PCT/KR2008/005252 2007-09-07 2008-09-05 Conductive ink compositions incorporating nano glass frit and nano metal for enhanced adhesion with glass and ceramic substrates used in displays WO2009031849A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020070091068A KR100905399B1 (en) 2007-09-07 2007-09-07 Conductive ink compositions incorporating nano glass frit and nano metal for enhanced adhesion with glass and ceramic substrates used in displays
KR10-2007-0091068 2007-09-07

Publications (3)

Publication Number Publication Date
WO2009031849A2 WO2009031849A2 (en) 2009-03-12
WO2009031849A3 true WO2009031849A3 (en) 2009-07-02
WO2009031849A4 WO2009031849A4 (en) 2009-09-03

Family

ID=40429554

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2008/005252 WO2009031849A2 (en) 2007-09-07 2008-09-05 Conductive ink compositions incorporating nano glass frit and nano metal for enhanced adhesion with glass and ceramic substrates used in displays

Country Status (2)

Country Link
KR (1) KR100905399B1 (en)
WO (1) WO2009031849A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101386085B1 (en) * 2011-06-14 2014-04-17 주식회사 아모그린텍 Conductive Metal Nano Particle Ink and Manufacturing Method thereof
JP2014523459A (en) * 2011-06-14 2014-09-11 バイエル・テクノロジー・サービシーズ・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツング Silver-containing aqueous ink formulation for producing an electrically conductive structure and ink jet printing method for producing such an electrically conductive structure
KR101350706B1 (en) * 2011-11-24 2014-01-17 한국화학연구원 Method for solar cell metallization using conductive ink with nano sized glass frit by sol―gel process
KR102169003B1 (en) * 2013-06-20 2020-10-22 주식회사 잉크테크 Conductive ink composition, transparent conductive film comprising thereof and method for preparing transparent conductive film
KR101599103B1 (en) * 2013-06-20 2016-03-02 주식회사 엘지화학 Method for manufacturing metal particles with core-shell structure
KR101656452B1 (en) * 2013-09-06 2016-09-09 주식회사 잉크테크 Method for making conductive pattern and conductive pattern
WO2016110724A1 (en) 2015-01-07 2016-07-14 Fenzi Spa Glass frit composition and ceramic inkjet ink comprising the same
KR101900877B1 (en) * 2016-11-17 2018-09-20 (주)삼광기업 Manufacturing method of pad printing ink for ceramic coating layer and pad printing ink using the same
KR101960588B1 (en) * 2017-02-09 2019-03-21 창성나노텍 주식회사 Composition of thin film using Conductive Metal Ink and Method for preparing the same
KR102205001B1 (en) * 2019-01-28 2021-01-18 순천대학교 산학협력단 Method for providing temperature sensor tag using r2r gravure printing scheme

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR970001404B1 (en) * 1990-04-12 1997-02-06 마쯔시다덴기산교 가부시기가이샤 Conductive ink
JP2007198933A (en) * 2006-01-27 2007-08-09 Keio Gijuku Method of preparing substrate for surface-enhanced raman spectroscopy, and substrate for surface-enhanced raman spectroscopy
KR20070085963A (en) * 2004-12-11 2007-08-27 이스트맨 코닥 캄파니 Conductive silver dispersions and uses thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3211641B2 (en) 1995-09-22 2001-09-25 株式会社村田製作所 Conductive composition
KR100554207B1 (en) * 2003-10-28 2006-02-22 대주전자재료 주식회사 Production Method of Nano-size Silver Particle
JP4795674B2 (en) * 2004-11-17 2011-10-19 住友ゴム工業株式会社 Ink for surface printing of crystallized glass

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR970001404B1 (en) * 1990-04-12 1997-02-06 마쯔시다덴기산교 가부시기가이샤 Conductive ink
KR20070085963A (en) * 2004-12-11 2007-08-27 이스트맨 코닥 캄파니 Conductive silver dispersions and uses thereof
JP2007198933A (en) * 2006-01-27 2007-08-09 Keio Gijuku Method of preparing substrate for surface-enhanced raman spectroscopy, and substrate for surface-enhanced raman spectroscopy

Also Published As

Publication number Publication date
WO2009031849A4 (en) 2009-09-03
KR20090025894A (en) 2009-03-11
WO2009031849A2 (en) 2009-03-12
KR100905399B1 (en) 2009-06-30

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