CN101040290A - 半导体组件的晶粒跟踪装置及其测试设备 - Google Patents
半导体组件的晶粒跟踪装置及其测试设备 Download PDFInfo
- Publication number
- CN101040290A CN101040290A CNA2005800352387A CN200580035238A CN101040290A CN 101040290 A CN101040290 A CN 101040290A CN A2005800352387 A CNA2005800352387 A CN A2005800352387A CN 200580035238 A CN200580035238 A CN 200580035238A CN 101040290 A CN101040290 A CN 101040290A
- Authority
- CN
- China
- Prior art keywords
- die
- string
- strings
- source object
- pointer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q10/00—Administration; Management
- G06Q10/06—Resources, workflows, human or project management; Enterprise or organisation planning; Enterprise or organisation modelling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q10/00—Administration; Management
- G06Q10/08—Logistics, e.g. warehousing, loading or distribution; Inventory or stock management
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Business, Economics & Management (AREA)
- Economics (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Strategic Management (AREA)
- Human Resources & Organizations (AREA)
- Entrepreneurship & Innovation (AREA)
- General Business, Economics & Management (AREA)
- Quality & Reliability (AREA)
- Theoretical Computer Science (AREA)
- Tourism & Hospitality (AREA)
- Development Economics (AREA)
- Marketing (AREA)
- Operations Research (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Educational Administration (AREA)
- Game Theory and Decision Science (AREA)
- General Factory Administration (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US61880504P | 2004-10-15 | 2004-10-15 | |
| US60/618,805 | 2004-10-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101040290A true CN101040290A (zh) | 2007-09-19 |
Family
ID=35754092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2005800352387A Pending CN101040290A (zh) | 2004-10-15 | 2005-10-12 | 半导体组件的晶粒跟踪装置及其测试设备 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US7343214B2 (enExample) |
| EP (1) | EP1810326A1 (enExample) |
| JP (1) | JP2008517465A (enExample) |
| KR (1) | KR20070085369A (enExample) |
| CN (1) | CN101040290A (enExample) |
| TW (1) | TW200629026A (enExample) |
| WO (1) | WO2006044399A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB0800227D0 (en) * | 2008-01-07 | 2008-02-13 | Metryx Ltd | Method of controlling semiconductor device fabrication |
| TWI442401B (zh) * | 2009-12-30 | 2014-06-21 | Macronix Int Co Ltd | 共享輸入封裝之三維晶片選取 |
| CN102640253B (zh) | 2010-10-04 | 2014-06-18 | 晟碟半导体(上海)有限公司 | 分立组件后向可追溯性和半导体装置前向可追溯性 |
| US9559113B2 (en) | 2014-05-01 | 2017-01-31 | Macronix International Co., Ltd. | SSL/GSL gate oxide in 3D vertical channel NAND |
| KR20160018227A (ko) * | 2014-08-08 | 2016-02-17 | 에스케이하이닉스 주식회사 | 웨이퍼 처리 시스템 및 이를 이용한 웨이퍼 처리 방법 |
| US10419410B2 (en) * | 2016-12-15 | 2019-09-17 | Seagate Technology Llc | Automatic generation of unique identifiers for distributed directory management users |
| KR102653937B1 (ko) | 2018-07-17 | 2024-04-02 | 삼성전자주식회사 | 반도체 장치의 테스트 방법및 반도체 장치의 테스트 시스템 |
| US11063000B2 (en) * | 2019-01-29 | 2021-07-13 | Infineon Technologies Ag | Semiconductor package authentication feature |
| US11450616B2 (en) | 2020-07-29 | 2022-09-20 | Nxp Usa, Inc. | Using a backside mask layer for forming a unique die mark identifier pattern |
Family Cites Families (83)
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| US103628A (en) * | 1870-05-31 | Lemuel w | ||
| US21265A (en) * | 1858-08-24 | Improvement in rotary harrows | ||
| US225385A (en) * | 1880-03-09 | Service-pipe box | ||
| US4767A (en) * | 1846-09-19 | Pike-engine | ||
| US132060A (en) * | 1872-10-08 | Improvement in windmills | ||
| US6404A (en) * | 1849-05-01 | shaw and ezra gould | ||
| US744A (en) * | 1838-05-17 | Mode of cutting off steam in steam-engines | ||
| US158795A (en) * | 1875-01-19 | Improvement in clover-harvesters | ||
| US95172A (en) * | 1869-09-21 | Improved shoemakers tool | ||
| US5090A (en) * | 1847-05-01 | Improvement in diffusers for water-wheels | ||
| US26949A (en) * | 1860-01-24 | William lewis | ||
| US42780A (en) * | 1864-05-17 | Improvement in wood-splitting machines | ||
| US17708A (en) * | 1857-06-30 | Coloring yarn ijst the bobbin | ||
| US251472A (en) * | 1881-12-27 | sohmetzer | ||
| US106931A (en) * | 1870-08-30 | Improvement in machine for rounding fellies for wheels | ||
| US110270A (en) * | 1870-12-20 | Improvement in machines for making cigars | ||
| US187737A (en) * | 1877-02-27 | Improvement in mowing-machines | ||
| US183884A (en) * | 1876-10-31 | Improvement in gas-carbureters | ||
| US81756A (en) * | 1868-09-01 | Improved traveling-trunk | ||
| US62609A (en) * | 1867-03-05 | Improved life-pbeservdfg beeth | ||
| US38779A (en) * | 1863-06-02 | Improvement in thrashing-machines | ||
| US34785A (en) * | 1862-03-25 | Improvement in heaters | ||
| US76897A (en) * | 1868-04-21 | Improved composition foe blacking leatheb | ||
| US87113A (en) * | 1869-02-23 | Improvement in reel and swift | ||
| US224540A (en) * | 1880-02-17 | Caleb h | ||
| US176872A (en) * | 1876-05-02 | Improvement in gang-planks | ||
| US124437A (en) * | 1872-03-12 | Improvement in type writing-machines | ||
| US36677A (en) * | 1862-10-14 | Improvement in hoop-skirts | ||
| US157762A (en) * | 1874-12-15 | Improvement in bird-cages | ||
| US203591A (en) * | 1878-05-14 | Improvement in tools for trimming and finishing the edges of dash-boards | ||
| US256463A (en) * | 1882-04-18 | Journal-bearing | ||
| US141605A (en) * | 1873-08-05 | Improvement in packages for fruit | ||
| US5129974A (en) * | 1990-08-23 | 1992-07-14 | Colorcode Unlimited Corporation | Microlabelling system and method of making thin labels |
| JPH07123101B2 (ja) * | 1990-09-14 | 1995-12-25 | 株式会社東芝 | 半導体装置 |
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| US5838361A (en) | 1996-01-11 | 1998-11-17 | Micron Technology, Inc. | Laser marking techniques |
| DE19640425A1 (de) | 1996-09-30 | 1998-04-02 | Siemens Ag | Verfahren zur Waferidentifizierung in der Chipfertigung und Vorrichtung zur Durchführung des Verfahrens |
| US6259960B1 (en) * | 1996-11-01 | 2001-07-10 | Joel Ltd. | Part-inspecting system |
| US6100486A (en) | 1998-08-13 | 2000-08-08 | Micron Technology, Inc. | Method for sorting integrated circuit devices |
| US6065113A (en) * | 1997-03-07 | 2000-05-16 | Texas Instruments Incorporated | Circuits, systems, and methods for uniquely identifying a microprocessor at the instruction set level employing one-time programmable register |
| US5856923A (en) | 1997-03-24 | 1999-01-05 | Micron Technology, Inc. | Method for continuous, non lot-based integrated circuit manufacturing |
| JPH1126333A (ja) * | 1997-06-27 | 1999-01-29 | Oki Electric Ind Co Ltd | 半導体装置及びその情報管理システム |
| US6446017B1 (en) * | 1997-08-21 | 2002-09-03 | Micron Technology, Inc. | Method and system for tracking manufacturing data for integrated circuit parts |
| JP3394895B2 (ja) | 1997-09-08 | 2003-04-07 | 沖電気工業株式会社 | 半導体記憶装置およびその製造方法 |
| US6128588A (en) * | 1997-10-01 | 2000-10-03 | Sony Corporation | Integrated wafer fab time standard (machine tact) database |
| US6216055B1 (en) * | 1997-12-16 | 2001-04-10 | Texas Instruments Incorporated | Partial semiconductor wafer processing |
| KR19990065486A (ko) * | 1998-01-14 | 1999-08-05 | 윤종용 | 반도체 제조설비 관리시스템의 공정조건 관리방법 |
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| JP4951811B2 (ja) | 1999-03-24 | 2012-06-13 | 富士通セミコンダクター株式会社 | 半導体装置の製造方法 |
| US6337122B1 (en) | 2000-01-11 | 2002-01-08 | Micron Technology, Inc. | Stereolithographically marked semiconductors devices and methods |
| JP3555859B2 (ja) | 2000-03-27 | 2004-08-18 | 広島日本電気株式会社 | 半導体生産システム及び半導体装置の生産方法 |
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| JP2002190509A (ja) | 2000-12-22 | 2002-07-05 | Mitsubishi Electric Corp | 検査解析方法及び半導体装置 |
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-
2005
- 2005-10-12 WO PCT/US2005/036548 patent/WO2006044399A1/en not_active Ceased
- 2005-10-12 CN CNA2005800352387A patent/CN101040290A/zh active Pending
- 2005-10-12 EP EP05804118A patent/EP1810326A1/en not_active Withdrawn
- 2005-10-12 KR KR1020077011038A patent/KR20070085369A/ko not_active Withdrawn
- 2005-10-12 US US11/247,196 patent/US7343214B2/en not_active Expired - Fee Related
- 2005-10-12 JP JP2007536813A patent/JP2008517465A/ja not_active Withdrawn
- 2005-10-14 TW TW094136036A patent/TW200629026A/zh unknown
-
2007
- 2007-10-31 US US11/982,163 patent/US20080071413A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| TW200629026A (en) | 2006-08-16 |
| US20080071413A1 (en) | 2008-03-20 |
| US20060085089A1 (en) | 2006-04-20 |
| US7343214B2 (en) | 2008-03-11 |
| WO2006044399A1 (en) | 2006-04-27 |
| KR20070085369A (ko) | 2007-08-27 |
| EP1810326A1 (en) | 2007-07-25 |
| JP2008517465A (ja) | 2008-05-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20070919 |