JP2008517465A - 半導体組立てと試験設備用のダイ・レベル追跡遂行機構 - Google Patents

半導体組立てと試験設備用のダイ・レベル追跡遂行機構 Download PDF

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JP2008517465A
JP2008517465A JP2007536813A JP2007536813A JP2008517465A JP 2008517465 A JP2008517465 A JP 2008517465A JP 2007536813 A JP2007536813 A JP 2007536813A JP 2007536813 A JP2007536813 A JP 2007536813A JP 2008517465 A JP2008517465 A JP 2008517465A
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die
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source object
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JP2008517465A5 (enExample
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コー，ホーン・ローン
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Applied Materials Inc
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Applied Materials Inc
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q10/00—Administration; Management
    • G06Q10/06—Resources, workflows, human or project management; Enterprise or organisation planning; Enterprise or organisation modelling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q10/00—Administration; Management
    • G06Q10/08—Logistics, e.g. warehousing, loading or distribution; Inventory or stock management
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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  • Engineering & Computer Science (AREA)
  • Business, Economics & Management (AREA)
  • Economics (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Strategic Management (AREA)
  • Human Resources & Organizations (AREA)
  • Entrepreneurship & Innovation (AREA)
  • General Business, Economics & Management (AREA)
  • Quality & Reliability (AREA)
  • Theoretical Computer Science (AREA)
  • Tourism & Hospitality (AREA)
  • Development Economics (AREA)
  • Marketing (AREA)
  • Operations Research (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Educational Administration (AREA)
  • Game Theory and Decision Science (AREA)
  • General Factory Administration (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2007536813A 2004-10-15 2005-10-12 半導体組立てと試験設備用のダイ・レベル追跡遂行機構 Withdrawn JP2008517465A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US61880504P 2004-10-15 2004-10-15
PCT/US2005/036548 WO2006044399A1 (en) 2004-10-15 2005-10-12 Die-level traceability mechanism for semiconductor assembly and test facility

Publications (2)

Publication Number Publication Date
JP2008517465A true JP2008517465A (ja) 2008-05-22
JP2008517465A5 JP2008517465A5 (enExample) 2008-11-27

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Family Applications (1)

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JP2007536813A Withdrawn JP2008517465A (ja) 2004-10-15 2005-10-12 半導体組立てと試験設備用のダイ・レベル追跡遂行機構

Country Status (7)

Country Link
US (2) US7343214B2 (enExample)
EP (1) EP1810326A1 (enExample)
JP (1) JP2008517465A (enExample)
KR (1) KR20070085369A (enExample)
CN (1) CN101040290A (enExample)
TW (1) TW200629026A (enExample)
WO (1) WO2006044399A1 (enExample)

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US9559113B2 (en) 2014-05-01 2017-01-31 Macronix International Co., Ltd. SSL/GSL gate oxide in 3D vertical channel NAND
KR20160018227A (ko) * 2014-08-08 2016-02-17 에스케이하이닉스 주식회사 웨이퍼 처리 시스템 및 이를 이용한 웨이퍼 처리 방법
US10419410B2 (en) * 2016-12-15 2019-09-17 Seagate Technology Llc Automatic generation of unique identifiers for distributed directory management users
KR102653937B1 (ko) 2018-07-17 2024-04-02 삼성전자주식회사 반도체 장치의 테스트 방법및 반도체 장치의 테스트 시스템
US11063000B2 (en) * 2019-01-29 2021-07-13 Infineon Technologies Ag Semiconductor package authentication feature
US11450616B2 (en) 2020-07-29 2022-09-20 Nxp Usa, Inc. Using a backside mask layer for forming a unique die mark identifier pattern

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Also Published As

Publication number Publication date
TW200629026A (en) 2006-08-16
US20080071413A1 (en) 2008-03-20
US20060085089A1 (en) 2006-04-20
CN101040290A (zh) 2007-09-19
US7343214B2 (en) 2008-03-11
WO2006044399A1 (en) 2006-04-27
KR20070085369A (ko) 2007-08-27
EP1810326A1 (en) 2007-07-25

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