CN101035406B - 具有多层结构之埋入式电容核 - Google Patents

具有多层结构之埋入式电容核 Download PDF

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Publication number
CN101035406B
CN101035406B CN2006101272704A CN200610127270A CN101035406B CN 101035406 B CN101035406 B CN 101035406B CN 2006101272704 A CN2006101272704 A CN 2006101272704A CN 200610127270 A CN200610127270 A CN 200610127270A CN 101035406 B CN101035406 B CN 101035406B
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CN
China
Prior art keywords
conductive pattern
conductive
dielectric film
embedded
electrodes
Prior art date
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CN2006101272704A
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English (en)
Chinese (zh)
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CN101035406A (zh
Inventor
吴仕先
李明林
赖信助
张致豪
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Industrial Technology Research Institute ITRI
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Industrial Technology Research Institute ITRI
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Publication of CN101035406A publication Critical patent/CN101035406A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN2006101272704A 2005-09-19 2006-09-19 具有多层结构之埋入式电容核 Active CN101035406B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US71838205P 2005-09-19 2005-09-19
US60/718,382 2005-09-19
US11/470,435 US7893359B2 (en) 2005-09-19 2006-09-06 Embedded capacitor core having a multiple-layer structure
US11/470,435 2006-09-06

Publications (2)

Publication Number Publication Date
CN101035406A CN101035406A (zh) 2007-09-12
CN101035406B true CN101035406B (zh) 2011-04-13

Family

ID=37776010

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2006101272704A Active CN101035406B (zh) 2005-09-19 2006-09-19 具有多层结构之埋入式电容核

Country Status (7)

Country Link
US (1) US7893359B2 (enExample)
JP (1) JP5111815B2 (enExample)
KR (1) KR100907325B1 (enExample)
CN (1) CN101035406B (enExample)
DE (1) DE102006042005A1 (enExample)
FR (1) FR2891085A1 (enExample)
TW (1) TWI365014B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080248596A1 (en) * 2007-04-04 2008-10-09 Endicott Interconnect Technologies, Inc. Method of making a circuitized substrate having at least one capacitor therein
US7804678B2 (en) * 2007-04-25 2010-09-28 Industrial Technology Research Institute Capacitor devices
US8083954B2 (en) * 2008-06-03 2011-12-27 Kinsus Interconnect Technology Corp. Method for fabricating component-embedded printed circuit board
US20090296310A1 (en) * 2008-06-03 2009-12-03 Azuma Chikara Chip capacitor precursors, packaged semiconductors, and assembly method for converting the precursors to capacitors
US8957663B2 (en) * 2009-12-01 2015-02-17 Nipro Corporation Cellular potential measurement container and production method therefor
CN103187312A (zh) * 2011-12-28 2013-07-03 中国科学院上海微系统与信息技术研究所 圆片级封装结构中的重布线层的制备方法及形成的结构
WO2017154167A1 (ja) * 2016-03-10 2017-09-14 三井金属鉱業株式会社 多層積層板及びこれを用いた多層プリント配線板の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5972053A (en) * 1996-03-25 1999-10-26 International Business Machines Corporation Capacitor formed within printed circuit board

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61252697A (ja) * 1985-05-02 1986-11-10 株式会社日立製作所 多層プリント板内層の処理方法
JP2969670B2 (ja) * 1989-09-01 1999-11-02 松下電器産業株式会社 積層セラミックコンデンサの製造方法
JP3019541B2 (ja) 1990-11-22 2000-03-13 株式会社村田製作所 コンデンサ内蔵型配線基板およびその製造方法
JPH0555752A (ja) 1991-08-23 1993-03-05 Matsushita Electric Ind Co Ltd 多層プリント配線板の製造方法
JP3064544B2 (ja) 1991-08-30 2000-07-12 株式会社村田製作所 積層電子部品の製造方法
JPH07263271A (ja) 1994-03-17 1995-10-13 Marcon Electron Co Ltd 積層セラミック部品の製造方法
JPH08102427A (ja) 1994-09-30 1996-04-16 Matsushita Electric Ind Co Ltd フィルムコンデンサ
JP3199637B2 (ja) 1996-07-11 2001-08-20 京セラ株式会社 多層配線基板の製造方法
JP3241605B2 (ja) 1996-09-06 2001-12-25 松下電器産業株式会社 配線基板の製造方法並びに配線基板
JP2000244129A (ja) 1998-12-25 2000-09-08 Ngk Spark Plug Co Ltd 配線基板、コア基板及びその製造方法
DE19927026A1 (de) 1999-06-03 2000-12-14 Manfred A Gregor Verfahren zur Trennung und Anordnung zur Wägung von träger Masse und schwerer Masse physikalischer Körper und chemischer Stoffe
US6871396B2 (en) 2000-02-09 2005-03-29 Matsushita Electric Industrial Co., Ltd. Transfer material for wiring substrate
US6606793B1 (en) 2000-07-31 2003-08-19 Motorola, Inc. Printed circuit board comprising embedded capacitor and method of same
GB2370080B (en) * 2000-12-16 2004-05-19 Federal Mogul Brake Syst Ltd Method and apparatus for constructing disc brakes
KR100455891B1 (ko) 2002-12-24 2004-11-06 삼성전기주식회사 커패시터 내장형 인쇄회로기판 및 그 제조 방법
JP2004281169A (ja) 2003-03-14 2004-10-07 Rikogaku Shinkokai ポリマーコンポジット高誘電率材料、多層配線板及びモジュール基板
JP4415554B2 (ja) 2003-03-26 2010-02-17 株式会社村田製作所 積層セラミック電子部品の製造方法
JP3927562B2 (ja) 2003-06-27 2007-06-13 Ｔｄｋ株式会社 コンデンサを内蔵した基板の製造方法
JP4365166B2 (ja) 2003-08-26 2009-11-18 新光電気工業株式会社 キャパシタ、多層配線基板及び半導体装置
CN1317923C (zh) 2003-09-29 2007-05-23 财团法人工业技术研究院 一种具内藏电容的基板结构
JP4287757B2 (ja) * 2004-02-04 2009-07-01 パナソニック株式会社 回路部品内蔵モジュール及びその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5972053A (en) * 1996-03-25 1999-10-26 International Business Machines Corporation Capacitor formed within printed circuit board

Also Published As

Publication number Publication date
JP2007088461A (ja) 2007-04-05
TWI365014B (en) 2012-05-21
FR2891085A1 (fr) 2007-03-23
US20070062725A1 (en) 2007-03-22
US7893359B2 (en) 2011-02-22
TW200803645A (en) 2008-01-01
JP5111815B2 (ja) 2013-01-09
KR20070032615A (ko) 2007-03-22
DE102006042005A1 (de) 2007-03-22
KR100907325B1 (ko) 2009-07-13
CN101035406A (zh) 2007-09-12

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