CN101015037B - 处理衬底表面的方法 - Google Patents
处理衬底表面的方法 Download PDFInfo
- Publication number
- CN101015037B CN101015037B CN2004800430875A CN200480043087A CN101015037B CN 101015037 B CN101015037 B CN 101015037B CN 2004800430875 A CN2004800430875 A CN 2004800430875A CN 200480043087 A CN200480043087 A CN 200480043087A CN 101015037 B CN101015037 B CN 101015037B
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- liquid
- silicon chip
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Links
- 238000000034 method Methods 0.000 title claims abstract description 41
- 238000012545 processing Methods 0.000 title claims description 16
- 239000000758 substrate Substances 0.000 title abstract description 63
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 39
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 39
- 239000010703 silicon Substances 0.000 claims abstract description 39
- 239000007788 liquid Substances 0.000 claims description 51
- 230000005540 biological transmission Effects 0.000 claims description 39
- 238000005530 etching Methods 0.000 claims description 22
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- 238000009736 wetting Methods 0.000 description 28
- 239000000463 material Substances 0.000 description 12
- 229910052698 phosphorus Inorganic materials 0.000 description 8
- 239000011574 phosphorus Substances 0.000 description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 7
- 230000008569 process Effects 0.000 description 7
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- 230000008859 change Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Inorganic materials [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 5
- 230000008878 coupling Effects 0.000 description 4
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- 229920000049 Carbon (fiber) Polymers 0.000 description 2
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- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02019—Chemical etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3063—Electrolytic etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical & Material Sciences (AREA)
- Weting (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Electrodes Of Semiconductors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
Claims (12)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/DE2004/000597 WO2005093788A1 (de) | 2004-03-22 | 2004-03-22 | Verfahren zur behandlung von substratoberflächen |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101015037A CN101015037A (zh) | 2007-08-08 |
CN101015037B true CN101015037B (zh) | 2010-04-21 |
Family
ID=35056453
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2004800430875A Expired - Fee Related CN101015037B (zh) | 2004-03-22 | 2004-03-22 | 处理衬底表面的方法 |
Country Status (9)
Country | Link |
---|---|
US (1) | US7943526B2 (zh) |
EP (1) | EP1733418B2 (zh) |
JP (1) | JP4780800B2 (zh) |
KR (1) | KR101046287B1 (zh) |
CN (1) | CN101015037B (zh) |
AT (1) | ATE480868T1 (zh) |
DE (2) | DE112004002879A5 (zh) |
ES (1) | ES2352674T3 (zh) |
WO (1) | WO2005093788A1 (zh) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005062528A1 (de) * | 2005-12-16 | 2007-06-21 | Gebr. Schmid Gmbh & Co. | Vorrichtung und Verfahren zur Oberflächenbehandlung von Substraten |
DE102006033354B4 (de) * | 2006-07-19 | 2012-01-12 | Höllmüller Maschinenbau GmbH | Vorrichtung zum Behandeln von flachen, zerbrechlichen Substraten |
DE102006049488A1 (de) | 2006-10-17 | 2008-04-30 | Höllmüller Maschinenbau GmbH | Vorrichtung zum Behandeln von flachen, zerbrechlichen Substraten |
DE102007004060B4 (de) * | 2007-01-22 | 2013-03-21 | Gp Solar Gmbh | Verwendung einer Ätzlösung aufweisend Wasser, Salpetersäure und Schwefelsäure und Ätzverfahren |
KR20100106321A (ko) * | 2007-10-27 | 2010-10-01 | 하이퍼플로 엘엘씨 | 사이클 핵형성 공정 |
DE102007054093B3 (de) * | 2007-11-13 | 2009-07-23 | Rena Sondermaschinen Gmbh | Vorrichtung und Verfahren zum Transport von flachem Gut in Durchlaufanlagen |
DE102008026199B3 (de) * | 2008-05-30 | 2009-10-08 | Rena Gmbh | Vorrichtung und Verfahren zur elektrischen Kontaktierung von ebenem Gut in Durchlaufanlagen |
US20100055398A1 (en) * | 2008-08-29 | 2010-03-04 | Evergreen Solar, Inc. | Single-Sided Textured Sheet Wafer |
DE102008037404A1 (de) * | 2008-09-30 | 2010-04-01 | Schott Solar Ag | Verfahren zur chemischen Behandlung eines Substrats |
EP2481080B1 (de) * | 2009-09-22 | 2018-10-24 | RENA Technologies GmbH | Verfahren und vorrichtung zum rückätzen einer halbleiterschicht |
DE102009050845A1 (de) * | 2009-10-19 | 2011-04-21 | Gebr. Schmid Gmbh & Co. | Verfahren und Vorrichtung zur Behandlung einer Substratoberfläche eines Substrats |
WO2011072706A1 (de) | 2009-12-18 | 2011-06-23 | Rena Gmbh | Verfahren zum abtragen von substratschichten |
DE102009059704A1 (de) | 2009-12-18 | 2011-06-22 | RENA GmbH, 78148 | Vorrichtung zum Transportieren von flachen Gegenständen |
WO2012020274A1 (en) | 2010-08-10 | 2012-02-16 | Rena Gmbh | Process and apparatus for texturizing a flat semiconductor substrate |
TW201218407A (en) | 2010-10-22 | 2012-05-01 | Wakom Semiconductor Corp | Method for fabricating a silicon wafer solar cell |
CN102185011A (zh) * | 2010-12-02 | 2011-09-14 | 江阴浚鑫科技有限公司 | 太阳能电池片的制绒方法 |
CN103620800A (zh) | 2011-04-19 | 2014-03-05 | 弗劳恩霍弗实用研究促进协会 | 用于制造太阳能电池的方法 |
CN102891078A (zh) | 2011-07-18 | 2013-01-23 | 商先创光伏股份有限公司 | 用于衬底圆片的单面湿处理的装置和方法 |
DE102011109568A1 (de) | 2011-08-05 | 2013-02-07 | Rena Gmbh | Abluftsystem und Verfahren dazu |
DE102011111175B4 (de) * | 2011-08-25 | 2014-01-09 | Rena Gmbh | Verfahren und Vorrichtung zur Flüssigkeits-Niveauregelung bei Durchlaufanlagen |
DE102011118441B8 (de) | 2011-11-12 | 2018-10-04 | RENA Technologies GmbH | Anlage und Verfahren zur Behandlung von flachen Substraten |
DE102012210618A1 (de) * | 2012-01-26 | 2013-08-01 | Singulus Stangl Solar Gmbh | Vorrichtung und Verfahren zum Behandeln von plattenförmigem Prozessgut |
JPWO2013114589A1 (ja) * | 2012-02-01 | 2015-05-11 | 三菱電機株式会社 | 光起電力装置の製造方法および光起電力装置の製造装置 |
DE112012005803T5 (de) | 2012-02-01 | 2014-10-16 | Mitsubishi Electric Corporation | Herstellungsverfahren für Photovoltaikvorrichtung und Herstellungsvorrichtung für Photovoltaikvorrichtung |
NL2008970C2 (en) | 2012-06-08 | 2013-12-10 | Tempress Ip B V | Method of manufacturing a solar cell and solar cell thus obtained. |
DE102012209902A1 (de) | 2012-06-13 | 2013-12-19 | Singulus Stangl Solar Gmbh | Verfahren und Vorrichtung zum Behandeln von Halbleiterstäben mit einer Flüssigkeit oder einem Gas |
DE102012107372B4 (de) | 2012-08-10 | 2017-03-09 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Alkalischer Ätzprozess und Vorrichtung zur Durchführung des Verfahrens |
DE202012103661U1 (de) | 2012-09-24 | 2012-10-26 | Rena Gmbh | Vorrichtung zur nasschemischen Behandlung und zum Schutz flacher Substrate |
CN104037257B (zh) * | 2013-03-08 | 2016-12-28 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 太阳能电池及其制造方法、单面抛光设备 |
DE102013218693A1 (de) | 2013-09-18 | 2015-03-19 | lP RENA GmbH | Vorrichtung und Verfahren zur asymmetrischen alkalischen Textur von Oberflächen |
DE102014222737B4 (de) | 2014-05-16 | 2021-06-10 | Singulus Stangl Solar Gmbh | Vorrichtung zum Behandeln der Unterseite und der Kanten eines Guts mit einer Flüssigkeit und Verfahren zum Herstellen eines auf einer Unterseite mit einer Flüssigkeit behandelten Guts |
DE102014117276A1 (de) * | 2014-11-25 | 2016-05-25 | Rena Gmbh | Verfahren und Vorrichtung zur unterseitigen Behandlung eines Substrats |
DE102016210883A1 (de) | 2016-06-17 | 2017-12-21 | Singulus Technologies Ag | Vorrichtung und Verfahren zur Behandlung von Substraten unter Verwendung einer Auflagerolle mit porösem Material |
CN106216274A (zh) * | 2016-07-27 | 2016-12-14 | 陕西彩虹电子玻璃有限公司 | 一种玻璃基板边部刷洗装置及其控制方法 |
DE202017102678U1 (de) | 2016-12-08 | 2017-05-26 | RENA Technologies GmbH | Transportrolle, Transportvorrichtung sowie Substratbehandlungsanlage |
DE102017110297A1 (de) | 2016-12-30 | 2018-07-05 | RENA Technologies GmbH | Verfahren und Vorrichtung zur Behandlung einer Objektoberfläche mittels einer Behandlungslösung |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5660642A (en) * | 1995-05-26 | 1997-08-26 | The Regents Of The University Of California | Moving zone Marangoni drying of wet objects using naturally evaporated solvent vapor |
EP1073095A2 (en) * | 1999-07-29 | 2001-01-31 | Kaneka Corporation | Method for cleaning photovoltaic module and cleaning apparatus |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US496899A (en) * | 1893-05-09 | dupont | ||
US1073095A (en) * | 1909-04-15 | 1913-09-16 | Stuart W Cramer | Air-conditioning apparatus. |
US1184091A (en) * | 1915-05-17 | 1916-05-23 | Royal E Frickey | Electric storage-cooker. |
US3811068A (en) * | 1971-12-30 | 1974-05-14 | Westinghouse Electric Corp | Protection circuit for cathode ray tubes |
JPS49107480A (zh) | 1973-02-15 | 1974-10-12 | ||
US4004045A (en) * | 1974-08-09 | 1977-01-18 | Stelter Manfred K | Method for fluid film application |
US4324647A (en) * | 1980-05-01 | 1982-04-13 | Phillips Petroleum Company | Catalytic hydrocracking, hydrodesulfurization, and/or hydrodenitrogenation of organic compounds employing promoted zinc titanate and a zeolite as the catalytic agent |
DE3811068C2 (de) * | 1988-03-31 | 1995-07-20 | Telefunken Microelectron | Vorrichtung zum einseitigen Bearbeiten von flächenhaft ausgedehnten Körpern, insbesondere von Halbleiterscheiben |
JPH03229680A (ja) | 1990-02-02 | 1991-10-11 | Toppan Printing Co Ltd | 洗浄方法 |
CA2066753A1 (en) * | 1990-08-22 | 1992-02-23 | Minoru Inada | Cleaning method and cleaning apparatus |
US5690755A (en) * | 1992-08-31 | 1997-11-25 | Nippon Steel Corporation | Cold-rolled steel sheet and hot-dip galvanized cold-rolled steel sheet having excellent bake hardenability, non-aging properties at room temperature and good formability and process for producing the same |
US5270079A (en) | 1992-12-18 | 1993-12-14 | Specialty Coatings Systems, Inc. | Methods of meniscus coating |
US5601655A (en) | 1995-02-14 | 1997-02-11 | Bok; Hendrik F. | Method of cleaning substrates |
JP3103774B2 (ja) | 1996-03-29 | 2000-10-30 | 芝浦メカトロニクス株式会社 | 超音波洗浄方法およびその洗浄装置 |
EP1005095B1 (en) | 1997-03-21 | 2003-02-19 | Sanyo Electric Co., Ltd. | Method of manufacturing a photovoltaic element |
JP3772456B2 (ja) * | 1997-04-23 | 2006-05-10 | 三菱電機株式会社 | 太陽電池及びその製造方法、半導体製造装置 |
US6015462A (en) * | 1997-09-30 | 2000-01-18 | Semitool, Inc. | Semiconductor processing workpiece position sensing |
WO1999017344A1 (en) * | 1997-09-30 | 1999-04-08 | Semitool, Inc. | Apparatus and methods for controlling workpiece surface exposure to processing liquids during the fabrication of microelectronic components |
US5839460A (en) * | 1997-11-13 | 1998-11-24 | Memc Electronic Materials, Inc. | Apparatus for cleaning semiconductor wafers |
DE19830212A1 (de) * | 1998-07-07 | 2000-01-20 | Angew Solarenergie Ase Gmbh | Verfahren und Vorrichtung zum Behandeln von Gegenständen, insbesondere scheibenförmigen Gegenständen wie Blechen, Glasplatten, Leiterplatten, Keramiksubstraten |
WO2000007220A2 (en) | 1998-07-29 | 2000-02-10 | Cfmt, Inc. | Wet processing methods for the manufacture of electronic components using ozonated process fluids |
DE19901162C2 (de) * | 1999-01-14 | 2002-03-14 | Wacker Siltronic Halbleitermat | Vorrichtung und Verfahren zum Reinigen von Halbleiterscheiben |
US7640176B1 (en) | 1999-05-20 | 2009-12-29 | Insweb Corporation | Insurance agent contact system |
JP2002075947A (ja) * | 2000-08-30 | 2002-03-15 | Alps Electric Co Ltd | ウェット処理装置 |
EP1354638A3 (en) * | 2002-04-15 | 2004-11-03 | Fuji Photo Film Co., Ltd. | Method and apparatus for manufacturing pattern members using webs on which coating films have been formed |
SG114560A1 (en) * | 2002-07-31 | 2005-09-28 | Inst Data Storage | A method and apparatus for cleaning surfaces |
-
2004
- 2004-03-22 JP JP2007504241A patent/JP4780800B2/ja not_active Expired - Lifetime
- 2004-03-22 KR KR1020067021686A patent/KR101046287B1/ko active IP Right Grant
- 2004-03-22 CN CN2004800430875A patent/CN101015037B/zh not_active Expired - Fee Related
- 2004-03-22 WO PCT/DE2004/000597 patent/WO2005093788A1/de active Application Filing
- 2004-03-22 AT AT04722226T patent/ATE480868T1/de active
- 2004-03-22 DE DE112004002879T patent/DE112004002879A5/de not_active Withdrawn
- 2004-03-22 EP EP04722226.0A patent/EP1733418B2/de not_active Expired - Lifetime
- 2004-03-22 ES ES04722226T patent/ES2352674T3/es not_active Expired - Lifetime
- 2004-03-22 DE DE502004011649T patent/DE502004011649D1/de not_active Expired - Lifetime
- 2004-03-22 US US10/599,208 patent/US7943526B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5660642A (en) * | 1995-05-26 | 1997-08-26 | The Regents Of The University Of California | Moving zone Marangoni drying of wet objects using naturally evaporated solvent vapor |
EP1073095A2 (en) * | 1999-07-29 | 2001-01-31 | Kaneka Corporation | Method for cleaning photovoltaic module and cleaning apparatus |
Also Published As
Publication number | Publication date |
---|---|
US20080233760A1 (en) | 2008-09-25 |
WO2005093788A1 (de) | 2005-10-06 |
EP1733418B1 (de) | 2010-09-08 |
ES2352674T3 (es) | 2011-02-22 |
DE112004002879A5 (de) | 2007-05-24 |
DE502004011649D1 (de) | 2010-10-21 |
EP1733418B2 (de) | 2018-01-17 |
EP1733418A1 (de) | 2006-12-20 |
JP2007529912A (ja) | 2007-10-25 |
JP4780800B2 (ja) | 2011-09-28 |
US7943526B2 (en) | 2011-05-17 |
CN101015037A (zh) | 2007-08-08 |
ATE480868T1 (de) | 2010-09-15 |
KR101046287B1 (ko) | 2011-07-04 |
KR20070005685A (ko) | 2007-01-10 |
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