CN101013476A - 卷绕rfid标签系列的方法以及rfid标签卷 - Google Patents

卷绕rfid标签系列的方法以及rfid标签卷 Download PDF

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Publication number
CN101013476A
CN101013476A CNA2006101444236A CN200610144423A CN101013476A CN 101013476 A CN101013476 A CN 101013476A CN A2006101444236 A CNA2006101444236 A CN A2006101444236A CN 200610144423 A CN200610144423 A CN 200610144423A CN 101013476 A CN101013476 A CN 101013476A
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CN
China
Prior art keywords
rfid label
antenna
stress
series
reeling
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Pending
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CNA2006101444236A
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English (en)
Inventor
石川直树
常野达朗
吉良秀彦
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Fujitsu Ltd
Fujitsu Frontech Ltd
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Fujitsu Ltd
Fujitsu Frontech Ltd
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Publication of CN101013476A publication Critical patent/CN101013476A/zh
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    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
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Abstract

本发明提供一种卷绕RFID标签系列的方法以及RFID标签卷。RFID标签系列卷绕在卷轴芯上，该卷轴芯由芯材料以及叠置在该芯材料周围的应力吸收材料形成，该应力吸收材料吸收在卷绕所述RFID标签系列时产生的应力。在所述RFID标签系列中，在长带状柔性基片上以预定的间距形成多个RFID标签，所述RFID标签的每个都具有天线以及与所述天线相连的电路芯片，并通过所述天线进行无线电通信。

Description

卷绕RFID标签系列的方法以及RFID标签卷
技术领域
本发明涉及一种卷绕RFID标签系列的方法以及一种RFID标签卷。在所述RFID标签系列上形成有多个RFID(射频识别)标签，所述RFID标签无需与外部装置接触就能与该装置进行信息交换，并以预定的间距布置在长带形的柔性基片上。所述RFID标签卷通过所述RFID标签系列卷绕而成。在本领域内技术人员中，本发明中采用的“RFID标签”也称为“RFID标签嵌体(inlay)”，该嵌体即“RFID标签”的内部构件。该“RFID标签”也称为“无线IC标签”。RFID标签包括非接触式IC卡。
背景技术
近年来，已经提出了多种不与以读取器和记录器为代表的外部装置接触而通过使用无线电波与所述装置交换信息的RFID标签(例如参见日本专利特开2000-311226、2000-200332和2001-351082号公报)。一个这样的RFID标签设有用于无线电通信的天线图案以及电路芯片，所述天线图案和电路芯片都安装在由塑料或纸制成的基片上。这种RFID标签的用途在于通过与外部装置交换关于其上附有该RFID标签的物品等的信息而对该物品等进行区分。
图1的部分(A)和部分(B)分别为表示RFID标签示例的前视图和侧剖视图。
图1所示的RFID标签由天线12、IC芯片11、盖片14构成，所述天线12由导电材料(诸如Cu或Al或Ag涂胶)形成并布置在由PET、聚酰亚胺等制成的呈薄膜形式的基片13上，所述IC芯片11具有通过凸起16连接到天线12上的IC电极，所述盖片14通过粘合剂15粘合到基片13上，以使得盖片14覆盖天线12和IC芯片11。
这里，IC芯片11的电极在天线12的两个端部12a和12b以及都与基片13上的天线分开形成的两个接合点(land)12c和12d这四个点上粘合。只有连接到天线12的端部12a和12b上的两个电极实际上起到电的作用，而连接到接合点12c和12d上的其它电极只是用于将IC芯片稳定地固定到基片13上。
构成RFID标签1的IC芯片11可通过天线12与外部装置进行无线电通信从而进行信息交换。
此外，在图1中，RFID标签1的天线12由两个环121和122构成。然而，天线12不限于这一形式。可以采用具有不同形式的其它天线，例如一个形成为环，而一个形成为从IC芯片的两侧延伸的条状。
接下来将描述图1所示的RFID标签1的加工过程。
图2为表示在基片上形成天线的状态的图。
在该示例中制备基片13，该基片13呈沿图2的左右方向延伸的长带状形式，而且是柔性的，呈例如由PET或聚酰亚胺制成的薄膜的形式。在基片13上利用诸如Ag涂胶的导电材料以预定间距形成有多个用于RFID标签的天线12。
接下来，在每个天线12上，将每个IC芯片(参见图1)安装在图2中的虚线圆表示的位置处。
图3为表示IC芯片安装过程的过程图。
将热固性粘合剂21施加到在其上形成有天线12的基片13上的IC安装位置(由图2中的虚线圆表示)，如图3的部分(A)所示。
接下来，将具有形成在IC电极111上的焊料凸起16的IC芯片11承放并确定在基片13的IC安装位置上(图3的部分(B))。然后，通过安装头31将IC芯片11按压在基片13上，并同时加热IC芯片(图3的部分(C))。这样，通过凸起16用焊料将IC芯片11粘合到天线12上，并通过粘合剂的硬化而将所述IC芯片粘合到基片13上，然后移开安装头31(图3的部分(D))。
如图2所示，对于形成在基片13上的多个天线12中的每个天线，重复上述IC芯片安装过程。
在如上所述地安装IC芯片11后，根据需要用盖片14覆盖IC芯片。(参见图1的部分(B))。
图4为表示另一IC芯片安装过程的过程图。
将热固性粘合剂22施加到在其上形成有天线12的基片13上的IC安装位置(由图2中的虚线圆表示)。在该IC安装位置上，通过粘合剂22将IC芯片11安装并粘合到基片13上，且电极112向上(图4的部分(A))。
接下来，将IC芯片11的电极112以及基片13上的天线12用接合线17进行线接合(图4的部分(B))，然后用树脂18封装(图4的部分(C))。
如图3或图4所示的，每个IC芯片安装在每个天线12上的组成物称为RFID标签系列。
所述RFID标签系列一次卷起以发送至加工处理，诸如分离将要安装在IC卡上的每个RFID标签。
图5为表示RFID标签系列被卷绕的RFID标签卷的图。
在呈长带状形式的基片13上形成的多个RFID标签的RFID标签系列100绕柱状芯41卷起，从而卷绕形成RFID标签卷100。
因为RFID标签系列100绕芯卷绕使得卷绕的RFID标签系列100没有松动，从而RFID标签系列在一定张力下卷绕。在进行卷绕时，产生向着中心的应力。为此，在一部分RFID标签系列100的卷绕内侧上作用有过大的载荷。此外，在由于RFID标签系列100的加工设备的运行计时而难以连续卷绕时，应暂停重复卷绕一定时间，以进行间歇操作。在该过程中，因为即使在卷绕暂停的计时内也要持续施加张力来防止RFID标签系列100变松，因此卷绕得太紧，从而进一步增加了作用在卷绕内侧部分上的载荷。
因此，由于应力与卷绕增加量成比例地增加，从而在图5中的虚线圆所示的位置处(IC芯片在该位置处叠加)产生天线的断裂和IC芯片的破坏。因此，难以维持产品的功能。防止这一点的方法包括降低用于卷绕的张力，以在卷绕期间减轻张力。然而，在张力过分降低时，可能会产生由于卷绕坍塌(collapse)而不能维持卷形式的问题。作为一种降低应力同时防止卷坍塌的方法，设置引导壁(guide wall)来保持在其两侧卷起的RFID标签系列，从而防止卷绕坍塌。然而，引导壁的直径需要是卷绕完成后的卷的大约两倍大，因此由于空间的原因而难以放置所述壁。
在有缺陷的产品混入到已卷绕的RFID标签系列中时，需要增加去除有缺陷产品的选择过程。因此，这对于应该以低成本、大批量制造的RFID标签的加工带来相当大的影响。
发明内容
考虑到以上所述，本发明提供一种卷绕RFID标签系列的方法，该方法产生所需的张力，并同时防止产生产品缺陷，本发明还提供一种通过所述卷绕方法形成所述RFID标签系列的RFID标签卷。
根据本发明的一方面，提供一种卷绕RFID标签系列的方法，其中，在长带状柔性基片上以预定的间距形成多个RFID标签，所述RFID标签的每个都具有天线以及与所述天线相连的电路芯片，并通过所述天线进行无线电通信，所述方法包括，绕由芯材料以及叠置在该芯材料周围的应力吸收材料形成的卷轴芯来卷绕所述RFID标签系列，所述应力吸收材料吸收在卷绕所述RFID标签系列时产生的应力。
优选地，所述应力吸收材料响应于在卷绕所述RFID标签系列时产生的应力而收缩和变形。
此外，根据本发明的一方面，一种RFID标签卷包括：
RFID标签系列，其中，在长带状柔性基片上以预定的间距形成多个RFID标签，所述RFID标签的每个都具有天线以及与所述天线相连的电路芯片，并通过所述天线进行无线电通信，以及
卷轴芯，所述RFID标签系列卷绕在该卷轴芯上，而且该卷轴芯由芯材料以及叠置在该芯材料周围的应力吸收材料形成，所述应力吸收材料吸收在卷绕所述RFID标签系列时产生的应力。
根据本发明的一方面，由于应力吸收材料位于所述芯材料和所述RFID标签系列之间，从而即使在利用所需张力卷绕所述RFID标签系列时也由于所述应力吸收材料的存在而吸收应力。因此，避免了诸如所述天线断裂或所述IC芯片破坏的缺陷。
附图说明
图1的部分(A)和部分(B)分别为表示RFID标签示例的前视图和侧剖视图。
图2为表示在基片上形成天线的状态的图。
图3为表示IC芯片安装过程的过程图。
图4为表示另一IC芯片安装过程的过程图。
图5为表示RFID标签系列被卷绕的RFID标签卷的图。
图6为表示RFID标签系列被卷绕的RFID标签卷的图。
具体实施方式
将参考附图来描述根据本发明的示例性实施例。
在以下描述的示例性实施例中，RFID标签以及RFID标签系列本身与上述现有技术中的RFID标签类似。因此，仅参考图1至图4以及对它们的说明来描述与现有技术的不同之处。
图6为表示RFID标签系列被卷绕的RFID标签卷的图。
RFID标签系列100绕由芯材料41以及叠置在芯材料41周围的应力吸收材料42形成的卷轴芯40卷绕，从而形成RFID标签卷120。图6所示的芯材料41的直径比图5所示的芯材料的直径小出将应力吸收材料42放置在芯材料41周围的那一部分。
在示例性实施例中，采用在外力作用下收缩和变形的材料(诸如空气缓冲器材料和海绵)作为应力吸收材料。
如上所述，在RFID标签卷120绕由芯材料41和应力吸收材料42形成的卷轴芯40卷绕时，随着卷绕的进行在卷绕的内侧部分上作用有载荷。因此，应力吸收材料42收缩和变形从而吸收应力。这样就防止了诸如天线断裂或IC芯片破坏的缺陷。
此外，应力吸收材料42以及芯材料41可粘合在一起从而一体形成。或者，在卷绕RFID标签系列前，应力吸收材料42可作为单独的材料而叠置在芯材料41的周围。而且，在卷绕内侧部分时产生的应力还取决于卷绕的RFID标签系列的长度。因此，可采用厚度与卷绕的RFID标签系列的长度相对应的应力吸收材料42。

Claims (3)

1、一种卷绕RFID标签系列的方法，其中在长带状柔性基片上以预定的间距形成多个RFID标签，所述RFID标签的每个都具有天线以及与所述天线相连的电路芯片，并通过所述天线进行无线电通信，所述方法包括：
绕由芯材料以及叠置在该芯材料周围的应力吸收材料形成的卷轴芯来卷绕所述RFID标签系列，所述应力吸收材料吸收在卷绕所述RFID标签系列时产生的应力。
2、根据权利要求1所述的卷绕方法，其特征在于，所述应力吸收材料响应于在卷绕所述RFID标签系列时产生的应力而收缩和变形。
3、一种RFID标签卷，该RFID标签卷包括：
RFID标签系列，其中，在长带状柔性基片上以预定的间距形成多个RFID标签，所述RFID标签的每个都具有天线以及与所述天线相连的电路芯片，并通过所述天线进行无线电通信；以及
卷轴芯，所述RFID标签系列卷绕在该卷轴芯上，而且该卷轴芯由芯材料以及叠置在该芯材料周围的应力吸收材料形成，所述应力吸收材料吸收在卷绕所述RFID标签系列时产生的应力。
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