CN100590826C - 引线清洗导向装置 - Google Patents
引线清洗导向装置 Download PDFInfo
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Abstract
本发明涉及引线清洗导向装置。设有等离子发生室(41),从等离子用气体供给部(34)供给等离子用气体,从等离子发生用的高频电力供给部(32)供给高频电力,引线(12)通过设在等离子发生室(41)的绝缘套(43,45)的导向孔(44,46)。引线(12)接地,在引线(12)和等离子发生室之间通以高频电力,在等离子发生室内部使得等离子用气体等离子化,清洗引线(12)。使得引线输出部侧导向孔(44)的孔径比焊接工具侧导向孔(46)的孔径大,以便使得从引线输出部侧的导向孔(44)流出的引线清洗后的气体流量比从焊接工具侧的导向孔(46)流出的引线清洗后的气体流量多。在接合装置中,焊接时在引线路线上能有效除去引线表面异物。
Description
技术领域
本发明涉及用于引线接合装置等的引线清洗导向装置结构。
背景技术
在半导体的制造工序中,大多使用以金属线连接半导体芯片和引脚框之间的接线机。在该接线机中,使用金线作为连接引线。但是,近年来,由于半导体的高速化,低价格化的要求,大多使用能实现更高速的信号处理、且成本也低的铜等金以外的金属线作为连接引线。
这样的铜等金属线的表面易氧化,若置于高温状态,或长时间放置在空气中,会在表面形成氧化膜。这样的氧化膜在引线接合中存在产生连接不良、引起焊接质量低下的问题。
在专利文献1中,公开了以下技术:当将铜等易氧化金属线用于引线接合时,因加热半导体芯片或引脚框产生的热,会引起金属线表面氧化,为了防止上述表面氧化,在引线输送部和作为接合工具的毛细管之间,向引线喷射惰性气体,防止因热引起表面氧化。
另一方面,在金引线等中,使用在形成引线环后为防止发生短路、用树脂等对引线进行包覆的方法。但是,将包覆引线用于引线接合场合,必须除去引线表面的包覆物,使得金属面暴露。作为这种除去引线表面包覆物的技术,在专利文献2中,公开了以下方法:在毛细管等接合工具前端设有感应线圈,通过接合工具使得引线与引脚框接触时,在感应线圈中流过高频电流,熔融引线的包覆树脂,除去连接部分的包覆物,此后,一边通过超声波模具施加振动,一边通过接合工具将引线朝引脚框加压,进行接合。
在专利文献3中,公开了通过激光光线加热树脂包覆物、熔融除去连接部分树脂的方法。在专利文献4中,公开了以下方法:将具有树脂包覆物的引线插入放电电极之间,通过放电电极间的放电释放出的电子加热熔融树脂包覆物,除去树脂包覆物。
另外,在金引线中,为了与接合动作高速化对应,大多场合在引线表面涂布界面活性剂。该界面活性剂在高温的接合工具前端附近蒸发,但含有的有机成份作为污染物固接在接合工具前端部分,若长时间使用,则会发生引线切断差等接合质量低下的问题。因此,接合工具每隔所定时间或所定接合次数需要更换,或必须清洗,存在接合效率低下问题。
在引线接合装置中,使用张紧器对插入穿通在作为接合工具的毛细管中的引线给予拉伸力,使得引线不松弛。在专利文献5中,记载了以下张紧器:在筒状的喷嘴支架的引线卷线筒侧,设有比毛细管侧大的引线通孔,使得供给喷嘴支架的压缩空气在两侧排出,通过在上方流过的流体阻力,对引线施加一定的张力。
在专利文献6中,公开了在等离子发生部从前端的气体喷出口向半导体芯片电极喷射等离子化气体清洗电极的技术。
[专利文献1]日本特开昭61-58246号公报
[专利文献2]日本特开平5-211196号公报
[专利文献3]日本特开昭61-214530号公报
[专利文献4]日本专利第2723280号说明书
[专利文献5]日本特开2002-83837号公报
[专利文献6]日本特开2000-340599号公报
作为除去引线表面附着物的方法,有专利文献2-4记载的背景技术。但是,在这些背景技术中,可以通过感应加热,激光加热,放电加热等高温加热处理除去引线表面树脂膜,但由于高温处理,存在处理时引线表面氧化形成氧化膜问题。对此,如专利文献4记载,有使得放电部流过惰性气体防止引线氧化的方法。但是,存在难以除去形成在引线表面的氧化膜的问题。又,因高温处理,即使能除去氧化膜,引线的机械特性,电气特性因高温处理发生变化,存在有时因粘接性低下导致连接不良或动作不良原因的问题。再有,使用如专利文献5记载那样的张紧器场合,因包含氧气的空气接触高温引线表面,表面氧化进展,存在进一步因表面氧化物导致引线连接不良问题。这样,在专利文献2-4记载的背景技术中,存在不能有效除去引线表面氧化膜等异物的问题。
在专利文献1记载的背景技术中,能防止表面没有发生氧化的铜引线在将要焊接前的热氧化,但不能除去已经形成在表面的氧化膜。因此,通常必须使用表面没有氧化的铜引线进行焊接,存在可使用的引线受到限制的问题。当使用表面已形成氧化膜的铜引线场合,由于不能除去氧化膜,存在引线接合性低下、连接不良等接合质量低下的问题。
根据与上述同样的理由,在专利文献1-4记载的背景技术中,存在不能有效除去涂布在金引线表面的界面活性剂的问题。
再有,如专利文献6记载的背景技术,向被清洗体喷射等离子化气体的方法,由于从一方喷出等离子化气体,即使用于清洗引线场合,也不能均等地清洗全周,产生清洗不匀,存在局部发生接合不良可能性的问题。另外,在朝着引线喷出等离子化气体的方式中,因喷流导致引线路线变化,引线张力也变化,因此,存在引起接合不良等接合质量低下的问题。
发明内容
本发明就是为解决上述先有技术所存在的问题而提出来的,本发明的目的在于,接合时在引线路线上能有效除去引线表面异物。
为了达到上述目的,本发明提出以下技术方案。
(1)一种引线清洗导向装置,设有等离子发生室,供给等离子用气体,向等离子发生室和通过其中的引线之间通电,在等离子发生室的内部使得等离子用气体等离子化,通过等离子化气体清洗引线,该引线为接合用引线,沿送进方向对引线进行导向同时清洗引线,其特征在于:
等离子发生室安装在引线输出部和焊接工具之间,在引线输出部侧及焊接工具侧各包含沿送进方向对引线进行导向的导向孔;
使得引线输出部侧导向孔的直径比焊接工具侧导向孔的直径大,以便使得从引线输出部侧的导向孔和引线之间流出的引线清洗后的气体流量比从焊接工具侧的导向孔和引线之间流出的引线清洗后的气体流量多。
(2)一种引线清洗导向装置,设有等离子发生室,供给等离子用气体,向等离子发生室和通过其中的引线之间通电,在等离子发生室的内部使得等离子用气体等离子化,通过等离子化气体清洗引线,该引线为接合用引线,沿送进方向对引线进行导向同时清洗引线,其特征在于,等离子发生室安装在引线输出部和焊接工具之间,等离子发生室包括:
等离子空间分隔部件,设在引线输出部侧及焊接工具侧,包含等离子衰减孔,引线插入穿通所述等离子衰减孔,同时使得等离子衰减;
二个盖,各包含导向孔及气体排出喷嘴,所述导向孔设在各等离子空间分隔部件的引线输出部侧及焊接工具侧,沿送进方向对引线进行导向,所述气体排出喷嘴从等离子发生室排出引线清洗后气体。
(3)在上述(2)所述的引线清洗导向装置中,其特征在于:
包括气体净化机构,该气体净化机构设有:
过滤器,用于除去从气体排出喷嘴排出的引线清洗后的气体中的异物;
再循环流路,将通过所述过滤器的气体作为等离子发生用气体再供给等离子发生室。
(4)在上述(1)-(3)中任一个所述的引线清洗导向装置中,其特征在于:
包括电介质构成的保持线圈,沿引线送进方向设在等离子发生室内部,引线插入穿通其中心孔。
下面说明本发明效果。
按照本发明的引线清洗导向装置,具有焊接时在引线路线中能有效除去引线表面异物的效果。
附图说明
图1是表示引线接合装置构成的说明图。
图2是表示本发明涉及的引线清洗导向装置第一参考例构成的说明图。
图3是在本发明涉及的引线清洗导向装置第一参考例中,表示将引线清洗导向装置与张紧器一起配置在引线路线上构成的说明图。
图4是在本发明涉及的引线清洗导向装置的第一实施形态中,表示引线清洗导向装置配置的说明图。
图5是在本发明涉及的引线清洗导向装置的第一实施形态中,表示等离子发生室的截面图。
图6是表示本发明涉及的引线清洗导向装置第二参考例构成的说明图。
图7是在本发明涉及的引线清洗导向装置的第二实施形态中,表示等离子发生室的截面图。
图8是表示本发明涉及的引线清洗导向装置的第三实施形态构成的说明图。
图9是表示本发明涉及的引线清洗导向装置的第四实施形态构成的说明图。
符号说明如下:
11-引线接合装置、12-引线、13-接合臂、14-引脚框、15-半导体芯片、16-毛细管、17-夹紧器、19-焊头、20-XY台、21-超声波振子、22-运送导向件、23-焊接台、25-加热器、27-回转中心、28-卷线筒、31-引线清洗导向装置、32-高频电力供给部、33-电力线、34-等离子用气体供给部、35-气体供给管、41-等离子发生室、41a,41b-端板、42-气体供给喷嘴、43,45-绝缘套、44,46-导向孔、47-电介体、48-导向孔、48a-卷线筒侧导向孔、48b-毛细管侧导向孔、49-气体供给孔、51-保持线圈、53-卷线筒侧盖、54,57-排气喷嘴、55,58-小孔、56-毛细管侧盖、61-高频电源、62-匹配电路、63-气源、64-供给箱、65-等离子空间分隔部件、66-等离子衰减孔、71-减压阀、72-关闭阀、73-缓冲罐、74-泵、75-流量计、76-过滤器、77-压缩机、78-气体补充管、79-压力计、80,81-排气配管、82-入口管、83-出口管、84-储气瓶、90-张紧器、300-等离子。
具体实施方式
下面参照附图说明本发明的较佳实施形态及参考例。在以下实施形态中,虽然对构成要素,种类,组合,形状,相对配置等作了各种限定,但是,这些仅仅是例举,本发明并不局限于此。
下面参照附图说明本发明的引线清洗导向装置的合适的参考例。如图1所示,在引线接合装置11中,焊头19设置在XY台20上,接合臂13和夹紧器17安装在焊头19上。在接合臂13前端安装作为接合工具的毛细管16,在接合臂13基端部安装超声波振子21,用于将超声波能量供给前端的毛细管16。
在焊头19的上部设有作为引线输出部的卷线筒28。在作为引线输出部的卷线筒28和作为接合工具的毛细管16之间设有引线清洗导向装置31,清洗引线12同时,沿送进方向进行导向。在本参考例中,引线清洗导向装置31设在与接合臂13邻接设置的夹紧器17和卷线筒28之间,但若设在卷线筒28和毛细管16之间,则并不局限于该位置,也可以设在接合臂13和夹紧器17之间。由于卷线筒28接地,因此,引线12通过卷线筒28接地。卷绕在卷线筒28上的引线12从卷线筒28通过引线清洗导向装置31送出,通过引线清洗导向装置31被导向,从夹紧器17插入穿通毛细管16的中心孔。来自等离子发生用的高频电力供给部32的电力线33以及从等离子用气体供给部34供给等离子用气体的气体供给管35与引线清洗导向装置31连接。
XY台20在沿接合面的面内(XY面内)能使焊头19移动到随意位置,通过高速Z电机驱动安装在焊头19上的接合臂13绕回转中心27回转,沿上下方向即Z方向驱动安装在其前端的毛细管16,驱动夹紧器17与接合臂13一起上下移动。
在XY台20的接合臂13的前端侧设有两根运送导轨22,用于对引脚框14进行导向,通过该运送导轨22将安装着半导体芯片15的引脚框14朝着图中X方向运送。在各运送导轨22之间设有进行焊接的焊接台23,运送到焊接台23的引脚框14被吸附固定在焊接台23上。加热器25安装在焊接台23上,用于加热被吸附固定的引脚框14。
简单说明这样构成的引线接合装置11的动作。若由运送导轨22运送的引脚框14来到焊接台23上,则引脚框14被吸附固定在焊接台23上同时被加热。若通过XY台20使得安装在接合臂13前端的毛细管16对位到半导体芯片15的焊接点(pad)位置,则通过高速Z电机使得接合臂13往下移动,通过毛细管16将引线12推压在半导体芯片15上,同时,通过超声波振子21使得毛细管16振动,使得引线12与半导体芯片15接合。此后,使得接合臂13上升,使得毛细管16位置与引脚框14的焊接点位置一致,同样实行引线12接合。引线12与引脚框14的接合一结束,就将夹紧器17设为闭合,一边握持引线12一边与接合臂13一起上升,切断引线12。在半导体芯片15和引脚框14的各焊接点之间反复实行上述动作,通过引线12连接半导体芯片15和引脚框14之间。并且,连接在半导体芯片15和引脚框14之间的引线12,从卷线筒28通过引线清洗导向装置31清洗供给毛细管16。
参照图2详细说明引线清洗导向装置31的第一参考例。引线清洗导向装置31设有等离子发生室41,供给等离子用气体的气体供给喷嘴42以及绝缘套43,45。等离子发生室41由例如不锈钢等金属制成,呈圆筒形状,内部具有使得等离子发生的空间,在卷线筒侧及毛细管侧分别设有端板41a,41b。绝缘套43,45分别固定在各端板41a,41b的中心。各绝缘套43,45由绝缘部件构成,在其中心设有用于对引线12进行导向的导向孔44,46,对引线12进行导向同时,使得金属制的引线12和金属制的等离子发生室41绝缘。各绝缘套43,45分别固定在各端板41a,41b的中心。各绝缘套43,45构成为能在等离子发生室41内部使得金属制的引线12离开等离子发生室41内壁保持着。等离子发生室41设为圆筒形状,其中心配置引线12,使得在引线12周围能生成大致均等的等离子,但并不局限于此,只要能在引线12周围能生成大致均等的等离子,也可以构成例如四角形等多角形筒。
等离子发生室41的气体供给喷嘴42通过气体配管与等离子用气体供给部34连接。等离子用气体供给部34具有供给成为等离子源的气体的功能,具体地说,包含等离子用的气源63,供给箱64以及连接它们的各种配管构成,所述供给箱64将从气源63送来的气体供给等离子发生室41。在本参考例中,等离子用气体设为氩气,但也可以使用氮气,或氦,氖等惰性气体。供给箱64也可以根据附着在引线12表面的异物,以适当的混合比混合还原性气体或氧化性气体供给等离子发生室41。使得还原性气体混合场合,可以通过还原除去引线12表面的氧化膜等,使得氧化性气体混合场合,能更有效地除去引线12表面的有机物。作为还原性气体,可以使用例如氢气,作为氧化性气体,可以使用例如氧气。只要具有还原性,还原性气体并不局限于氢,也可以使用其他气体。只要具有氧化性,氧化性气体并不局限于氧,也可以使用其他气体。消耗的气体量为微量,因此,各气体可以从小型储气瓶供给。当然,也可以从外部通过专用配管与供给箱64连接。
等离子发生用的高频电力供给部32通过电力线33与金属制的等离子发生室41连接。高频电力供给部32具有向作为电极的金属制的等离子发生室41供给用于持续生成等离子的高频电力的功能,包括匹配电路62及高频电源61构成。匹配电路62是用于抑制向作为电极的等离子发生室41供给高频电力时的电力反射的电路。高频电源61可以使用例如从100MHz到500MHz等频率的电源。供给电力的大小考虑从等离子用气体供给部34供给的气体种类,流量,等离子的稳定性等决定。
通过等离子发生室41内部的引线12通过如图1所示卷线筒28接地,因此,若从高频电力供给部向等离子发生室41以高频供给电力,则起着作为等离子发生用的一方电极的功能。
说明引线清洗导向装置31的动作。为了在等离子发生室41内生成等离子300,实行以下工序。最初,从等离子用气体供给部34向等离子发生室41供给适当流量的等离子用气体。如图2所示,供给的等离子用气体从气体供给喷嘴42流入等离子发生室41内。流入的等离子用气体按图中箭头所示,从卷线筒侧的绝缘套43的导向孔44与引线12之间的间隙以及毛细管侧的绝缘套45的导向孔46向外部流出。接着,从高频电力供给部32向等离子发生室41供给适当的高频电力。上述适当条件可以预先通过试验求得。并且,若供给的等离子用气体条件及高频电力条件合适,则将等离子发生室41和引线12作为两电极,在等离子发生室41内部,等离子用气体被等离子化,生成等离子300。生成的等离子300在等离子发生室41内部从全周方向大致均等地与引线12冲突,从全周方向清洗附着在引线外表面的异物。包含从引线12表面除去的异物的引线清洗后的气体,按图中箭头所示,从卷线筒侧的绝缘套43的导向孔44与引线12之间的间隙以及毛细管侧的绝缘套45的导向孔46向外部流出。
表面附着氧化膜或界面活性剂等异物的引线12通过卷线筒侧的绝缘套43的导向孔44被送向等离子发生室41内部,在其内部通过等离子除去表面异物,从毛细管侧的导向孔46伸出到外部,送向毛细管16。引线清洗导向装置31配置在毛细管16的正上方的引线路线中,已清洗的引线12以清洁表面状态被导向,保持该路线,供给毛细管16,与半导体芯片15或引脚框14接合。因此,接合面不会进入异物,能减少发生接合不良。又,通过等离子300从全周方向清洗引线12,因此,清洗引线12没有方向性,能大致均等地清洗全周,不管朝着什么方向接合引线12场合,也能减少接合不良。又,通过低温的等离子300清洗处理引线12,因此,能防止引线12的电气、机械特性变化,防止粘接力低下,同时,通过低温的等离子300处理,在引线12表面形成微小凹凸,通过该微小凹凸能提高引线12的接合性。另外,具有提高与模制树脂接合性的效果。又,通过混合氧化性气体,能有效地除去金引线等表面的有机物,能使得毛细管16寿命变长。将本参考例的引线清洗导向装置31适用于包覆引线场合,在包覆引线表面通过等离子300处理形成微小凹凸,通过该微小凹凸具有提高与模制树脂接合性的效果。
这样,在焊接时,本参考例的引线清洗导向装置31具有以下效果:在引线路线上能有效除去引线表面异物,同时,能提高引线12的接合性。
如图3所示,本参考例的引线清洗导向装置31与张紧器90一起配置很合适,所述张紧器90朝着卷线筒侧对引线12施加张力。张紧器90在筒状的喷嘴支架的卷线筒侧设有比毛细管侧大的引线通孔,将供给喷嘴支架的高压空气向两侧排出。此时,流向卷线筒侧的排出空气量比流向毛细管侧的排出空气量多,因此,在引线12上产生朝着卷线筒侧的力。如图3所示,焊接时,引线12的前端与半导体芯片15或引脚框14接合,因此,在引线12上通过上述力施加张力。引线清洗导向装置31通过张紧器90,即使引线12表面形成氧化膜场合,在引线12供给毛细管16前,在引线路线中,能有效地清洗该氧化膜,具有能提高引线12接合性的效果。
参照图4及图5说明第一实施形态。如图4所示,本实施形态的引线清洗导向装置31对引线12进行导向、清洗同时,能对引线12施加朝着卷线筒侧的张力。与参照图1-图3说明的参考例相同部分标以相同符号,说明省略。如图5所示,在本实施形态中,卷线筒侧的绝缘套43的导向孔44的大小比毛细管侧的绝缘套45的导向孔46大,从导向孔44和引线12之间排出到外部的清洗后气体量比从导向孔46和引线12之间排出到外部的清洗后气体量多。因此,由朝卷线筒侧喷出的清洗后气流施加在引线12的卷线筒侧方向的力比由朝毛细管侧喷出的清洗后气流施加在引线12的毛细管侧方向的力大,引线12朝着卷线筒侧施加力。与上述说明相同,因该力在引线12上施加张力。该张力使得通过等离子发生室41中的引线12保持直线状,减少引线12和等离子发生室41内面之间距离变化,能使得产生等离子300更稳定化。由于该张力插入穿通毛细管16中心孔的引线12不会松弛,毛细管16能使得引线12成形为所定形状,连接在半导体芯片15和引脚框14之间。
在本实施形态的一实施例中,引线直径为φ50μm,使得卷线筒侧的绝缘套43的导向孔44为0.5mm,毛细管侧的绝缘套45的导向孔46为0.15mm。
当然,上述数据不过是本发明一例,本发明并不局限于上述数据。
这样,本实施形态的引线清洗导向装置31除了具有与上述说明的参考例相同效果之外,还具有以下效果:使得通过等离子发生室41中的引线12保持直线状,减少引线12和等离子发生室41内面之间距离变化,能使得产生等离子300更稳定化。又,在引线路线中,通过给与引线12所定张力,具有能使得引线12成形为所定形状连接的效果。进而,即使不使用张紧器90也能对引线12施加所定张力,具有能使得装置简单的效果。
参照图6说明本发明第二参考例。与参照图1-图5说明的参考例、实施形态相同部分标以相同符号,说明省略。在图6中,将陶瓷或玻璃等电介体47安装在等离子发生室41内部,在该电介体47内部设有导向孔48,将引线12插入穿通所述导向孔48。电介体47为陶瓷或玻璃等绝缘材料,因此,能使得引线12与金属制等离子发生室41绝缘,对引线12进行导向。例如,引线12直径为20~30μm场合,电介体47的导向孔48的直径可以为100~200μm。在电介体47的侧方设有使得气体供给喷嘴42和导向孔48连通的气体供给孔49。电介体47既可以一体构成,也可以例如沿引线12的插入穿通方向分割为复数构成。与上述参考例、实施形态相同,不锈钢等金属制的等离子发生室41通过电力线与高频电力供给部32连接,引线12通过图1所示的卷线筒28接地。
说明这样构成的引线清洗导向装置31的动作。从等离子用气体供给部34通过气体供给喷嘴42及气体供给孔49供给电介体47的导向孔48的等离子用气体在气孔48中朝着卷线筒侧及毛细管侧流动。并且,若从合适的高频电力供给部32向等离子发生室41供给合适的高频电力,则将等离子发生室41和引线12作为两电极,在电介体47的导向孔48内部,等离子用气体被等离子化,生成等离子300。供给的高频电力大小根据电介体47的电介率及供给的等离子用气体的流量、种类等适当选择。所生成的等离子300在电介体47的导向孔48内部从全周方向大致均等地与引线12冲突,从全周方向清洗附着在引线12外表面的异物。包含从引线12表面除去的异物的引线清洗后的气体,从电介体47的导向孔48朝卷线筒侧及毛细管侧流出。本参考例具有与上述说明的第一参考例相同的效果。
参照图7说明第二实施形态。与参照图1-图6说明的参考例、实施形态相同部分标以相同符号,说明省略。本实施形态中,在电介体47的卷线筒侧设有孔径大的卷线筒侧导向孔48a,在毛细管侧设有孔径比卷线筒侧导向孔48a小的毛细管侧导向孔48b。从气体供给喷嘴42流入各导向孔48a,48b的等离子用气体将等离子发生室41和引线12作为两电极,被等离子化,生成等离子300。等离子300除去引线12表面异物,朝卷线筒侧及毛细管侧流出。与上述说明的第一实施形态相同,由于卷线筒侧导向孔48a直径比毛细管侧导向孔48b大,清洗后气体流量也大,因此,引线12因该气流朝卷线筒侧受到力,因该力在引线12上施加张力。该张力使得通过各导向孔48a,48b中的引线12保持直线状。并且,引线12通过毛细管16成形为所定形状,连接在半导体芯片15和引脚框14之间。本实施形态具有与上述说明的第一实施形态相同的效果。
参照图8说明第三实施形态。与参照图1-图7说明的参考例、实施形态相同部分标以相同符号,说明省略。如图8所示,在本实施形态中,在等离子发生室41内部设有用于将引线12保持在插入穿通方向的保持线圈51。其他结构与上述说明的第一实施形态相同。保持线圈51由陶瓷或玻璃等电介质部件构成,使得引线12贯穿形成在该线圈中心的孔。通过这样构成,保持引线12位置不因等离子用气流发生变化,能使得引线12和等离子发生室41之间的离开距离成为一定,具有能使得等离子发生更稳定化的效果。即使在本实施形态中,也可以使得卷线筒侧的绝缘套43的导向孔44大小比毛细管侧的绝缘套45的导向孔46大,在引线12上施加朝着卷线筒侧的张力。
参照图9说明第四实施形态。与参照图1-图8说明的参考例、实施形态相同部分标以相同符号,说明省略。如图9所示,在本实施形态的引线清洗导向装置31中,在不锈钢等金属制的等离子发生室41的卷线筒侧和毛细管侧安装等离子空间分隔部件65,在卷线筒侧的等离子空间分隔部件65安装由绝缘体构成的卷线筒侧盖53,在毛细管侧的等离子空间分隔部件65安装由绝缘体构成的毛细管侧盖56。各等离子空间分隔部件65通过其中心的等离子衰减孔66使得等离子发生室41中被等离子化的气体等离子衰减,不使得在等离子发生室41发生的等离子300扩散到卷线筒侧盖53及毛细管侧盖56内部,构成为能分隔等离子发生室41内部的等离子区域和外部区域。引线12插入穿通等离子衰减孔66。在盖53中心设有小孔55,在盖56中心设有小孔58,分别用于插入穿通引线12,在各盖53,56的侧面,设有用于排出清洗后气体的排气喷嘴54,57。
各盖53,56中心的各小孔55,58构成为与引线12之间具有微小间隙,对引线12滑动自如地进行导向,引线12能沿送进方向移动,从引线12和各盖53,56之间气体泄漏变少。各等离子空间分隔部件65的等离子衰减孔66在内径变小的部位可以使得等离子衰减,各等离子衰减孔朝着卷线筒侧扩展形成锥状,使得引线12容易插入穿通。又,锥面表面成为平滑结构,以便能插入柔性引线12。
在本实施形态中,从气体供给喷嘴42供给等离子发生室41的等离子用气体在内部成为等离子300,清洗引线12表面。等离子发生室41内部产生的等离子300通过各等离子空间分隔部件65的等离子衰减孔66衰减后,成为清洗后气体,从各盖53,56的排气喷嘴54,57排出到等离子发生室41的外部。各盖53,56与引线12之间成为微小间隙,因此,清洗后气体从该部分的排出量非常少,大部分的清洗后气体从排气喷嘴54,57排出。
在排出的清洗后气体中含有因清洗从引线12除去的氧化膜及有机物粒子,因此,若就这样排出到接合装置周边,则含在清洗后气体中的粒子有时会附着到接合装置等上,导致接合质量低下。于是,如图9所示,在本实施形态中,对清洗后气体实行再处理,通过再使用气体循环净化方式处理清洗后气体。气体供给管35与等离子发生室41的气体供给喷嘴42连接,所述气体供给管35供给储存在缓冲罐73中的作为等离子用气体的氩气,在气体供给管35安装等离子用气体的升压用泵74及流量计75。等离子发生室41的各盖53,56的各排气喷嘴54,57分别与排气配管80,81连接。在排气配管80安装压力计79,各排气配管80,81与过滤器76的入口管82连接。过滤器76的出口管83与压缩机77连接,压缩机77与缓冲罐73连接。又,气体补充管78与缓冲罐73连接,在气体补充管78上设有减压阀71及关闭阀72,所述减压阀71对储气瓶84的氩气进行减压,所述关闭阀72用于关闭供给气体。
通过泵74对储存在缓冲罐73中的等离子用气体进行加压,从气体供给喷嘴42向等离子发生室41供给所定流量。通过流量计75测定流量,调整泵74的回转数等使得成为所定流量。流入等离子发生室41的等离子用气体通过通电高频电力,被等离子化,成为等离子300,清洗引线12后,成为清洗后气体从排气喷嘴54,57排出。通过压力计79监视排出气体压力,调整等离子用气体流量,使得排气压力比大气压高,不使空气进入系统内。排出的清洗后气体通过排气配管80,81,从入口管82流入过滤器76。过滤器76具有从清洗后气体除去氧化膜及有机物粒子的功能,所述氧化膜及有机物粒子是从引线12除去的。例如,如图9所示,可以采用在罐中使得流速减慢,使得重量重的粒子分离到下部那样的形式,也可以是纤维状过滤器,也可以将它们组合。通过过滤器76除去氧化膜及有机物粒子的气体由压缩机77加压,流入缓冲罐73,作为等离子用气体再使用。若使用该循环系统,从储气瓶84将等离子用气体减压,供给缓冲罐73一次,此后能不供给气体地持续运转,但是,当存在气体从系统泄漏场合,打开关闭阀72,从储气瓶84向缓冲罐73补充氩气。在本实施形态中,以使用氩气作为等离子用气体场合进行说明,但是,并不局限于此,例如也可以使用氮气或其他惰性气体。另外,在缓冲罐73也可以根据附着在引线12表面的异物,以适当的混合比混合还原性气体或氧化性气体,供给等离子发生室41。在本实施形态中,对于从储气瓶84供给等离子用气体场合进行说明,但是,并不局限于从储气瓶84供给,也可以例如构成为从外部通过专用配管进行供给。混合还原性气体或氧化性气体场合,各气体可以从另一储气瓶供给,也可以另外设置专用配管供给。
本实施形态除了第一,第二参考例的效果,还具有以下效果:由于从引线清洗导向装置31排出的清洗后气体排出到引线接合装置11周边的量非常少,能将引线接合装置11周围保持清洁的环境,能提高焊接质量。又,具有通过使用气体循环方式能再使用气体、减少等离子用气体使用量的效果。
上面参照附图说明了本发明的实施例,但本发明并不局限于上述实施形态。在本发明技术思想范围内可以作种种变更,它们都属于本发明的保护范围。
在本实施形态中,说明气体循环净化方式,但是,本发明并不局限于此,可以例如使得排气配管与排气喷嘴54,57连接,排出到设置接合装置的建筑物外部等,也可以将清洗后气体储存在排气罐等后废弃等,将引线接合装置11周围保持清洁的环境。
在上述参考例,实施形态中,对于将本发明适用引线接合装置11场合进行说明,但是,不仅引线接合装置11,本发明也能适用于冲击接合装置等使用引线的其他接合装置。
Claims (4)
1.一种引线清洗导向装置,设有等离子发生室,供给等离子用气体,向等离子发生室和通过其中的引线之间通电,在等离子发生室的内部使得等离子用气体等离子化,通过等离子化气体清洗引线,该引线为接合用引线,沿送进方向对引线进行导向同时清洗引线,其特征在于:
等离子发生室安装在引线输出部和焊接工具之间,在引线输出部侧及焊接工具侧各包含沿送进方向对引线进行导向的导向孔;
使得引线输出部侧导向孔的直径比焊接工具侧导向孔的直径大,以便使得从引线输出部侧的导向孔和引线之间流出的引线清洗后的气体流量比从焊接工具侧的导向孔和引线之间流出的引线清洗后的气体流量多。
2.一种引线清洗导向装置,设有等离子发生室,供给等离子用气体,向等离子发生室和通过其中的引线之间通电,在等离子发生室的内部使得等离子用气体等离子化,通过等离子化气体清洗引线,该引线为接合用引线,沿送进方向对引线进行导向同时清洗引线,其特征在于,等离子发生室安装在引线输出部和焊接工具之间,等离子发生室包括:
等离子空间分隔部件,设在引线输出部侧及焊接工具侧,包含等离子衰减孔,引线插入穿通所述等离子衰减孔,同时使得等离子衰减;
二个盖,各包含导向孔及气体排出喷嘴,所述导向孔设在各等离子空间分隔部件的引线输出部侧及焊接工具侧,沿送进方向对引线进行导向,所述气体排出喷嘴从等离子发生室排出引线清洗后气体。
3.根据权利要求2中所述的引线清洗导向装置,其特征在于:
包括气体净化机构,该气体净化机构设有:
过滤器,用于除去从气体排出喷嘴排出的引线清洗后的气体中的异物;
再循环流路,将通过所述过滤器的气体作为等离子发生用气体再供给等离子发生室。
4.根据权利要求1-3中任一项所述的引线清洗导向装置,其特征在于:
包括电介质构成的保持线圈,沿引线送进方向设在等离子发生室内部,引线插入穿通其中心孔。
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CN101246827A (zh) | 2008-08-20 |
KR100960027B1 (ko) | 2010-05-28 |
US20080197168A1 (en) | 2008-08-21 |
JP4700633B2 (ja) | 2011-06-15 |
US8283593B2 (en) | 2012-10-09 |
TWI358778B (zh) | 2012-02-21 |
TW200837857A (en) | 2008-09-16 |
JP2008198886A (ja) | 2008-08-28 |
KR20080076732A (ko) | 2008-08-20 |
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