JP5683644B2 - ワイヤボンディング装置 - Google Patents
ワイヤボンディング装置 Download PDFInfo
- Publication number
- JP5683644B2 JP5683644B2 JP2013126411A JP2013126411A JP5683644B2 JP 5683644 B2 JP5683644 B2 JP 5683644B2 JP 2013126411 A JP2013126411 A JP 2013126411A JP 2013126411 A JP2013126411 A JP 2013126411A JP 5683644 B2 JP5683644 B2 JP 5683644B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- plasma
- bonding
- cleaning
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004140 cleaning Methods 0.000 claims description 50
- 239000007921 spray Substances 0.000 claims description 2
- 239000007789 gas Substances 0.000 description 38
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 18
- 229910052786 argon Inorganic materials 0.000 description 9
- 239000011261 inert gas Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 230000013011 mating Effects 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052756 noble gas Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7801—Means for cleaning, e.g. brushes, for hydro blasting, for ultrasonic cleaning, for dry ice blasting, using gas-flow, by etching, by applying flux or plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
Claims (2)
- 基体部と、
ボンディングツールを前記基体部に対してXYZ方向に移動させるボンディングヘッドと、
前記基体部に取り付けられ、前記ボンディングツールにワイヤを供給するワイヤスプールと、
前記基体部に取り付けられ、前記ワイヤスプールから供給される前記ワイヤを直線方向にガイドする少なくとも2つのワイヤガイドと、を含むワイヤボンディング装置であって、
前記各ワイヤガイドの間の前記ワイヤの側面に向かって一方向から大気開放状態で洗浄用プラズマジェットを吹き付ける洗浄プラズマユニットを備えるワイヤボンディング装置。 - 基体部と、
ボンディングツールを前記基体部に対してXYZ方向に移動させるボンディングヘッドと、
前記基体部に取り付けられ、前記ボンディングツールにワイヤを供給するワイヤスプールと、を含むワイヤボンディング装置であって、
前記ボンディングヘッドに取り付けられ、前記ワイヤの側面に向かって一方向から大気開放状態で洗浄用プラズマジェットを吹き付ける洗浄プラズマユニットを備えるワイヤボンディング装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013126411A JP5683644B2 (ja) | 2013-06-17 | 2013-06-17 | ワイヤボンディング装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013126411A JP5683644B2 (ja) | 2013-06-17 | 2013-06-17 | ワイヤボンディング装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012023722A Division JP5296233B2 (ja) | 2012-02-07 | 2012-02-07 | ワイヤボンディング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013179367A JP2013179367A (ja) | 2013-09-09 |
JP5683644B2 true JP5683644B2 (ja) | 2015-03-11 |
Family
ID=49270659
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013126411A Active JP5683644B2 (ja) | 2013-06-17 | 2013-06-17 | ワイヤボンディング装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5683644B2 (ja) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060219754A1 (en) * | 2005-03-31 | 2006-10-05 | Horst Clauberg | Bonding wire cleaning unit and method of wire bonding using same |
JP4700633B2 (ja) * | 2007-02-15 | 2011-06-15 | 株式会社新川 | ワイヤ洗浄ガイド |
JP4228024B1 (ja) * | 2007-12-07 | 2009-02-25 | 株式会社新川 | ワイヤボンディング装置及びワイヤボンディング方法 |
JP4852521B2 (ja) * | 2007-12-07 | 2012-01-11 | 株式会社新川 | ボンディング装置及びボンディング方法 |
JP4369507B2 (ja) * | 2007-12-07 | 2009-11-25 | 株式会社新川 | ボンディング装置及びボンディング方法 |
KR20100081068A (ko) * | 2009-01-05 | 2010-07-14 | 삼성전기주식회사 | 플라즈마 발생장치 |
-
2013
- 2013-06-17 JP JP2013126411A patent/JP5683644B2/ja active Active
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Publication number | Publication date |
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JP2013179367A (ja) | 2013-09-09 |
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