CN100580871C - 基板清洗装置和基板清洗方法 - Google Patents

基板清洗装置和基板清洗方法 Download PDF

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Publication number
CN100580871C
CN100580871C CN200710160027A CN200710160027A CN100580871C CN 100580871 C CN100580871 C CN 100580871C CN 200710160027 A CN200710160027 A CN 200710160027A CN 200710160027 A CN200710160027 A CN 200710160027A CN 100580871 C CN100580871 C CN 100580871C
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China
Prior art keywords
substrate
cleaning
back side
holding unit
unit
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CN200710160027A
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Chinese (zh)
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CN101207007A (zh
Inventor
泷口靖史
山本太郎
藤本昭浩
锦户修一
熊谷大
吉高直人
北野高广
德永容一
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication of CN101207007A publication Critical patent/CN101207007A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0057—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by ultraviolet radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/50—Cleaning of wafers, substrates or parts of devices characterised by the part to be cleaned
    • H10P70/56—Cleaning of wafer backside
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Liquid Crystal (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN200710160027A 2006-12-20 2007-12-20 基板清洗装置和基板清洗方法 Active CN100580871C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006343309 2006-12-20
JP2006343309 2006-12-20
JP2007303453 2007-11-22

Publications (2)

Publication Number Publication Date
CN101207007A CN101207007A (zh) 2008-06-25
CN100580871C true CN100580871C (zh) 2010-01-13

Family

ID=39567093

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200710160027A Active CN100580871C (zh) 2006-12-20 2007-12-20 基板清洗装置和基板清洗方法

Country Status (4)

Country Link
JP (3) JP4983565B2 (https=)
KR (1) KR101061912B1 (https=)
CN (1) CN100580871C (https=)
TW (2) TWI390590B (https=)

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CN101447415A (zh) * 2008-12-19 2009-06-03 上海集成电路研发中心有限公司 半导体硅片清洗装置及其清洗方法
JP5349944B2 (ja) * 2008-12-24 2013-11-20 株式会社荏原製作所 基板処理装置の液飛散防止カップ、基板処理装置、及びその運転方法
JP5254120B2 (ja) * 2009-04-22 2013-08-07 東京エレクトロン株式会社 液処理装置および液処理方法
JP2010287686A (ja) * 2009-06-10 2010-12-24 Tokyo Electron Ltd 塗布、現像装置及び基板の裏面洗浄方法。
CN102211095B (zh) * 2010-04-02 2013-11-06 中芯国际集成电路制造(上海)有限公司 一种晶片清洗方法
JP5397399B2 (ja) * 2010-07-09 2014-01-22 東京エレクトロン株式会社 塗布、現像装置
CN102357477B (zh) * 2011-09-23 2013-10-02 北京七星华创电子股份有限公司 防污染装置
JP5637974B2 (ja) * 2011-11-28 2014-12-10 東京エレクトロン株式会社 基板洗浄装置及び基板洗浄方法
CN103506339B (zh) * 2012-06-28 2017-04-19 盛美半导体设备（上海）有限公司 晶圆背面清洗装置及清洗方法
CN102779772A (zh) * 2012-07-16 2012-11-14 北京七星华创电子股份有限公司 晶片背面清洗装置
JP5887227B2 (ja) * 2012-08-07 2016-03-16 株式会社荏原製作所 ドレッサーディスク洗浄用ブラシ、洗浄装置及び洗浄方法
JP6001961B2 (ja) * 2012-08-29 2016-10-05 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置および基板処理方法
JP5973901B2 (ja) * 2012-12-13 2016-08-23 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法
JP5904169B2 (ja) * 2013-07-23 2016-04-13 東京エレクトロン株式会社 基板洗浄装置、基板洗浄方法及び記憶媒体
JP6210935B2 (ja) 2013-11-13 2017-10-11 東京エレクトロン株式会社 研磨洗浄機構、基板処理装置及び基板処理方法
JP6415662B2 (ja) * 2013-11-13 2018-10-31 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP6442582B2 (ja) * 2014-03-05 2018-12-19 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記録媒体
JP6600470B2 (ja) 2014-04-01 2019-10-30 株式会社荏原製作所 洗浄装置及び洗浄方法
JP2016051727A (ja) * 2014-08-28 2016-04-11 東京エレクトロン株式会社 基板処理方法、基板処理装置及び記録媒体
JP6386424B2 (ja) 2015-08-06 2018-09-05 東芝メモリ株式会社 半導体製造装置および半導体装置の製造方法
JP6552931B2 (ja) * 2015-09-18 2019-07-31 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP6671459B2 (ja) * 2016-03-22 2020-03-25 東京エレクトロン株式会社 基板洗浄装置
JP6740066B2 (ja) * 2016-09-13 2020-08-12 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置、基板処理装置および基板洗浄方法
JP6783624B2 (ja) * 2016-10-27 2020-11-11 株式会社ディスコ 洗浄装置
TWI821887B (zh) * 2016-11-29 2023-11-11 日商東京威力科創股份有限公司 基板處理裝置、基板處理方法及記錄媒體
KR102185140B1 (ko) * 2016-12-28 2020-12-01 시바우라 메카트로닉스 가부시키가이샤 기판 처리 장치 및 기판 처리 방법
US10410936B2 (en) 2017-05-19 2019-09-10 Illinois Tool Works Inc. Methods and apparatuses for effluent monitoring for brush conditioning
CN109426085A (zh) * 2017-08-25 2019-03-05 台湾积体电路制造股份有限公司 用于清洁光刻设备的集光镜的装置及方法
JP7148349B2 (ja) * 2017-11-14 2022-10-05 株式会社荏原製作所 基板処理装置および基板処理方法
KR102628175B1 (ko) * 2017-11-14 2024-01-23 가부시키가이샤 에바라 세이사꾸쇼 기판 처리 장치 및 기판 처리 방법
TWI834489B (zh) * 2017-12-13 2024-03-01 日商東京威力科創股份有限公司 基板處理裝置
CN109031717A (zh) * 2018-08-10 2018-12-18 昆山弘锦威电子有限公司 Tft-lcd模块的加工工艺
JP7222721B2 (ja) * 2019-01-17 2023-02-15 株式会社ディスコ 洗浄機構
CN110148573B (zh) * 2019-04-17 2020-12-04 湖州达立智能设备制造有限公司 一种半导体设备工艺腔的晶圆升降装置
CN110459493B (zh) * 2019-08-21 2022-03-22 北京北方华创微电子装备有限公司 抽真空腔室及抽真空方法
WO2021053995A1 (ja) * 2019-09-17 2021-03-25 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置
CN111085954A (zh) * 2019-12-24 2020-05-01 深圳市华星光电半导体显示技术有限公司 基板吸附装置
JP7504421B2 (ja) * 2020-02-28 2024-06-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
KR102835055B1 (ko) * 2020-04-09 2025-07-18 주식회사 제우스 기판처리장치
TWI718078B (zh) * 2020-07-13 2021-02-01 環球晶圓股份有限公司 晶片承載裝置
TWI781763B (zh) * 2020-09-18 2022-10-21 日商斯庫林集團股份有限公司 基板洗淨裝置及基板洗淨方法
JP7491805B2 (ja) * 2020-10-05 2024-05-28 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法
CN112051679A (zh) * 2020-10-15 2020-12-08 深圳市金晓时代科技有限公司 一种液晶显示屏的制程设备及其制程工艺
JP7635572B2 (ja) 2021-02-22 2025-02-26 東京エレクトロン株式会社 基板洗浄方法及び基板洗浄装置
JP7730272B2 (ja) * 2021-07-05 2025-08-27 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置および基板洗浄方法
JP7740832B2 (ja) * 2021-11-18 2025-09-17 東京エレクトロン株式会社 加工装置、及び加工方法
US11688600B1 (en) * 2021-12-03 2023-06-27 Pulseforge, Inc. Method and apparatus for removing particles from the surface of a semiconductor wafer
JP2023173836A (ja) * 2022-05-26 2023-12-07 東京エレクトロン株式会社 基板洗浄装置及び基板洗浄方法
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Also Published As

Publication number Publication date
JP2008177541A (ja) 2008-07-31
KR20080058223A (ko) 2008-06-25
JP2012191215A (ja) 2012-10-04
TW200841378A (en) 2008-10-16
KR101061912B1 (ko) 2011-09-02
TWI390589B (zh) 2013-03-21
JP5641110B2 (ja) 2014-12-17
TW201250771A (en) 2012-12-16
JP5348277B2 (ja) 2013-11-20
JP2014017499A (ja) 2014-01-30
TWI390590B (zh) 2013-03-21
JP4983565B2 (ja) 2012-07-25
CN101207007A (zh) 2008-06-25

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