CN100576069C - 可辐射固化树脂组合物及利用该组合物的快速成型方法 - Google Patents

可辐射固化树脂组合物及利用该组合物的快速成型方法 Download PDF

Info

Publication number
CN100576069C
CN100576069C CN03810052A CN03810052A CN100576069C CN 100576069 C CN100576069 C CN 100576069C CN 03810052 A CN03810052 A CN 03810052A CN 03810052 A CN03810052 A CN 03810052A CN 100576069 C CN100576069 C CN 100576069C
Authority
CN
China
Prior art keywords
radiation
weight
composition
component
hardenable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN03810052A
Other languages
English (en)
Chinese (zh)
Other versions
CN1650231A (zh
Inventor
J·C·蒂斯
A·J·A·A·迪亚斯
J·A·劳顿
D·L·温米尔
J·许
X·姚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Covestro Netherlands BV
Original Assignee
Dsm Ip Property Co ltd
Dsmip Property Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dsm Ip Property Co ltd, Dsmip Property Co ltd filed Critical Dsm Ip Property Co ltd
Publication of CN1650231A publication Critical patent/CN1650231A/zh
Application granted granted Critical
Publication of CN100576069C publication Critical patent/CN100576069C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00—Materials specially adapted for additive manufacturing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/06—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0037—Production of three-dimensional images
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Epoxy Resins (AREA)
  • Polyethers (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Graft Or Block Polymers (AREA)
CN03810052A 2002-05-03 2003-05-01 可辐射固化树脂组合物及利用该组合物的快速成型方法 Expired - Lifetime CN100576069C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US37723902P 2002-05-03 2002-05-03
US60/377,239 2002-05-03

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN200910224789A Division CN101706639A (zh) 2002-05-03 2003-05-01 可辐射固化树脂组合物及利用该组合物的快速成型方法

Publications (2)

Publication Number Publication Date
CN1650231A CN1650231A (zh) 2005-08-03
CN100576069C true CN100576069C (zh) 2009-12-30

Family

ID=29401462

Family Applications (2)

Application Number Title Priority Date Filing Date
CN03810052A Expired - Lifetime CN100576069C (zh) 2002-05-03 2003-05-01 可辐射固化树脂组合物及利用该组合物的快速成型方法
CN200910224789A Pending CN101706639A (zh) 2002-05-03 2003-05-01 可辐射固化树脂组合物及利用该组合物的快速成型方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN200910224789A Pending CN101706639A (zh) 2002-05-03 2003-05-01 可辐射固化树脂组合物及利用该组合物的快速成型方法

Country Status (8)

Country Link
US (3) US7183040B2 (enExample)
EP (2) EP1502155B1 (enExample)
JP (2) JP2005529200A (enExample)
KR (3) KR20120086737A (enExample)
CN (2) CN100576069C (enExample)
AU (1) AU2003224516A1 (enExample)
ES (1) ES2405107T3 (enExample)
WO (1) WO2003093901A1 (enExample)

Families Citing this family (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0212062D0 (en) * 2002-05-24 2002-07-03 Vantico Ag Jetable compositions
US20040077745A1 (en) * 2002-10-18 2004-04-22 Jigeng Xu Curable compositions and rapid prototyping process using the same
US20040137368A1 (en) * 2003-01-13 2004-07-15 3D Systems, Inc. Stereolithographic resins containing selected oxetane compounds
US20050040564A1 (en) * 2003-08-18 2005-02-24 Jones Oliver Systems and methods for using norbornene based curable materials
WO2005021248A1 (ja) * 2003-08-27 2005-03-10 Fuji Photo Film Co., Ltd. 三次元造形物の製造方法
US7232850B2 (en) * 2003-10-03 2007-06-19 Huntsman Advanced Materials Americas Inc. Photocurable compositions for articles having stable tensile properties
US20070149667A1 (en) * 2003-10-16 2007-06-28 Dsm Ip Assets B.V. Curable compositions and rapid prototyping process using the same
WO2005045525A1 (en) * 2003-11-06 2005-05-19 Dsm Ip Assets B.V. Curable compositions and rapid prototyping process using the same
CN1886438A (zh) * 2003-12-02 2006-12-27 帝斯曼知识产权资产管理有限公司 阻燃可辐射固化组合物
US20070267134A1 (en) * 2004-09-03 2007-11-22 Konarski Mark M Photoinitiated Cationic Epoxy Compositions
SE529306C2 (sv) 2005-03-18 2007-06-26 Perstorp Specialty Chem Ab Ultravioletthärdande hartskomposition
JP4702784B2 (ja) * 2005-08-08 2011-06-15 ソニー株式会社 液体吐出型記録ヘッドの流路構成材料
US7279210B2 (en) * 2005-09-07 2007-10-09 3M Innovative Properties Company Curable compositions, methods of making and using the same, and articles therefrom
WO2007031505A1 (en) 2005-09-13 2007-03-22 Huntsman Advanced Materials (Switzerland) Gmbh Photocurable compositions for preparing abs-like articles
EP1939234B2 (en) * 2005-09-29 2018-04-11 Cmet Inc. Resin composition for optical three-dimensional molded object
US8334025B2 (en) * 2005-10-27 2012-12-18 3D Systems, Inc. Antimony-free photocurable resin composition and three dimensional article
JP5068454B2 (ja) * 2005-12-06 2012-11-07 富士フイルム株式会社 インク組成物、インクジェット記録方法、印刷物、平版印刷版の製造方法、及び平版印刷版
JP5280615B2 (ja) * 2006-06-16 2013-09-04 シーメット株式会社 光学的立体造形用樹脂組成物
JP2008024871A (ja) * 2006-07-24 2008-02-07 Fujifilm Corp インク組成物、インクジェット記録方法、印刷物、平版印刷版の製造方法、及び平版印刷版
US20080103226A1 (en) 2006-10-31 2008-05-01 Dsm Ip Assets B.V. Photo-curable resin composition
CN101631832A (zh) * 2007-03-14 2010-01-20 亨斯迈先进材料（瑞士）有限公司 用于制备类似abs的制品的可光固化组合物
WO2008115057A1 (en) 2007-03-20 2008-09-25 Dsm Ip Assets B.V. Stereolithography resin compositions and three-dimensional objects made therefrom
US20090004579A1 (en) * 2007-06-27 2009-01-01 Dsm Ip Assets B.V. Clear and colorless three-dimensional articles made via stereolithography and method of making said articles
JP5881948B2 (ja) * 2007-11-27 2016-03-09 スリーディー システムズ インコーポレーテッド 高透明性を有する三次元物品を製造するための光硬化型樹脂組成物
JP5210645B2 (ja) * 2008-01-25 2013-06-12 シーメット株式会社 光学的立体造形用樹脂組成物
JP5284833B2 (ja) * 2008-03-31 2013-09-11 富士フイルム株式会社 フォトスペーサーの製造方法
JP5446902B2 (ja) * 2009-03-05 2014-03-19 Ｄｉｃ株式会社 カチオン重合性接着剤及びそれを用いて得られた偏光板
KR101714798B1 (ko) 2009-03-13 2017-03-09 디에스엠 아이피 어셋츠 비.브이. 방사선-경화성 수지 조성물 및 이를 이용한 쾌속 3차원 이미지화 방법
US11725395B2 (en) 2009-09-04 2023-08-15 Välinge Innovation AB Resilient floor
US8365499B2 (en) 2009-09-04 2013-02-05 Valinge Innovation Ab Resilient floor
KR20120058554A (ko) 2009-09-04 2012-06-07 뵈린게 이노베이션 에이비이 기계식 잠금 시스템을 구비하는 탄성 바닥판 조립 방법
PL2524090T3 (pl) 2010-01-11 2022-06-13 Välinge Innovation AB Pokrycie powierzchni z konstrukcją blokującą
CN102385250A (zh) * 2011-06-29 2012-03-21 南昌大学 一种紫外激光固化快速成型光敏树脂及制备方法
JP5843508B2 (ja) * 2011-07-21 2016-01-13 Jsr株式会社 光学的立体造形用放射線硬化性液状樹脂組成物、及びそれを光硬化させて得られる光造形物
RS59933B1 (sr) 2011-08-29 2020-03-31 Ceraloc Innovation Ab Mehanički sistem za blokiranje namenjen za podne panele
JP2014048556A (ja) * 2012-09-03 2014-03-17 Sumitomo Chemical Co Ltd 感光性樹脂組成物
UA111803C2 (uk) * 2012-10-05 2016-06-10 Кроноплюс Текнікал Аг Підлогова панель для зовнішнього застосування
CN102981362A (zh) * 2012-11-14 2013-03-20 南昌大学 4,5-环氧环己烷-1,2-二甲酸二缩水甘油酯作为预聚物制备立体光刻快速成型光敏树脂的方法及应用
EP3358101B1 (en) 2013-03-25 2019-11-06 Välinge Innovation AB Floorboards provided with a mechanical locking system and a method to produce such a locking system
CN104345562B (zh) 2013-08-09 2020-04-24 帝斯曼知识产权资产管理有限公司 用于增材制造的低粘度液体辐射可固化的牙对准器模具树脂组合物
JP6399084B2 (ja) * 2014-03-14 2018-10-03 コニカミノルタ株式会社 ３ｄ造形用光硬化性組成物および３ｄ造形物の製造方法
AU2015309679B2 (en) 2014-08-29 2020-01-16 Välinge Innovation AB Vertical joint system for a surface covering panel
JP6205522B2 (ja) * 2015-03-26 2017-09-27 東京応化工業株式会社 ネガ型感光性組成物、パターン形成方法
US10837181B2 (en) 2015-12-17 2020-11-17 Valinge Innovation Ab Method for producing a mechanical locking system for panels
CN108779321B (zh) * 2016-03-30 2021-04-02 株式会社Adeka 固化性组合物、固化物的制造方法、及其固化物
ES3007336T3 (en) 2016-09-30 2025-03-19 Vaelinge Innovation Ab Set of panels assembled by vertical displacement and locked together in the vertical and horizontal direction
EP3315292A1 (en) * 2016-10-28 2018-05-02 DSM IP Assets B.V. Thermosetting compositions and forming three-dimensional objects therefrom
JP7701780B2 (ja) 2016-10-28 2025-07-02 ストラタシス，インコーポレイテッド 熱硬化性組成物及びそれからの三次元物体の形成
US11945152B2 (en) * 2017-03-06 2024-04-02 Maxell, Ltd. Model material ink set, support material composition, ink set, three-dimensional shaped object, and method for manufacturing three-dimensional shaped object
JP7020495B2 (ja) * 2017-04-28 2022-02-16 エルジー・ケム・リミテッド シール材組成物
PL3687949T3 (pl) 2017-11-03 2024-11-04 Covestro (Netherlands) B.V. Układy blokujące wodę zawierające włókna powleczone ciekłymi, utwardzanymi promieniowaniem kompozycjami sap
JP7215654B2 (ja) 2017-12-15 2023-01-31 コベストロ （ネザーランズ） ビー．ブイ． 粘性熱硬化性樹脂を高温噴射して、積層造形を介して固体物品を作製するための組成物及び方法
TWI692502B (zh) 2017-12-29 2020-05-01 法商阿科瑪法國公司 可固化組成物
CA3086053A1 (en) 2018-01-09 2019-07-18 Valinge Innovation Ab Set of panels
JP2021516180A (ja) * 2018-03-02 2021-07-01 フォームラブス, インコーポレーテッドFormlabs, Inc. 潜在性硬化樹脂および関連する方法
US10793735B2 (en) * 2018-03-15 2020-10-06 Ricoh Company, Ltd. Curable composition, curable ink, storing container, two-dimensional or three-dimensional image forming device, two-dimensional or three-dimensional image forming method, cured product, printed matter, and adhesive label
WO2020003133A1 (en) * 2018-06-29 2020-01-02 3M Innovative Properties Company Hydrated orthodontic articles, kits, and methods of making same
CN111624853B (zh) * 2019-07-10 2023-07-14 住华科技股份有限公司 着色树脂组成物、及应用其的彩色滤光片和显示设备
EP4117892A4 (en) * 2020-03-09 2023-11-22 Hewlett-Packard Development Company, L.P. THREE-DIMENSIONAL PRINTING WITH A CHARGED YELLOW WATER-SOLUBLE DYE-BASED FLUID
SE545292C2 (en) * 2020-07-08 2023-06-20 Perstorp Ab A radiation curable composition comprising a biobased reactive diluent
EP4206820A1 (en) 2021-12-30 2023-07-05 Arkema France Hybrid photocurable composition

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5621497A (en) * 1994-04-06 1997-04-15 Hitachi, Ltd. Pattern forming method and projection exposure tool therefor
CN1199507A (zh) * 1996-08-27 1998-11-18 精工爱普生株式会社 剥离方法、薄膜器件的转移方法以及使用该方法制造的薄膜器件、薄膜集成电路装置和液晶显示装置
US5858620A (en) * 1996-07-05 1999-01-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and method for manufacturing the same
CN1307694A (zh) * 1998-06-11 2001-08-08 陶氏化学公司 可光固化弹性组合物
CN1078357C (zh) * 1994-01-25 2002-01-23 奥托里夫Asp股份有限公司 具有联合增稠剂的带水光刻胶

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3835003A (en) * 1968-08-20 1974-09-10 American Can Co Photopolymerization of oxetanes
US3708296A (en) * 1968-08-20 1973-01-02 American Can Co Photopolymerization of epoxy monomers
PT71476A (en) 1979-07-03 1980-08-01 Sagami Chem Res Process for producing oxygen-containing hydrocarbon compounds
US4339567A (en) 1980-03-07 1982-07-13 Ciba-Geigy Corporation Photopolymerization by means of sulphoxonium salts
US4383025A (en) 1980-07-10 1983-05-10 Ciba-Geigy Corporation Photopolymerization by means of sulfoxonium salts
US4398014A (en) 1980-11-04 1983-08-09 Ciba-Geigy Corporation Sulfoxonium salts and their use as polymerization catalysts
EP0094914B1 (de) 1982-05-19 1986-09-24 Ciba-Geigy Ag Photopolymerisation mittels organometallischer Salze
DE3369398D1 (en) 1982-05-19 1987-02-26 Ciba Geigy Ag Curable compositions containing metallocen complexes, activated primers obtained therefrom and their use
ATE37242T1 (de) 1984-02-10 1988-09-15 Ciba Geigy Ag Verfahren zur herstellung einer schutzschicht oder einer reliefabbildung.
GB8414525D0 (en) 1984-06-07 1984-07-11 Ciba Geigy Ag Sulphoxonium salts
US4694029A (en) * 1985-04-09 1987-09-15 Cook Paint And Varnish Company Hybrid photocure system
US4772530A (en) 1986-05-06 1988-09-20 The Mead Corporation Photosensitive materials containing ionic dye compounds as initiators
US4772541A (en) 1985-11-20 1988-09-20 The Mead Corporation Photohardenable compositions containing a dye borate complex and photosensitive materials employing the same
DE3677527D1 (de) 1985-11-20 1991-03-21 Mead Corp Ionische farbstoffe als initiatoren enthaltende fotosensitive materialien.
US4751102A (en) 1987-07-27 1988-06-14 The Mead Corporation Radiation-curable ink and coating compositions containing ionic dye compounds as initiators
US5002856A (en) 1989-08-02 1991-03-26 E. I. Du Pont De Nemours And Company Thermally stable carbazole diazonium salts as sources of photo-initiated strong acid
TW269017B (enExample) 1992-12-21 1996-01-21 Ciba Geigy Ag
US5665792A (en) 1995-06-07 1997-09-09 E. I. Du Pont De Nemours And Company Stabilizers for use with photoacid precursor formulations
WO1996041237A1 (en) 1995-06-07 1996-12-19 E.I. Du Pont De Nemours And Company Sensitizers and photoacid precursors
JP3161583B2 (ja) * 1995-07-21 2001-04-25 東亞合成株式会社 活性エネルギー線硬化型組成物
JP3849989B2 (ja) * 1996-04-09 2006-11-22 株式会社Ａｄｅｋａ 光学的立体造形用樹脂組成物および光学的立体造形法
EP0822445B2 (de) 1996-07-29 2005-02-09 Huntsman Advanced Materials (Switzerland) GmbH Flüssige, strahlungshärtbare Zusammensetzung, insbesondere für die Stereolithographie
JP4197361B2 (ja) * 1996-12-02 2008-12-17 株式会社Ａｄｅｋａ 光学的立体造形用樹脂組成物および光学的立体造形方法
JP3626302B2 (ja) * 1996-12-10 2005-03-09 Ｊｓｒ株式会社 光硬化性樹脂組成物
US5821897A (en) 1996-12-20 1998-10-13 Wiltron Company Simulator for testing a collision avoidance radar system
FR2757530A1 (fr) 1996-12-24 1998-06-26 Rhodia Chimie Sa Utilisation pour la stereophotolithographie - d'une composition liquide photoreticulable par voie cationique comprenant un photoamorceur du type sels d'onium ou de complexes organometalliques
JP3913350B2 (ja) * 1998-01-13 2007-05-09 ナブテスコ株式会社 光学的造形用樹脂組成物
US6287745B1 (en) * 1998-02-18 2001-09-11 Dsm N.V. Photocurable liquid resin composition comprising an epoxy-branched alicyclic compound
JP4350832B2 (ja) * 1999-04-19 2009-10-21 Ｊｓｒ株式会社 立体造形用光硬化性樹脂組成物およびこれを硬化してなる造形物
US6413699B1 (en) * 1999-10-11 2002-07-02 Macdermid Graphic Arts, Inc. UV-absorbing support layers and flexographic printing elements comprising same
JP3893833B2 (ja) * 2000-02-09 2007-03-14 ブラザー工業株式会社 インクジェット記録方式用エネルギー線硬化型組成物
JP2001310938A (ja) * 2000-04-28 2001-11-06 Showa Denko Kk 重合性組成物、その硬化物と製造方法
JP3974336B2 (ja) * 2001-03-01 2007-09-12 ナブテスコ株式会社 光学的立体造形用の活性エネルギー線硬化性樹脂組成物
US20030149124A1 (en) * 2001-11-27 2003-08-07 Thommes Glen A. Radiation curable resin composition for making colored three dimensional objects

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1078357C (zh) * 1994-01-25 2002-01-23 奥托里夫Asp股份有限公司 具有联合增稠剂的带水光刻胶
US5621497A (en) * 1994-04-06 1997-04-15 Hitachi, Ltd. Pattern forming method and projection exposure tool therefor
US5858620A (en) * 1996-07-05 1999-01-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and method for manufacturing the same
CN1199507A (zh) * 1996-08-27 1998-11-18 精工爱普生株式会社 剥离方法、薄膜器件的转移方法以及使用该方法制造的薄膜器件、薄膜集成电路装置和液晶显示装置
CN1307694A (zh) * 1998-06-11 2001-08-08 陶氏化学公司 可光固化弹性组合物

Also Published As

Publication number Publication date
JP2005529200A (ja) 2005-09-29
JP2010189641A (ja) 2010-09-02
CN1650231A (zh) 2005-08-03
ES2405107T3 (es) 2013-05-30
HK1080554A1 (zh) 2006-04-28
WO2003093901A1 (en) 2003-11-13
EP2466378A3 (en) 2012-09-05
US7183040B2 (en) 2007-02-27
KR101176747B1 (ko) 2012-08-23
AU2003224516A1 (en) 2003-11-17
CN101706639A (zh) 2010-05-12
JP5656419B2 (ja) 2015-01-21
EP2466378B1 (en) 2014-01-08
US20080064780A1 (en) 2008-03-13
US20070154840A1 (en) 2007-07-05
EP1502155B1 (en) 2013-01-30
EP1502155A1 (en) 2005-02-02
US20040142274A1 (en) 2004-07-22
KR20110051258A (ko) 2011-05-17
KR20120086737A (ko) 2012-08-03
EP2466378A2 (en) 2012-06-20
KR20050007372A (ko) 2005-01-17

Similar Documents

Publication Publication Date Title
CN100576069C (zh) 可辐射固化树脂组合物及利用该组合物的快速成型方法
US9090020B2 (en) Photo-curable resin composition
US9861452B2 (en) Low-viscosity liquid radiation curable dental aligner mold resin compositions for additive manufacturing
US9457515B2 (en) Radiation curable resin composition and rapid three-dimensional imaging process using the same
ES2340480T3 (es) Composiciones curables y proceso de prototipado rapido que utiliza las mismas.
CN102858738A (zh) 用于加成法制造的包含三芳基锍硼酸盐阳离子光引发剂的液体可辐射固化树脂
KR20040030694A (ko) 방사선-경화성 수지 조성물 및 이를 사용한 신속프로토타이핑 방법
CN1354763A (zh) 用于三维物体光加工的树脂组合物
JP5280610B2 (ja) 安定性の向上した活性エネルギー線硬化性の光学的立体造形用樹脂組成物
JP2002060463A (ja) 光硬化性樹脂組成物および立体形状物
JP2005281414A (ja) 放射線硬化性液状樹脂組成物
HK1080554B (en) Radiation curable resin composition and rapid prototyping process using the same
HK1143864A (en) Radiation curable resin composition and rapid prototyping process using the same
JP2005194365A (ja) 光学的立体造形用樹脂組成物およびそれを用いる立体造形物の製造法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
REG Reference to a national code

Ref country code: HK

Ref legal event code: DE

Ref document number: 1080554

Country of ref document: HK

C14 Grant of patent or utility model
GR01 Patent grant
REG Reference to a national code

Ref country code: HK

Ref legal event code: GR

Ref document number: 1080554

Country of ref document: HK

CP01 Change in the name or title of a patent holder

Address after: Newhagen, the Netherlands

Patentee after: Kostron (Netherlands) Co.,Ltd.

Address before: Newhagen, the Netherlands

Patentee before: MS Holdings Ltd.

CP01 Change in the name or title of a patent holder
TR01 Transfer of patent right

Effective date of registration: 20211213

Address after: Newhagen, the Netherlands

Patentee after: MS Holdings Ltd.

Address before: Holland Heerlen

Patentee before: DSM IP Property Co.,Ltd.

TR01 Transfer of patent right
CP02 Change in the address of a patent holder

Address after: Geleen

Patentee after: Kostron (Netherlands) Co.,Ltd.

Address before: Newhagen, the Netherlands

Patentee before: Kostron (Netherlands) Co.,Ltd.

CP02 Change in the address of a patent holder
CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20091230