AU2003224516A1 - Radiation curable resin composition and rapid prototyping process using the same - Google Patents
Radiation curable resin composition and rapid prototyping process using the sameInfo
- Publication number
- AU2003224516A1 AU2003224516A1 AU2003224516A AU2003224516A AU2003224516A1 AU 2003224516 A1 AU2003224516 A1 AU 2003224516A1 AU 2003224516 A AU2003224516 A AU 2003224516A AU 2003224516 A AU2003224516 A AU 2003224516A AU 2003224516 A1 AU2003224516 A1 AU 2003224516A1
- Authority
- AU
- Australia
- Prior art keywords
- resin composition
- same
- curable resin
- radiation curable
- rapid prototyping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/06—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
- C08G65/16—Cyclic ethers having four or more ring atoms
- C08G65/18—Oxetanes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0037—Production of three-dimensional images
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Epoxy Resins (AREA)
- Polyethers (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Graft Or Block Polymers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US37723902P | 2002-05-03 | 2002-05-03 | |
| US60/377,239 | 2002-05-03 | ||
| PCT/NL2003/000320 WO2003093901A1 (en) | 2002-05-03 | 2003-05-01 | Radiation curable resin composition and rapid prototyping process using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2003224516A1 true AU2003224516A1 (en) | 2003-11-17 |
Family
ID=29401462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2003224516A Abandoned AU2003224516A1 (en) | 2002-05-03 | 2003-05-01 | Radiation curable resin composition and rapid prototyping process using the same |
Country Status (8)
| Country | Link |
|---|---|
| US (3) | US7183040B2 (enExample) |
| EP (2) | EP1502155B1 (enExample) |
| JP (2) | JP2005529200A (enExample) |
| KR (3) | KR20120086737A (enExample) |
| CN (2) | CN100576069C (enExample) |
| AU (1) | AU2003224516A1 (enExample) |
| ES (1) | ES2405107T3 (enExample) |
| WO (1) | WO2003093901A1 (enExample) |
Families Citing this family (61)
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| GB0212062D0 (en) * | 2002-05-24 | 2002-07-03 | Vantico Ag | Jetable compositions |
| US20040077745A1 (en) * | 2002-10-18 | 2004-04-22 | Jigeng Xu | Curable compositions and rapid prototyping process using the same |
| US20040137368A1 (en) * | 2003-01-13 | 2004-07-15 | 3D Systems, Inc. | Stereolithographic resins containing selected oxetane compounds |
| US20050040564A1 (en) * | 2003-08-18 | 2005-02-24 | Jones Oliver | Systems and methods for using norbornene based curable materials |
| WO2005021248A1 (ja) * | 2003-08-27 | 2005-03-10 | Fuji Photo Film Co., Ltd. | 三次元造形物の製造方法 |
| US7232850B2 (en) * | 2003-10-03 | 2007-06-19 | Huntsman Advanced Materials Americas Inc. | Photocurable compositions for articles having stable tensile properties |
| US20070149667A1 (en) * | 2003-10-16 | 2007-06-28 | Dsm Ip Assets B.V. | Curable compositions and rapid prototyping process using the same |
| WO2005045525A1 (en) * | 2003-11-06 | 2005-05-19 | Dsm Ip Assets B.V. | Curable compositions and rapid prototyping process using the same |
| CN1886438A (zh) * | 2003-12-02 | 2006-12-27 | 帝斯曼知识产权资产管理有限公司 | 阻燃可辐射固化组合物 |
| US20070267134A1 (en) * | 2004-09-03 | 2007-11-22 | Konarski Mark M | Photoinitiated Cationic Epoxy Compositions |
| SE529306C2 (sv) | 2005-03-18 | 2007-06-26 | Perstorp Specialty Chem Ab | Ultravioletthärdande hartskomposition |
| JP4702784B2 (ja) * | 2005-08-08 | 2011-06-15 | ソニー株式会社 | 液体吐出型記録ヘッドの流路構成材料 |
| US7279210B2 (en) * | 2005-09-07 | 2007-10-09 | 3M Innovative Properties Company | Curable compositions, methods of making and using the same, and articles therefrom |
| WO2007031505A1 (en) | 2005-09-13 | 2007-03-22 | Huntsman Advanced Materials (Switzerland) Gmbh | Photocurable compositions for preparing abs-like articles |
| EP1939234B2 (en) * | 2005-09-29 | 2018-04-11 | Cmet Inc. | Resin composition for optical three-dimensional molded object |
| US8334025B2 (en) * | 2005-10-27 | 2012-12-18 | 3D Systems, Inc. | Antimony-free photocurable resin composition and three dimensional article |
| JP5068454B2 (ja) * | 2005-12-06 | 2012-11-07 | 富士フイルム株式会社 | インク組成物、インクジェット記録方法、印刷物、平版印刷版の製造方法、及び平版印刷版 |
| JP5280615B2 (ja) * | 2006-06-16 | 2013-09-04 | シーメット株式会社 | 光学的立体造形用樹脂組成物 |
| JP2008024871A (ja) * | 2006-07-24 | 2008-02-07 | Fujifilm Corp | インク組成物、インクジェット記録方法、印刷物、平版印刷版の製造方法、及び平版印刷版 |
| US20080103226A1 (en) | 2006-10-31 | 2008-05-01 | Dsm Ip Assets B.V. | Photo-curable resin composition |
| CN101631832A (zh) * | 2007-03-14 | 2010-01-20 | 亨斯迈先进材料(瑞士)有限公司 | 用于制备类似abs的制品的可光固化组合物 |
| WO2008115057A1 (en) | 2007-03-20 | 2008-09-25 | Dsm Ip Assets B.V. | Stereolithography resin compositions and three-dimensional objects made therefrom |
| US20090004579A1 (en) * | 2007-06-27 | 2009-01-01 | Dsm Ip Assets B.V. | Clear and colorless three-dimensional articles made via stereolithography and method of making said articles |
| JP5881948B2 (ja) * | 2007-11-27 | 2016-03-09 | スリーディー システムズ インコーポレーテッド | 高透明性を有する三次元物品を製造するための光硬化型樹脂組成物 |
| JP5210645B2 (ja) * | 2008-01-25 | 2013-06-12 | シーメット株式会社 | 光学的立体造形用樹脂組成物 |
| JP5284833B2 (ja) * | 2008-03-31 | 2013-09-11 | 富士フイルム株式会社 | フォトスペーサーの製造方法 |
| JP5446902B2 (ja) * | 2009-03-05 | 2014-03-19 | Dic株式会社 | カチオン重合性接着剤及びそれを用いて得られた偏光板 |
| KR101714798B1 (ko) | 2009-03-13 | 2017-03-09 | 디에스엠 아이피 어셋츠 비.브이. | 방사선-경화성 수지 조성물 및 이를 이용한 쾌속 3차원 이미지화 방법 |
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| KR20120058554A (ko) | 2009-09-04 | 2012-06-07 | 뵈린게 이노베이션 에이비이 | 기계식 잠금 시스템을 구비하는 탄성 바닥판 조립 방법 |
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| EP1655633A3 (en) * | 1996-08-27 | 2006-06-21 | Seiko Epson Corporation | Exfoliating method, transferring method of thin film device, thin film integrated circuit device, and liquid crystal display device |
| JP4197361B2 (ja) * | 1996-12-02 | 2008-12-17 | 株式会社Adeka | 光学的立体造形用樹脂組成物および光学的立体造形方法 |
| JP3626302B2 (ja) * | 1996-12-10 | 2005-03-09 | Jsr株式会社 | 光硬化性樹脂組成物 |
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| FR2757530A1 (fr) | 1996-12-24 | 1998-06-26 | Rhodia Chimie Sa | Utilisation pour la stereophotolithographie - d'une composition liquide photoreticulable par voie cationique comprenant un photoamorceur du type sels d'onium ou de complexes organometalliques |
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| US6287745B1 (en) * | 1998-02-18 | 2001-09-11 | Dsm N.V. | Photocurable liquid resin composition comprising an epoxy-branched alicyclic compound |
| DE69906076T2 (de) * | 1998-06-11 | 2003-12-24 | Dow Global Technologies, Inc. | Photohärtende elastomere polymere |
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| US20030149124A1 (en) * | 2001-11-27 | 2003-08-07 | Thommes Glen A. | Radiation curable resin composition for making colored three dimensional objects |
-
2003
- 2003-05-01 KR KR1020127016516A patent/KR20120086737A/ko not_active Ceased
- 2003-05-01 CN CN03810052A patent/CN100576069C/zh not_active Expired - Lifetime
- 2003-05-01 JP JP2004502060A patent/JP2005529200A/ja active Pending
- 2003-05-01 KR KR10-2004-7017652A patent/KR20050007372A/ko not_active Ceased
- 2003-05-01 ES ES03721169T patent/ES2405107T3/es not_active Expired - Lifetime
- 2003-05-01 EP EP03721169A patent/EP1502155B1/en not_active Expired - Lifetime
- 2003-05-01 EP EP12154838.2A patent/EP2466378B1/en not_active Expired - Lifetime
- 2003-05-01 WO PCT/NL2003/000320 patent/WO2003093901A1/en not_active Ceased
- 2003-05-01 CN CN200910224789A patent/CN101706639A/zh active Pending
- 2003-05-01 AU AU2003224516A patent/AU2003224516A1/en not_active Abandoned
- 2003-05-01 KR KR1020117006984A patent/KR101176747B1/ko not_active Expired - Lifetime
- 2003-07-21 US US10/623,153 patent/US7183040B2/en not_active Expired - Lifetime
-
2007
- 2007-01-08 US US11/650,453 patent/US20070154840A1/en not_active Abandoned
- 2007-11-09 US US11/979,878 patent/US20080064780A1/en not_active Abandoned
-
2010
- 2010-02-22 JP JP2010036379A patent/JP5656419B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005529200A (ja) | 2005-09-29 |
| JP2010189641A (ja) | 2010-09-02 |
| CN1650231A (zh) | 2005-08-03 |
| ES2405107T3 (es) | 2013-05-30 |
| CN100576069C (zh) | 2009-12-30 |
| HK1080554A1 (zh) | 2006-04-28 |
| WO2003093901A1 (en) | 2003-11-13 |
| EP2466378A3 (en) | 2012-09-05 |
| US7183040B2 (en) | 2007-02-27 |
| KR101176747B1 (ko) | 2012-08-23 |
| CN101706639A (zh) | 2010-05-12 |
| JP5656419B2 (ja) | 2015-01-21 |
| EP2466378B1 (en) | 2014-01-08 |
| US20080064780A1 (en) | 2008-03-13 |
| US20070154840A1 (en) | 2007-07-05 |
| EP1502155B1 (en) | 2013-01-30 |
| EP1502155A1 (en) | 2005-02-02 |
| US20040142274A1 (en) | 2004-07-22 |
| KR20110051258A (ko) | 2011-05-17 |
| KR20120086737A (ko) | 2012-08-03 |
| EP2466378A2 (en) | 2012-06-20 |
| KR20050007372A (ko) | 2005-01-17 |
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| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |