CN100566152C - 具有抑制体声波滤波器中通带波纹的装置的体声波谐振器 - Google Patents

具有抑制体声波滤波器中通带波纹的装置的体声波谐振器 Download PDF

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CN100566152C
CN100566152C CNB038216523A CN03821652A CN100566152C CN 100566152 C CN100566152 C CN 100566152C CN B038216523 A CNB038216523 A CN B038216523A CN 03821652 A CN03821652 A CN 03821652A CN 100566152 C CN100566152 C CN 100566152C
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piezoelectric layer
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CN1682442A (zh
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H·P·勒布
R·F·米尔索姆
C·梅茨马彻尔
H·-W·布兰德
M·K·克里
R·基伊维特
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Qorvo US Inc
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    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46Filters
    • H03H9/54Filters comprising resonators of piezoelectric or electrostrictive material
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02007Details of bulk acoustic wave devices
    • H03H9/02047Treatment of substrates
    • H03H9/02055Treatment of substrates of the surface including the back surface
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02007Details of bulk acoustic wave devices
    • H03H9/02086Means for compensation or elimination of undesirable effects
    • H03H9/0211Means for compensation or elimination of undesirable effects of reflections
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/15Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/171Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
    • H03H9/172Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
    • H03H9/175Acoustic mirrors

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

一种体声波(BAW)谐振器,包括:顶电极;与所述顶电极相邻放置的压电层;与所述压电层相邻放置的底电极,其中,所述底电极关于所述压电层与所述顶电极相对放置;以及衬底和吸收材料层,与所述底电极相对放置,其中,所述衬底或所述吸收材料层的表面是不平坦的,以抑制寄生模态。

Description

具有抑制体声波滤波器中通带波纹的装置的体声波谐振器
技术领域
本发明涉及由体声波(BAW)谐振器构造的体声波滤波器,所述谐振器可以连接成阶梯或网格型结构。本发明尤其涉及用于抑制体声波滤波器中通带波纹的装置BAW谐振器至少包括一个第一电极、压电层和第二电极。可选地,声学耦合及叠置的晶体谐振器结构也可用于整形滤波器曲线。
背景技术
为了将谐振器与滤波器衬底去耦合,可以使用任一由λ/4多层构成的布拉格反射器。或者,可以通过使用空气隙或通过蚀刻掉衬底产生隔膜结构来将谐振器与衬底隔离。然而,在隔膜型谐振器结构中,可以激发出寄生隔膜模态,其可以根据US 006150703A通过以特殊方式(不规则形状)整形该隔膜、以及通过在谐振器边缘周围施加由粘弹性阻尼材料构成的吸收层来抑制横向传播的声学模态来抑制。
布拉格反射器的优点是具有更少的寄生模态,主要因为纵向延伸模态是在谐振器内的压电膜中激发的。然而,该反射器必须在BAW滤波器的通带中有接近100%的高反射系数,以防止声学能量穿透到衬底内并防止引起衬底振动。为了获得反射器的高反射系数,因为这是作为输出或输入滤波器的前端使用所需要的,叠置若干个,通常是5对高低声学阻抗交替的材料层。对于作为1~10GHz领域中干涉滤波器的应用,其中不要求极低的插入损耗,反射器中对的数量可以减少。这将节省加工时间和制造成本。然而,更多的声学能量会向衬底传送,并且衬底的振动可以作为BAW滤波器通带中的强波纹而观察到,该BAW滤波器由那些BAW谐振器构成。
发明内容
本发明的一个目的是提供一种体声波(BAW)谐振器,其具有用于抑制BAW滤波器中通带波纹的装置。本发明的另一个目的是提供具有改善的通带性能的BAW滤波器。本发明的另一个目的是提供制造这种BAW谐振器的方法。
关于抑制体声波滤波器中通带波纹的装置,该目的通过一种BAW谐振器实现,所述BAW谐振器至少包括底电极、压电层以及顶电极,基衬底和用于吸收或散射寄生模态的装置,其选自以下组中:
-该衬底的粗糙化的后侧,
-在衬底后侧上放置的吸收层和/或
-在衬底前侧上放置的吸收层。
这些装置防止了基衬底振动,因为基衬底的一个表面不再保持平滑而是变得不平坦,分别与包含小洞的层接触。根据本发明的一个方面,通过粗糙化该基衬底使得表面变得不平坦。根据本发明的另一方面,通过放置具有多孔结构的后侧或前侧吸收层,以间接方式使得表面变得不平坦。无论如何,因为基衬底的表面以直接或间接方式变得不平坦,所以碰撞表面的声波被部分地散射。
根据一个实施例,通过类似蚀刻的化学处理或者类似喷砂的机械处理来粗糙化基衬底的后侧。
根据另一个实施例,后侧吸收层或前侧吸收层选自以下的组中,包括例如环氧树脂胶的粘合剂,诸如聚酰亚胺的粘弹性材料、橡胶、塑料材料、类似气凝胶或干凝胶或多孔薄膜的多孔介质。环氧树脂胶的优点在于一旦其被硬化,它的最终抗张强度以及无应力。粘弹性材料的优点是高度的热稳定性。橡胶的优点是其柔软性,仅反射小部分声音。多孔介质的优点是弯曲表面仅反射部分的碰撞声波。
关于体声波滤波器,该目的通过根据本发明而制成的两个体声波谐振器所解决。
该BAW滤波器具有改善的通带滤波器性能,因为以吸收或散射寄生模态的方式选择了用于抑制的装置。
根据本发明的一个实施例,顶电极由诸如铝(Al)的金属材料制成。根据本发明的另一个实施例,压电层由氮化铝(AlN)、氧化锌(ZnO)或者锆钛酸铅(PZT)制成。根据另一个实施例,底电极由诸如钼(Mo)、铂(Pt)或钨(W)的金属材料制成。
关于方法,本发明通过制造体声波谐振器的方法实现,包括步骤:
-提供硅芯片或小片,
-在硅芯片或小片上放置顶电极,
-放置压电层,
-放置底电极,
-放置布拉格反射器,
-放置前侧吸收层,
-放置基衬底,
-移除硅芯片或小片。
本方法利用了衬底/晶片转移工艺的优点。
附图说明
本发明可以通过实例解释,其中
图1示出了具有粗糙化的衬底后侧的BAW谐振器,
图2示出了放置在衬底后侧上的吸收层,
图3示出了放置在衬底前侧上以及布拉格反射器之下的吸收层,
图4示出了2.79GHz BAW滤波器的体谐振器频率响应,所述滤波器包括上述用于抑制通带波纹的一些装置。
具体实施方式
图1示出了一BAW谐振器,建立起基底的衬底5具有粗糙化的后侧。该谐振器包括放置在压电层2上的顶电极1,该压电层2设置在底电极3上,顶电极1和底电极3以及以夹层方式包裹压电层2。为了使该夹层结构与基衬底5去耦合,在其间放置布拉格反射器4。基衬底5具有向着电极的布置对准的前侧,以及向着相反一侧对准的后侧。布拉格反射器4由交替的高、低声学阻抗材料制成。根据该实施例,衬底5的后侧被粗糙化,以散射驻波。可以通过例如蚀刻或喷砂来粗糙化衬底5的后侧,衬底5由例如玻璃衬底或半导体衬底制成。吸收层6可以放置在衬底5的后侧上。
图2示出了具有吸收层6的BAW谐振器,该吸收层6放置在布拉格反射器4和衬底5的顶侧之间。该吸收层6由具有高声学吸收能力的粘合剂,例如环氧树脂胶或硅橡胶制成。由于其散射行为,吸收层6避免了声波穿透进入衬底5。衬底的后侧被粗糙化。
图3示出了具有吸收层7的BAW谐振器,该吸收层7放置在衬底5的前侧上以及布拉格反射器4之下。该吸收层由具有高声学吸收能力的粘合剂,例如环氧树脂胶或硅橡胶制成。在一个优选实施例中,利用所谓的衬底/晶片转移工艺制造该具有前侧吸收层7的该谐振器。体谐振器的该优选实施例的制造包括以下步骤:
-提供硅芯片或小片(dice),
-放置由如铝(Al)的金属材料制成的顶电极,
-放置如氮化铝(AlN)或氧化锌(ZnO)的压电层,
-放置由如铂(Pt)、钼(Mo)或钨(W)的金属材料制成的底电极,
-放置布拉格反射器,
-将如环氧树脂胶的吸收层放置在衬底前侧上,
-放置类似例如玻璃衬底的衬底,
-移除硅小片。
图4的曲线图示出了BAW谐振器滤波器的响应曲线,其中通过在衬底5的顶上增加吸收层7减少了通带波纹。该曲线由频率分析仪检测。在该实例中,衬底5是玻璃衬底且吸收层7是环氧树脂胶。布拉格反射器4由交替的SiO2和Ta2O5的λ/4层构成。在布拉格反射器4的顶上叠置了由铂(Pt)制成的底电极3和压电膜(2),铝用作顶电极重。可以看出,在2.79GHz的区域中曲线S21(透射)的通带没有任何波纹。这是因为在玻璃衬底上的布拉格反射器下方使用了吸收层。虚线曲线示出了该滤波器的反射S11。吸收层是环氧树脂胶。可用作声学吸收体的其它材料是粘弹性材料,诸如聚酰亚胺、各种粘合剂、橡胶、塑料材料、如气凝胶或干凝胶以及多孔薄膜的多孔介质,这些材料中声学吸收机制是主导的或者发生声学散射。
单独考虑或结合考虑在公开本发明的说明书、附图和权利要求中描述的特征,对于本发明都是必要的。

Claims (10)

1.一种体声波(BAW)谐振器,包括:
顶电极;
与所述顶电极相邻放置的压电层;
与所述压电层相邻放置的底电极,其中,所述底电极关于所述压电层与所述顶电极相对放置;以及
衬底和吸收材料层,与所述底电极相对放置,其中,所述衬底或所述吸收材料层的表面是不平坦的,以抑制寄生模态。
2.如权利要求1所述的BAW谐振器,其特征在于所述衬底的表面是粗糙化的。
3.如权利要求1所述的BAW谐振器,其特征在于所述吸收材料层具有多孔结构。
4.如权利要求1-3中任意一项所述的BAW谐振器,其特征在于所述衬底放置在所述底电极和所述吸收材料层之间。
5.如权利要求1-3中任意一项所述的BAW谐振器,其特征在于所述吸收材料层放置在所述底电极和所述衬底之间。
6.如权利要求1所述的BAW谐振器,其特征在于布拉格反射器放置在所述底电极与所述衬底和所述吸收材料层两者中更靠近所述底电极的一方之间,所述布拉格反射器包括至少一层高声学阻抗材料和至少一层低声学阻抗材料。
7.如权利要求1-3中任意一项所述的BAW谐振器,其特征在于所述吸收材料层选自以下之一:环氧树脂胶,选自聚酰亚胺、橡胶和硅橡胶的粘弹性材料,塑料材料,选自气凝胶、干凝胶和多孔薄膜的多孔介质。
8.如权利要求1-3中任意一项所述的BAW谐振器,其特征在于所述顶电极包括铝以及所述底电极包括钼(Mo)、铂(Pt)和钨(W)之一。
9.如权利要求1-3中任意一项所述的BAW谐振器,其特征在于所述压电层包括氮化铝(AlN)、氧化锌(ZnO)或锆钛酸铅(PZT)之一。
10.一种体声波(BAW)滤波器,包括至少两个体声波谐振器,所述至少两个体声波谐振器中的每一个包括:顶电极;
与所述顶电极相邻放置的压电层;
与所述压电层相邻放置的底电极,其中,所述底电极关于所述压电层与所述顶电极相对放置;以及
衬底和吸收材料层,与所述底电极相对放置,其中,所述衬底或所述吸收材料层的表面是不平坦的,以抑制寄生模态。
CNB038216523A 2002-09-12 2003-09-01 具有抑制体声波滤波器中通带波纹的装置的体声波谐振器 Expired - Fee Related CN100566152C (zh)

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EP1540819A1 (en) 2005-06-15
AU2003259512A8 (en) 2004-04-30
CN1682442A (zh) 2005-10-12
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JP4541147B2 (ja) 2010-09-08

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